• BMB Reports
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• 제39권3호
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• pp.335-338
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• 2006

Methylglyoxal (MG) is an endogenous physiological metabolite which is present in increased concentrations in diabetics. MG reacts with the amino acids of proteins to form advanced glycation end products. In this in vitro study, we investigated the effect of MG on the structure and function of ceruloplasmin (CP) a serum oxidase carrier of copper ions in the human. When CP was incubated with MG, the protein showed increased electrophoretic mobility which represented the aggregates at a high concentration of MG (100 mM). MG-mediated CP aggregation led to the loss of enzymatic activity and the release of copper ions from the protein. Radical scavengers and copper ion chelators significantly prevented CP aggregation. CP is an important protein that circulates in plasma as a major copper transport protein. It is suggested that oxidative damage of CP by MG may induce perturbations of the copper transport system and subsequently lead to harmful intracellular condition. The proposed mechanism, in part, may provide an explanation for the deterioration of organs in the diabetic patient.

• KSTLE International Journal
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• 제2권1호
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• pp.22-28
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• 2001

A resin bonded copper-graphite brush was investigated to evaluate the characteristics electrical signal transmission through a sliding contact as a function of the relative amount of graphite and copper in the brush. Particular attention was given to the correlation between electrical signal fluctuation and tribological properties in an electrical sliding contact system. A ring-on-block type tribotester was used for this experiment and the ring was made from pure copper. Results showed that a copper-graphite brush at a particular composition range exhibited the most stable frictional behavior with a minimum voltage drop. The amount of voltage drop at the friction interface was affected by the surface roughness, transfer film formation at the friction interface, and the real area of contact. Microscopic observations and the surface analysis showed a good agreement with the results from this experiment. The results also indicated that the electrical signal flunctuation was directly associated with the oscillation of the coefficient of friction during sliding by nanoscale variation of contacts at the friction interface.

• 한국분말재료학회지
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• 제19권5호
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• pp.343-347
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• 2012

In this study, an oxygen plasma treatment was used as a low temperature debinding method to form a conductive copper feature on a flexible substrate using a direct printing process. To demonstrate this concept, conductive copper patterns were formed on polyimide films using a copper nanoparticle-based paste with polymeric binders and dispersing agents and a screen printing method. Thermal and oxygen plasma treatments were utilized to remove the polymeric vehicle before a sintering of copper nanoparticles. The effect of the debinding methods on the phase, microstructure and electrical conductivity of the screen-printed patterns was systematically investigated by FE-SEM, TGA, XRD and four-point probe analysis. The patterns formed using oxygen plasma debinding showed the well-developed microstructure and the superior electrical conductivity compared with those of using thermal debinding.

• 한국전기전자재료학회논문지
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• 제25권7호
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• pp.496-499
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• 2012

Modified structure of copper pillar bump which has trapezoidal cross section on the top region is suggested with simulation results and concept of fabrication process. Due to the large surface area of joint region between bump and solder in suggested structure, electro-migration effect can be reduced. Reduction of electro-migration is related with current density and joule heating in bump and investigated with finite element methods with variation of dimensional parameters. Mechanical characteristics are also investigated with comparing modified copper pillar bump and conventional copper pillar bump.

• 마이크로전자및패키징학회지
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• 제23권4호
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• pp.1-6
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• 2016

In this article, the recent developments in electroless plating of copper, electroless bath formulation and effect of plating parameters have been reviewed. Cyanide free electroless baths are now being developed and studied due to the various environmental concerns. Various organic chemicals such as complexing agents, reducing agents, and additives such as poly-alcohols and aromatic ring compounds have been added to copper plating baths for promising results. The effects of various reducing and complexing agents, bath conditions like additives, bath pH, and composition have been summarized. Finally the applications of the electroless plating of copper and latest developments have been overviewed for further guidance in this field.

• 대한화학회지
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• 제54권6호
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• pp.680-686
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• 2010

인공해수에서 일어나는 구리의 부식에 대하여 알라닌, 아스파라긴, 아스파틱산, 글루타민 그리고 메티오닌의 부식억제 효과를 조사하였다. 아미노산들의 흡착은 흡착 분자들의 상호작용 때문에 Temkin의 logarithmic isotherm이 잘 적용되었으며, 부식억제 효율은 아미노산의 농도에 의존하였다.

• 한국지하수토양환경학회:학술대회논문집
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• 한국지하수토양환경학회 1999년도 추계학술발표회
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• pp.12-15
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• 1999

Soils collected from an agricultural field in Youngdong, Chungbuk province were intentionally: contaminated with lead and copper. The efficiencies of soil washing with HCl, SDS and Tween 80 were investigated through the column mode experiments. Washing with 0.1 N HCl obtained the best result for lead and copper removal (95.04 %, 95.94 %). In case of SDS, lead and copper removal rate was such poor as 7.1 % and copper was 24.04 %, respectively. Meanwhile, washing of contaminated soil with Tween 80, did not show any significant removal effect. It was found that the washing efficiency was dependent on pH of washing agent.

• 대한기계학회논문집
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• 제14권3호
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• pp.547-553
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• 1990

본 연구에서는 알루미나 세라믹(Al$_{2}$O$_{3}$)재료와 순수구리를 티타늄 용자재로써 접합한 브레이징 접합물내의 냉각후 잔류응력을 유한요소법으로 사용하여 해석하였다.

• 한국전기화학회:학술대회논문집
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• 한국전기화학회 2005년도 수소연료전지공동심포지움 2005논문집
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• pp.383-390
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• 2005

Effect of applying a DC voltage on the interfacial reaction at the metal to zirconia interface was investigated utilizing an oxygen ionic conductivity of partially stabilized zirconia. The joining of copper rod and zirconia tube was carried out in Ar gas atmosphere at $1000^{\circ}C$. There are two type of the joining. The one is the reaction bond consisting of copper and zirconia was dominated by surface reaction with a undetectable very thin layer. It was found that copper elements were diffused to zirconia side, but that Zr ions were not diffused to copper side. These results mean application of a DC voltage to migrate oxygen to the copper-zirconia interface can oxidize metal at the copper-zirconia interface and the bonding reaction between zirconia and copper oxide may occur. The other is the reaction bonding was dominated by interdiffusion with a very thick interface layer. This result mean application of a DC voltage can reduce zirconia at the interface. The bonding reaction is to be an alloying between Zr and Cu.

• 한국분말재료학회지
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• 제12권6호
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• pp.413-421
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• 2005

Copper is able to work as a current collector under wide range of hydrocarbon fuels without coking in Solid oxide fuel cells (SOFCs). The application of copper in SOFC is limited due to its low melting point, which result in coarsening the copper particle. This work focuses on the sintering of copper powder with ceria coating layer. Ceria-coated powder was prepared by thermal decomposition of urea in $Ce(NO_3)_3\cdot6H_2O$ solution, which containing CuO core particles. The ceria-coated powder was characterized by XRD, ICP, and SEM. The thermal stability of the ceria-coated copper in fuel atmosphere $(H_2)$ was observed by SEM. It was found that the ceria coating layer could effectively hinder the grain growth of the copper particles.