• 제목/요약/키워드: Copper alloy

검색결과 438건 처리시간 0.026초

Expansion Behavior of Iron-copper Compact Made from (Fe-Cu) Prealloyed Powder

  • Kim, Youn-Che;Suk, Myung-Jin
    • 한국분말야금학회:학술대회논문집
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    • 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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    • pp.812-813
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    • 2006
  • Dimensional change of compact made from (Fe-Cu) prealloyed powder and copper powder compared to that of compact made from iron-copper elemental powder. The compact made from the prealloyed powder with a copper content of 7.18mass% which is nearly equal to its solution limit and copper powder showed only the large contraction in spite of penetration of liquid copper into grain boundary of the prealloyed powder. But the compact made from iron-copper elemental powder showed the large expansion in spite of same chemical composition with former case.

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Optimization of Removal Rates with Guaranteed Dispersion Stability in Copper CMP Slurry

  • Kim Tae-Gun;Kim Nam-Hoon;Kim Sang-Yong;Chang Eui-Goo
    • Transactions on Electrical and Electronic Materials
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    • 제5권6호
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    • pp.233-236
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    • 2004
  • Copper metallization has been used in high-speed logic ULSI devices instead of the conventional aluminum alloy metallization. One of the key issues in copper CMP is the development of slurries that can provide high removal rates. In this study, the effects of slurry chemicals and pH for slurry dispersion stability on Cu CMP process characteristics have been performed. The experiments of copper slurries containing each different alumina and colloidal silica particles were evaluated for their selectivity of copper to TaN and $SiO_{2}$ films. Furthermore, the stability of copper slurries and pH are important parameters in many industries due to problems that can arise as a result of particle settling. So, it was also observed about several variables with various pH.

Electrochemical Impedance Study for Selective Dissolution of a Cu-Zn Alloy

  • Hoshi, Y.;Tabei, K.;Shitanda, I.;Itagaki, M.
    • Corrosion Science and Technology
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    • 제15권6호
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    • pp.311-313
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    • 2016
  • The anodic dissolution behavior of copper and brass in an electrolyte solution of 0.5M NaCl containing 0.5 mM $NaHCO_3$ was investigated by electrochemical impedance spectroscopy. The Nyquist plots of the copper impedance described a small loop in the high-frequency range and a large locus in the low-frequency range. Additionally, the features of the impedance spectrum of the brass were similar to those of the copper. This indicates that the copper-enriched layer formed on the brass surface due to the selective dissolution of the zinc from the surface. In addition, the rest potential and the anodic polarization curve for each sample were measured in order to discuss the selective dissolution of the zinc from the brass surface.

치과용 아말감합금 및 아말감의 마세구조에 관한 연구 (A STUDY ON THE MICROSTRUCTURES OF THE AMALGAM ALLOYS AND AMALGAMS)

  • 연상흠;이정식;이명종;엄정문
    • Restorative Dentistry and Endodontics
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    • 제21권1호
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    • pp.87-105
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    • 1996
  • The purpose of this study is to investigate the characteristics of the compositions and phases of amalgam alloys and amalgams by using EMPA and X-ray diffractometer. Each specimen was made from Caulk Fine Cut Clow copper lathe cut amalgam), Caulk Spherical (low copper spherical amalgam), Tytin (high copper unicorn position amalgam), Dispersally (high copper admixed amalgam) and Valiant (Palladium enriched amalgam). For preparing amalgam alloys, Tytin and Valiant were used as powder forms and the others were used as tablet forms after being polished with polishing machine. For preparing amalgams, each amalgam alloy and Hg were measured, and triturated by mechanical amalgamater according to user's instructions. After triturating, the triturated mass was inserted to cylindrical metal mold and simultaneously adapted by cylindrical condenser with same diameter and condensed by Instron universal testing machine with 80kg pressure & 1mm/min speed. Each specimen was removed from the metal mold and stored at room temperature for a week. The specimen was polished with the same polishing machine for amalgam alloy. For observation of microstructure and analysis of composition of amalgam alloys and amalgams, EMPA was used to get secondary electron images, backscattered images and characteristic X-ray images of Ag, Sn, Cu, Zn, Hg. To analyze compositions of amalgam alloys and amalgams, X-ray diffractometer was used. Amalgam alloys were scanned at the range of 2${\theta}$ of 30-$85^{\circ}$ and the speed of $4^{\circ}$/min with Cuka line and amalgams were scanned at the range of 2${\theta}$ of 28-$44^{\circ}$ and the speed of $4^{\circ}$/min with Cuka line. By comparing obtained d(distance between surfaces) and d of expected phases and atoms in amalgam alloys and amalgams in ASTM card, phases and atoms were identified. The results were as follows, 1. In Caulk Fine Cut amalgam alloy typical ${\gamma}$ phase was shown, and in amalgam, ${\gamma}$, ${\gamma}_1$ and ${\gamma}_2$ phases were observed. 2. In Caulk Spherical amalgam alloy ${\gamma}$, Ag, Cu and $\varepsilon$ phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, ${\gamma}_2$ and $\eta$ phases were observed. 3. In Tytin amalgam alloy ${\gamma}$, Cu and $\varepsilon$ phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, $\eta$ and $\varepsilon$ phases were observed. 4. In Dispersalloy ${\gamma}$, Ag, Cu and $\varepsilon$ phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, $\eta$ and $\varepsilon$ phases were observed. 5. In Valiant alloy ${\gamma}$, Cu and e phases were shown, and in amalgam ${\gamma}$, ${\gamma}_1$, $\eta$ and $\varepsilon$ phases were observed.

