• Title/Summary/Keyword: Copper Effect

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Copper Particle Effect on the Breakdown Strength of Insulating Oil at Combined AC and DC Voltage

  • Wang, You-Yuan;Li, Yuan-Long;Wei, Chao;Zhang, Jing;Li, Xi
    • Journal of Electrical Engineering and Technology
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    • v.12 no.2
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    • pp.865-873
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    • 2017
  • Converter transformer is the key equipment of high voltage direct current transmission system. The solid suspending particles originating from the process of installation and operation of converter transformer have significant influence on the insulation performance of transformer oil, especially in presence of DC component in applied voltage. Under high electric field, the particles easily lead to partial discharge and breakdown of insulating oil. This paper investigated copper particle effect on the breakdown voltage of transformer oil at combined AC and DC voltage. A simulation model with single copper particle was established to interpret the particle effect on the breakdown strength of insulating oil. The experimental and simulation results showed that the particles distort the electric field. The breakdown voltage of insulating oil contaminated with copper particle decreases with the increase of particle number, and the breakdown voltage and the logarithm of particle number approximately satisfy the linear relationship. With the increase of the DC component in applied voltage, the breakdown voltage of contaminated insulating oil decreases. The simulation results show that the particle collides with the electrode more frequently with more DC component contained in the applied voltage, which will trigger more discharge and decrease the breakdown voltage of insulating oil.

Removal Effect of Biostone and Green Tea on the Heavy Metal Toxicity during Seed Germination of Arabidopsis thaliana (애기장대의 종자 발아에 미치는 맥반석과 녹차의 중금속 제거 효과)

  • 박종범
    • Journal of Environmental Science International
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    • v.12 no.12
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    • pp.1303-1308
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    • 2003
  • This experiment was carried out to investigate the effects of heavy metals (cadmium, chromium, copper and lead) on the seed germination of Arabidopsis thaliana, and examinated the removal effects of biostone and green tea on the heavy metal toxicity. Cadmium and chromium among the four heavy metals had no effect on the seed germination even in the concentration fifty times higher than in the official standard concentration of pollutant exhaust notified by the Ministry of Environment. However, seeds were not germinated in the concentration of copper ten times higher and in the concentration of lead fifty times higher than the official standard concentration. When seeds were sown in the solutions of lead (15, 20, 25 and 30 mg/L) and copper(15 and 20 mg/L), the seed germination rates were 0% and less than 10%, respectively. However, when biostone(3 g/30 $m\ell$) was added, the seed germination rate was 100% in all the concentrations. The germination rate was 100% in distilled water and copper solution (5 mg/L). However, green tea (0.2 g/30 $m\ell$) was added, the seed germination rate was 0% in both. The results show that cadmiun and chromium had no effect on the seed germination, but lead and copper decreased the rate of seed germination of Arabidopsis thaliana, Biostone removed heavy metal toxicity, but green tea did not removed heavy metal toxicity during germination.

Effect of Copper on the Plant Regeneration from Seed Derived Callus of Orchardgrass (Dactylis glomerata L.) (오차드그래스의 종자유래의 캘러스로부터 식물체 재분화율에 미치는 Copper의 영향)

  • 이효신;이병현;원성혜;이상현;조진기
    • Journal of The Korean Society of Grassland and Forage Science
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    • v.20 no.4
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    • pp.259-264
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    • 2000
  • This study was conducted to investigate the effects of copper in the efficiencies of callus formation and plant regeneration of orchardgrass (Dactylis glomarata L.). Seeds were cultured on MS medium containing $2\;mg/{\ell}$ 2,4-D and different concentrations ($0.1-100\;{\mu}mol$) of copper sulfate. Plant regeneration was achieved on N6 medium containing $1\;mg/{\ell}$ NAA, $5\;mg/{\ell}$ kinetin and $0.1-100\;{\mu}mol$ of copper sulfate. Callus formation was not affected by copper incorporation into MS medium. However, the efficiency of plant regeneration was promoted by copper and the maximum efficiency was obtained when $70\;{\mu}mol$ copper was incorporated in the culture medium. The average number of regenerated plants from the seed-derived callus was also increased by copper.

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Silver Alloying Process for Mokumegane-like Effect for Jewelry Design (장신구 디자인을 위한 모꾸메가네 효과 은 합금 공정)

  • Song Oh-Sung
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.7 no.3
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    • pp.506-511
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    • 2006
  • Silver is one of the most appropriate Jewelry materials for Jewelry casting and bench working. The technique known as 'Mokumegane' is good for making silver jewelry with natural patterns, such as wood grain patterns, but the process is not easy for silversmithing because it requires complicated and heavy labour. Instead of using conventional Mokumegane technique, we propose a new modified silver-copper casting process that enables a similar surface effect with good metal bonding strength between silver and copper. Simply pouring the molten silver into pre-aligned copper granules or 0.5 mm to 1.5 mm-thick copper sheets leads to well embedded copper silver ingots. The rolled silver plates from those ingots show excellent bonding interface even after the silver plate rolled ten times. We successfully fabricated prototype rings with copper embedded silver plates. Our result implies that our newly proposed process nay be a simpler way to fabricate silver jewelry with a pseudo-Mokumegane effect.

