• Textile Coloration and Finishing
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• v.31 no.2
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• pp.65-76
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• 2019

A multi-point touch input sensor having different sizes or different capacitance touch points connected by only one pair of signal transmission lines was fabricated using a polyimide film coated with a thin copper plate. The capacitance increases with the decrease in the number of sheets of fabric spacers placed between the two sheets of the polyimide film. Therefore, the touch input sensor could be manufactured without fabric spacers, which was possible by the action of the polyimide film as a dielectric material in the capacitor. On the multi-point touch sensor, higher capacitance was obtained when pressing wider-area touch points with 10mm to 25mm diameter on average. However, the capacitance of a system comprising two sheets of touch sensors was considerably low, causing a serious overlap of the capacitance values according to the data collected from the reliability test. Although the capacitance values could be increased by stacking several sheets of touch sensors, the overlap of data was still observed. After reducing the size of all touch points to 10mm and stacking up to eight sheets of sensors, reliable and consistent capacitance data was obtained. Five different capacitance signals could be induced in the sensors by pushing touch points simultaneously.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1996.03a
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• pp.73-80
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• 1996

Commerical purity aluminium , copper and STS 304 stainless steel sheets are welded by ultrasonic welding. The microstructures, x-ray diffraction profiles of planes , pole figures of the surface of original metal sheets are compared with those of the weld interface. The microstructures show disturbance and dark areas in the weld interface and grain refinement in the vicinity of the interface. The x-ray diffraction intensity of each plane in weld interface decreased in all metal sheets with exception of 9200) in steel sheet. The microstructure and x-ray diffraction intensity is affected by the mixture of deformation, heating and vibratin duringthe ultrasonic welding. Therefore, after the ultrasonic welding, the positions of the peak intensity in the pole figures are changed, the value of the maximum pole intensity is decreased in Al, is increased in copper and stainless steel. Very strong {100} <001> texture, strong {100} <001>,{123}<634> textures in original Al surface are transformed into weak, {100}<001>, {110}<112> and {112}<111> components in weld surface, weak (110) fiber is slightly changed to (110) fiber in copper, (100)and ${\gamma}$ fiber components are transformed into strong ${\gamma}$ fiber component in stainless steel.

• Korean Journal of Materials Research
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• v.19 no.8
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• pp.432-436
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• 2009

A Cu-Fe-P copper alloy was processed by accumulative roll-bonding (ARB) for ultra grain refinement and high strengthening. Two 1mm thick copper sheets, 30 mm wide and 300 mm long, were first degreased and wire-brushed for sound bonding. The sheets were then stacked on top of each other and roll-bonded by about 50% reduction rolling without lubrication at ambient temperature. The bonded sheet was then cut into two pieces of the same dimensions and the same procedure was repeated for the sheets up to eight cycles. Microstructural evolution of the copper alloy with the number of the ARB cycles was investigated by optical microscopy (OM), transmission electron microscopy(TEM), and electron back scatter diffraction(EBSD). The grain size decreased gradually with the number of ARB cycles, and was reduced to 290 nm after eight cycles. The boundaries above 60% of ultrafine grains formed exhibited high angle boundaries above 15 degrees. In addition, the average misorientation angle of ultrafine grains was 30 degrees.

• Korean Journal of Materials Research
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• v.24 no.11
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• pp.585-590
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• 2014

Microstructural evolution in the thickness direction of an oxygen free copper processed by accumulative rollbonding (ARB) is investigated by electron back scatter diffraction (EBSD) measurement. For the ARB, two copper alloy sheets 1 mm thick, 30 mm wide and 300 mm long are first degreased and wire-brushed for sound bonding. The sheets are then stacked and roll-bonded by about 50% reduction rolling without lubrication at an ambient temperature. The bonded sheet is then cut to the two pieces of the same dimensions and the same procedure was repeated on the sheets up to eight cycles. The specimen after 1 cycle showed inhomogeneous microstructure in the thickness direction so that the grains near the surface were finer than those near the center. This inhomogeneity decreased with an increasing number of ARB cycles, and the grain sizes of the specimens after 3 cycles were almost identical. In addition, the aspect ratio of the grains decreased with an increasing number of ARB cycles due to the subdivision of the grains by shear deformation. The fraction of grains with high angle grain boundaries also increased with continuing process of the ARB so that it was higher than that of the low angle grain boundaries in specimens after 3 cycles. A discontinuous dynamic recrystallization occurred partially in specimens after 5 cycles.