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Sn/Cu 도금액의 보충이 도금제품의 도금피막특성에 미치는 영향 (The Supplement of Sn/Cu, Plating Solution Affects in Plating Skim Quality of the Plating Product)

  • 전택종;고준빈;이동주
    • 한국정밀공학회지
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    • 제26권7호
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    • pp.112-119
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    • 2009
  • The purpose of this study is to evaluate the evaluation of process yield performed by using Sn & Cu treatment on the surface to optimize process condition for Lead-free solder application. The materials which are used for the New Surface Treatment study are Semi-Dulling plating for high speed Sn/Cu alloy of Soft Alloy GTC-33 Pb free known as "UEMURA Method" and plating substrate is alloy 42.Especially in lead-free plating process, it is important to control plating thickness and Copper composition than Sn/Pb plating. Evaluated and controlled plating thickness $12{\pm}3um$, Copper composition $2{\pm}1%$, plating particle and visual inspection. The optimization of these parameters and condition makes it makes possible to apply Sn/Cu Lead-free solder from Sn/Pb alloy.

액체 로켓엔진 연소기 사용 재료의 상온 브레이징부 인장강도 특성 (The Tensile Strength at Room Temperature of Brazing Section for Materials used for Liquid Rocket Engine Combustion Chamber)

  • 정용현;류철성;최민수
    • 한국추진공학회지
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    • 제7권4호
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    • pp.73-79
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    • 2003
  • 재생 냉각형 액체 로켓엔진 제작에 주로 사용되는 합금에 대하여 브레이징 접합 강도 시험 및 파단면 분석을 실시하였다. 브레이징 시 사용되는 용가재(Filler Metal)로 니켈을 주성분으로 하는 BNi-2, BNi-7를 사용하였다. 5종의 합금에 대하여 모두 12개의 시편을 제작하여 인장 강도 시험 및 금속현미경을 통한 접합면 분석을 통해 재료 및 용가재 특성을 분석하였다. 크롬동과 타 합금과의 접합 강도가 크롬/지르코늄동과 타 합금과의 접합 강도보다 높게 나왔다. BNi-2가 BNi-7보다 모재에 대한 젖음성이 보다 더 우수하여 접합면 인장 강도가 BNi-2로 사용한 경우가 BNi-7을 사용한 경우보다 더 높게 나왔다.

Process Tape를 사용한 마그네슘 합금의 저항 점 용접 특성 (Resistance Spot Welding Characteristics of Mg Alloy Using Process Tape)

  • 최동순;김동철;강문진
    • Journal of Welding and Joining
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    • 제31권3호
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    • pp.49-53
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    • 2013
  • Recently, studies about application of magnesium alloy sheet to automotive bodies are on the increase. For application to automotive bodies, researches about characteristics of resistance spot welding of magnesium alloy sheet are essential. Electrode life of resistance spot welding of magnesium alloy is very short due to sticking of magnesium alloy to copper alloy electrode. To increase electrode life, most effective method is inserting cover plate between electrode and magnesium sheet. But application of cover plate to actual process is difficult and decreases welding productivity. Process tape supplied automatically as cover plate can minimize lose of productivity and increase welding quality. In this study, resistance spot welding of magnesium alloy is carried out with applying process tape. Acceptable welding current region according to electrode force and welding time is determined.

Ultra High Conductivity Diamond Composites

  • Bollina, Ravi;Stoiber, Monika
    • 한국분말야금학회:학술대회논문집
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    • 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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    • pp.922-923
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    • 2006
  • Thermal management is one of the critical aspects in the design of highly integrated microelectronic devices. The reliability of electronic components is limited not only to operating temperature but also by the thermal stresses caused during the operation. The need for higher power densities calls for use of advanced heat spreader materials. A copper diamond composite has been developed with high thermal conductivity $(\lambda)$ and tailorable coefficient of thermal expansion (CTE). Copper diamond composites are processed via gas pressure assisted infiltration with different copper alloys. Emphasis has been placed on the addition of trace elements in deisgning the copper alloys to facilitate a compromise between thermal conductivity and mechanical adhesion. The interfaces between the alloy and the diamond are related to the thermal properties of these copper composites.

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