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The Effect of Hydroxy Ethyl Cellulose(HEC) on the Surface Morphology and Mechanical Characteristis of Copper Electrodeposition (구리 전해도금 시 표면형상과 기계적 특성에 미치는 HEC효과)

  • Woo, Tae-Gyu;Park, Il-Song;Lee, Hyun-Woo;Seol, Kyeong-Won
    • Korean Journal of Materials Research
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    • v.16 no.11
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    • pp.710-714
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    • 2006
  • The purpose of this study is to identify the effect of additives and composition on copper surface morphology and mechanical characteristics by copper electrodeposition. Additives such as hydroxy ethyl cellulose(HEC), chloride ion were used in this study. Electrochemical experiments allied to SEM, XRD, AFM and four- point probe were performed to characterize the morphology and mechanical characters of copper in the presence of additives. Among various electrodeposition conditions, the minimum surface roughness of copper foil was obtained when electrodeposited at the current density of 200 mA/$cm^2$ for 68 seconds with 2 ppm of HEC. The minimum value of surface roughness(Rms) was 107.6 nm. It is copper foil is good for electromigration inhibition due to preferential crystal growth of Cu (111) deposited in the electrolyte containing chloride ions(10 ppm) and HEC(1 ppm).

Copper Ion from Cu2O Crystal Induces AMPK-Mediated Autophagy via Superoxide in Endothelial Cells

  • Seo, Youngsik;Cho, Young-Sik;Huh, Young-Duk;Park, Heonyong
    • Molecules and Cells
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    • v.39 no.3
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    • pp.195-203
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    • 2016
  • Copper is an essential element required for a variety of functions exerted by cuproproteins. An alteration of the copper level is associated with multiple pathological conditions including chronic ischemia, atherosclerosis and cancers. Therefore, copper homeostasis, maintained by a combination of two copper ions ($Cu^+$ and $Cu^{2+}$), is critical for health. However, less is known about which of the two copper ions is more toxic or functional in endothelial cells. Cubic-shaped $Cu_2O$ and CuO crystals were prepared to test the role of the two different ions, $Cu^+$ and $Cu^{2+}$, respectively. The $Cu_2O$ crystal was found to have an effect on cell death in endothelial cells whereas CuO had no effect. The $Cu_2O$ crystals appeared to induce p62 degradation, LC3 processing and an elevation of LC3 puncta, important processes for autophagy, but had no effect on apoptosis and necrosis. $Cu_2O$ crystals promote endothelial cell death via autophagy, elevate the level of reactive oxygen species such as superoxide and nitric oxide, and subsequently activate AMP-activated protein kinase (AMPK) through superoxide rather than nitric oxide. Consistently, the AMPK inhibitor Compound C was found to inhibit $Cu_2O$-induced AMPK activation, p62 degradation, and LC3 processing. This study provides insight on the pathophysiologic function of $Cu^+$ ions in the vascular system, where $Cu^+$ induces autophagy while $Cu^{2+}$ has no detected effect.

Valid Assessment for Copper Standard Establishment in Drinking Water (먹는물에서 구리기준 설정 타당성)

  • Yu, Soon-Ju;Jeong, Dong-Hwan;Kim, Jun-Hwan
    • Journal of Environmental Impact Assessment
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    • v.17 no.2
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    • pp.143-151
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    • 2008
  • As the NOAFL of copper based on liver toxicity in the human body is set and the TDI of copper is lower, it is necessary to strengthen the drinking water standard of copper according to toxic effects and the TDI of copper in humans. It is difficult to calculate the accurate drinking water standard because of the part of uncertainty for chronic effects of acute human with Wilson's disease and baby in the current studies. In order to improve the drinking water standard of copper considering of liver toxicity, it is desired to set the drinking water standard with concerning of the revising tendency in the foreign countries such as US, EC and WHO.

Coupled Thermal-Structure Analysis of UV Laser Pulsing according to the Thickness of Copper Film on the Surface of Polyimide (UV 펄스 레이저 가공의 구리 박막 두께에 따른 열-구조 연성 해석)

  • Shin, Minjae;Shin, Bosung
    • Laser Solutions
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    • v.16 no.2
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    • pp.7-11
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    • 2013
  • Recently advanced laser processing is widely introduced to improve the efficiency of micro part production and to reduce the rate of inferior goods. In this paper the trend of delamination of single layer with both thin copper and polyimide according to the variation of copper thickness was investigated using the coupled thermal-structural analysis of ANSYS. From these analyses results, some conclusions were obtained. Firstly, the maximum temperature was increasing with respect to decrease of copper thickness. Secondly the maximum strain which was in general estimation the main effect of the delamination was observed in case of the copper thickness of $5{\mu}m$. Finally the trend of the delamination was decreasing with increasing the thickness of copper layer.

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Effect of applying a DC voltage on the interfacial reactions at the zirconia to copper interface (접합계면반응에 미치는 직류전원부하의 영향)

  • Kim, Sung-Jin;Kim, In-Su;Oh, Myung-Hoon;Choi, Hwan
    • Proceedings of the KWS Conference
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    • 1996.05a
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    • pp.6-9
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    • 1996
  • The Joining of copper rod and zirconia tube was carried out in Ar gas atmosphere. There are two type of the joining. The one is the reaction bond consisting of Cu and zirconia was dominated by surface reaction wi th a undetctable very thin layer. It was found that copper elements were diffused to zirconia side, but that most of Z $r^{4+}$ ions were not diffused to copper side. This result means application of a DC voltage to migrate oxygen to the copper/zirconia interface can oxidize metal at the copper /zirconia interface, and the bonding reaction between zirconia and copper oxide may occur. The other is the reaction bonding was dominated by interdiffusion with a very thick interface layer. This result means application of a DC voltage can reduce zirconia at the interface. The bonding reaction is to be an alloying between Zr and Cr.

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