• Korean Journal of Materials Research
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• v.21 no.5
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• pp.263-267
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• 2011

The present study was carried out to evaluate the microstructural and mechanical properties of cross-roll rolled pure copper sheets, and the results were compared with those obtained for conventionally rolled sheets. For this work, pure copper (99.99 mass%) sheets with thickness of 5 mm were prepared as the starting material. The sheets were cold rolled to 90% thickness reduction and subsequently annealed at $400^{\circ}C$ for 30 min. Also, to analyze the grain boundary character distributions (GBCDs) on the materials, the electron back-scattered diffraction (EBSD) technique was introduced. The resulting cold-rolled and annealed sheets had considerably finer grains than the initial sheets with an average size of 100 ${\mu}M$. In particular, the average grain size became smaller by cross-roll rolling (6.5 ${\mu}M$) than by conventional rolling (9.8 ${\mu}M$). These grain refinements directly led to enhanced mechanical properties such as Vickers micro-hardness and tensile strength, and thus the values showed greater increases upon cross-roll rolling process than after conventional rolling. Furthermore, the texture development of <112>//ND in the cross-roll rolling processed material provided greater enhancement of mechanical properties relative to the case of the conventional rolling processed material. In the present study, we systematically discuss the enhancement of mechanical properties in terms of grain refinement and texture distribution developed by the different rolling processes.

• Korean Journal of Materials Research
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• v.17 no.10
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• pp.521-525
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• 2007

The microstructure and mechanical properties of an oxygen free copper processed by accumulative roll bonding(ARB) at low strain rate were studied. The copper sheets were highly strained up to an equivalent strain of ${\sim}6.4$ by ARB process at ambient temperature. The strain rate of the copper during the ARB was $2.6sec^{-1}$. The microstructure and mechanical properties of the ARB-processed copper were compared to those of the specimens processed by ARB at relatively high strain rate ($37sec^{-1}$). The microstructure and mechanical properties of the copper with ARB process was very similar to each other despite of some differences in recovery.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.31 no.12
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• pp.1194-1199
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• 2007

A unique fabrication method for a copper micromesh is proposed and demonstrated. A PDMS mold was fabricated using a microcasting process and then used as a flexible mold in copper electroplating. The fabricated copper micromesh was well formed and connected without any cracks within the entire mold area. The experimental results verified that the fabricated features of the copper micromesh accurately followed the shape of the microstructures of the PDMS mold. This unique fabrication method provides an easy yet precise means of producing three-dimensional metal microstructures.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.138.2-138.2
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• 2013

Copper oxide is a multi-functional material being used in various research areas including catalysis, electrochemical materials, oxidizing agents etc. Among these areas, we have synthesized and utilized graphene based copper oxide nanocomposites (CuOx/Graphene) for the catalytic applications (C-N cross coupling reaction). Briefly, Cu precursors were anchored on the graphite oxide(GO) sheets being exfoliated and oxidized from graphite powder. Two different crystalline structures of Cu2O and CuO on graphene and GO were prepared by annealing them in Ar and O2 environments, respectively. The morphological and electronic structures were systemically investigated using FT-IR, XRD, XPS, XAFS, and TEM. Here, we demonstrate that the catalytic performance was found to depend on oxidative states and morphological structures of CuOx graphene nanocomposites. The relationship between the structure of copper oxides and catalytic efficiency toward C-N cross coupling reaction will be discussed.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.5
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• pp.482-487
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• 2023

A carbon-based hybrid resistor was fabricated using carbon nanotube (CNT) paste as an adhesive layer to establish electrically continuous ohmic contacts between CNT sheets and different CNT sheet or copper based metal alloy plates, and its electrical properties were evaluated. CNT sheets were fabricated using vacuum filtration with a CNT solution dispersed in isopropyl alcohol (IPA) solvent. The electrical characteristics of these carbon-based hybrid resistors were investigated. The CNT paste fulfilled the requirements for forming ohmic contacts between CNT sheets and metal alloy plates, which was attributed to the lowest work function difference and excellent wettability at the interface.

• Korean Journal of Materials Research
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• v.14 no.5
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• pp.322-327
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• 2004

Copper-based leadframe sheets were oxidized in two kinds of hot alkaline solutions to form brown-oxide or black-oxide layer on the surface. The oxide coated leadframe sheets were molded with epoxy molding compound (EMC). After post mold curing, the oxide-coated EMC-leadframe joints were machined to form sandwiched Brazil-nut (SBN) specimens. The SBN specimens were used to measure the fracture toughness of the EMC/leadframe interfaces under mixed-mode (mode I + mode II) loading conditions. Fracture surfaces were analyzed by various equipment to investigate failure path. The results revealed that the failure paths were strongly dependent on the oxide type. In case of brown oxide, hackle-type failure was observed and failure path lay near the EMC/CuO interface with a little inclining to CuO at all case. On the other hand, in case of black oxide, quite different failure path was observed with respect to the distance from the tip of pre-crack and phase angle. Different failures occurred with oxide type is presumed to be due to the difference in microstructure of the oxides.