• Tribology and Lubricants
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• 제34권6호
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• pp.226-234
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• 2018

Copper chemical mechanical planarization (CMP) has become a key process in integrated circuit (IC) technology. The results of copper CMP depend not only on the mechanical abrasion, but also on the slurry chemistry. The slurry used for Cu CMP is known to have greater chemical reactivity than mechanical material removal. The Cu CMP slurry is composed of abrasive particles, an oxidizing agent, a complexing agent, and a corrosion inhibitor. Citric acid can be used as the complexing agent in Cu CMP slurries, and is widely used for post-CMP cleaning. Although many studies have investigated the effect of citric acid on Cu CMP, no studies have yet been conducted on the interfacial friction characteristics and step height reduction in CMP patterns. In this study, the effect of citric acid on the friction characteristics and step height reduction in a copper wafer with varying pattern densities during CMP are investigated. The prepared slurry consists of citric acid ($C_6H_8O_7$), hydrogen peroxide ($H_2O_2$), and colloidal silica. The friction force is found to depend on the concentration of citric acid in the copper CMP slurry. The step heights of the patterns decrease rapidly with decreasing citric acid concentration in the copper CMP slurry. The step height of the copper pattern decreases more slowly in high-density regions than in low-density regions.

• 한국표면공학회지
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• 제39권5호
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• pp.223-228
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• 2006

The current efficiency of copper anode containing impurities in copper sulfate solution for electrorefining was studied at various current type such as direct current, variable current and periodic reverse current. The passivity behavior was investigated by galvanostatic technique. The results obtained were that current efficiency of variable current was higher than those of direct current and periodic reverse current. The increased current efficiency could be explained by the formation of slime structure with lower average resistance due to variable current. The frequency of various factors in variable current condition has a greatest effect on current efficiency. It appeared that frequency increased current efficiency when increased from 1 to 4, but further increases did not have an effect.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2016년도 추계학술대회 논문집
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• pp.194.1-194.1
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• 2016

The present study investigated the effect of zincate treatment time on the dissolution behavior and the deposition of copper by immersion process and electroplating process on AZ31 Mg alloy substrate in a copper pyrophosphate bath. Without zincate pretreatment, the AZ31 Mg substrate quickly dissolved in the copper pyrophosphate solution although an external cathodic current was applied. The copper layers deposited on non-zincate treated AZ31 Mg alloy substrate by both immersion and electroplating processes showed very porous structure and very poor adhesion. With increasing zincate treatment time up to 2 min, the dissolution of AZ31 substrate in pyrophosphate solution rapidly decreased and the deposited copper layer was less porous and exhibited stronger adhesion. The immersion of AZ31 Mg sample in zincate solution for 5 min was found as a critical time for producing a non-porous and adherent electrodeposited copper layer on AZ31 Mg alloy. The optimum zincating time can be determined by observing the open circuit potential (OCP) of AZ31 Mg alloy samples in a copper pyrophosphate electroplating bath. The OCP reached a stable value of about -0.10 V (vs. SCE) after 5 min of immersion in the copper pyrophosphate electroplating solution.

• 한국재료학회지
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• 제16권12호
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• pp.725-730
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• 2006

The purpose of this study is to identify the effect of additives during copper electrodeposition. Additives such as arabic gum, chloride ions and glue were used in this study. Electrochemical experiments allied to SEM and roughness examination were performed to characterize of the copper foil in the presence of additives. In the production of electrodeposited copper foil, the surface roughness and grain size of the copper foil can be controlled by addition additives. on this study, the more uniform and hemispherical copper crystals are during the initial stages, the smaller crystal size and surface roughness of copper foil are. The surface roughness of copper foil electrodeposited at the current density of 500 $mA/cm^2$ under galvanostatic mode for 60 seconds has a minimum value of 0.136 ${\mu}$m when adding 2 ppm of arabic gum.

• 대한전자공학회논문지
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• 제25권8호
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• pp.966-971
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• 1988

AES was used to study oxygen adsorption due to the oxygen exposure at 300\ulcorner temperature and segregation of impurities due to annealing on polycrystal copper surface. The intensity of peak of CuM2, 3VV and CuL3 VV increased with annealing time and the peak of CKLL increased after Ar ion bombardment. The effect of oxygen adsorption on copper surface at 300\ulcorner was verified by the decreased of peak of CuM2, 3VV and CuL3 VV as oxygen exposure increase. The binding energy of copper atoms gradualy shifts from 0.7eV to 1.5eV of copper atoms gradually shifts from 0.7eV to 1.5eV after a oxygen exposure. After the oxygen exposure, the width at half the height of CuM2, 3VV is larger 2V*C/S by the effect of chemical liaison of the copper aton with oxygen atom.

• 한국세라믹학회지
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• 제48권2호
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• pp.195-199
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• 2011

The effect of copper oxide on migration and interaction of protons in barium zirconate was investigated using density functional theory. One copper atom was substituted for a zirconium atom site, and a proton was added to a $3{\times}3{\times}3$ barium zirconate superstructure. An energy barrier of 0.89 eV for proton migration was the highest among several energy barriers. To investigate the interaction between multiple protons and a copper atom, two protons were added to the superstructure. Various proton positions were determined by the interaction between the two protons and the copper atom.

• 식물조직배양학회지
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• 제28권4호
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• pp.205-208
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• 2001

벼의 종자배양에서 식물체 재분화 능력을 향상시키기 위하여 2 mg/L의 2,4-D와 여러 가지 농도의 copper (0~5.0mg/L)가 첨가된 MS배지에 종자배양 한 바 캘러스 생장정도는 copper 농도에 따라 다르게 나타났는데 특히, 2.5 mg/L의 copper가 첨가된 배지에서 가장 양호하였다. 그리고 캘러스 형성률과 copper 농도 간에는 유의성 있는 차이가 인정되지 않았다. 식물체 재분화 배지에 2.5 mg/L의 copper의 첨가는 Indica 품종들의 식물체 재분화 효율을 크게 향상시켰다. Copper가 첨가되지 않은 N$_{6}$배지에서 Indica 6품종의 평균재분화율은 2.4%이었으나, copper가 첨가된 배지에서 27.4%로 높게 나타났다.

• Journal of Electrochemical Science and Technology
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• 제9권1호
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• pp.44-50
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• 2018

The aims of this study were to determine the corrosion behavior of pure copper in the presence of Desulfovibrio sp. and also to investigate the effects of glutaraldehyde (GD) and isothiazolinone (ISO) on the corrosion behavior of pure copper in the presence of this sulfate-reducing bacteria (SRB) strain by using electrochemical techniques. Electrochemical measurements of pure copper were carried out at specified time intervals (0, 8, 24, 48, and 96 hr) over a period of exposure. Corrosion rates of pure copper from anodic and cathodic Tafel slopes and corrosion potential ($E_{corr}$) were determined. Biofilm and corrosion products on the copper surfaces were observed by Field Emission Scanning Electron Microscopy (FESEM) and Energy Dispersive X-Ray Spectrometry (EDS) analyses. The effects of solution types (PC (Postgate's C medium) and SRB (Desulfovibrio sp.)) and exposure times of copper and biocides (ISO or GD) on the corrosion rates of pure copper were evaluated by statistical analyses. As a result of the FESEM analysis, biofilm formation was observed on the surfaces of pure copper exposed to the Desulfovibrio sp. cultures both with and without the biocides. The results show that the pure copper was corroded by Desulfovibrio sp. However, the addition of GD or ISO to the Desulfovibrio sp. culture resulted in a decrease in the corrosion rate of the pure copper. It was also observed that both of the biocides showed a similar effect on pure copper's corrosion rate caused by Desulfovibrio sp.

• Environmental Engineering Research
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• 제17권1호
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• pp.17-25
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• 2012

Concern about green water problem has surfaced as a serious issue in Korea. In order to solve this problem, it is necessary to research inhibition of green water and corrosion control of copper pipe in water service. This paper discovered that moderate corrosion inhibitors can solve the green water problem and copper corrosion in water service by adding the optimal concentration of corrosion inhibitors based on regulation. Firstly, in the case of phosphate based corrosion inhibitors, as dosage of the corrosion inhibitor increases from 1 mg/L to 5 mg/L, the relative effect of corrosion inhibitor declines rapidly. Secondly, except for 1 mg/L dosage of silicate based inhibitor, relative effects of the inhibitor displays a positive number depending on inhibitor concentration. The most significant result is that the amount of copper release shows a downward trend, whereas the phosphate based inhibitor accelerates copper ion release as the inhibitor dosage increases. Thirdly, as the dosage of mixed inhibitors increases to 10 mg/L, the copper release change shows a similar trend of phosphate based inhibitor. Lastly, according to the Langelier saturation index (LI), silicate based inhibitors have the most non corrosive value. Larson ratio (LR) indicates that phosphate based inhibitors are the least corrosive. Korea water index (KWI) represents that silicate based inhibitors are most effective in controlling copper pipe corrosion.

• 한국재료학회지
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• 제15권6호
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• pp.426-430
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• 2005

Chemical mechanical polishing (CMP) is an essential process in the production of integrated circuits containing copper interconnects. The effect of alanine in reactive slurries representative of those that might be used in copper CMP was studied with the aim of improving selectivity between copper(Cu) film and tantalum-nitride(TaN) film. We investigated the pH effect of nano-colloidal silica slurry containing alanine through the chemical mechanical polishing test for the 8(inch) blanket wafers as deposited Cu and TaN film, respectively. The copper and tantalum-nitride removal rate decreased with the increase of pH and reaches the neutral at pH 7, then, with the further increase of pH to alkaline, the removal rate rise to increase soddenly. It was found that alkaline slurry has a higher removal rate than acidic and neutral slurries for copper film, but the removal rate of tantalum-nitride does not change much. These tests indicated that alanine may improve the CMP process by controlling the selectivity between Cu and TaN film.