• 한국환경과학회지
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• 제9권5호
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• pp.365-368
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• 2000

The antibacterial effect amino acid-copper(II) surfactant on fish pathogens was studied. Fish pathogens of Edwardsiella tarda Vibrio anguillarum Aeromonas hydrophila and Streptococcus sp. were selected cultured in nutrient agar and adjusted at $2{\times}10^5~10^6 CFU/$m\ell$$ in phosphate buffer saline before the addtion of amino acid-copper(II) surfactant with different concentrations. All tested pathogens died within 1 hour with 1 ppm of amino acid-copper(II) surfactant. In comparison with formalin and ET. amino acid-copper (II) surfactnat was more effective in antibacterial capacity.

• 한국환경보건학회지
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• 제19권2호
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• pp.40-45
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• 1993

A solvent extraction system of copper-thiocyanate complex into various types of alkylamines such as secondary, tertiary and quaternary ammonium salt for the determination of trace copper by atomic absorption spectrometry is presented. The maximum extraction of copper shows at 0.1 M-thiocyanate and single extraction with 10 ml of 1% amine-MIBK from 50 ml of aqueous solution is enough to be quantitative for micro amounts of copper. The effect of amine diluents and of diverse ions are also examined.

• 식물병연구
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• 제20권2호
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• pp.95-100
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• 2014

본 연구는 에스필과 수산화동의 혼용에 의한 오이, 토마토, 고추의 흰가루병에 대한 방제 효과를 구명하고자 수행하였다. 오이 흰가루병에서 에스필과 수산화동의 혼용 처리는 4 : 1 혼용처리구에서 발병엽률 18.9%와 방제효과 69.9%, 8 : 1 혼용 처리구에서 발병엽률 18.1%와 방제효과 71.1%로 가장 효과적이었다. 토마토 흰가루병에서 에스필과 수산화동의 혼용 처리는 4 : 1 혼용 처리구에서 발병엽률 12.4%와 방제효과 85.3%, 8 : 1 혼용 처리구에서 발병엽률 14.3%와 방제효과 83.0%로 가장 효과적이었다. 고추 흰가루병에서 에스필과 수산화동의 혼용 처리는 4 : 1 혼용 처리구에서 발병엽률 17.7%와 방제효과 76.4%로 가장 효과적이었다. 이상의 결과를 종합할 때 에스필과 수산화동 혼용처리에 의한 오이와 토마토 흰가루병에 대한 방제 효과는 4 : 1 혹은 8 : 1 혼용 처리가 가장 효과적이고, 고추 흰가루병에서는 4 : 1 혼용 처리가 가장 효과적인 방제 방법으로 구명되었다.

• 전기화학회지
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• 제15권1호
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• pp.41-47
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• 2012

조류제거를 위한 구리이온을 생성하기 위한 환형 흐름 구리 전기분해 반응기 시스템을 구성하고 그 가동특성에 대하여 고찰하였다. 또한 구리이온이 조류에 미치는 영향도 살펴보았다. 인가전류를 증가하면 균등조로부터 배출되는 구리 이온 농도가 비례적으로 증가함을 알 수 있었다. 전류 밀도를 조절하여 원하는 구리농도를 얻을 수 있음을 알았으며 패러데이 효율은 90% 이상임을 알 수 있었다. 유량을 증가시키면 구리이온농도는 감소하였으며 이는 전극에서의 반응속도와는 상관없이 물의 증가량에 따른 희석 때문임을 알 수 있었으며 농도 과전위 영향은 미미하였다. pH가 증가할수록 생성되는 구리이온 농도는 이에 반비례하여 감소하였고 전기전도도의 변화는 배출되는 구리이온 농도에 별 영향을 미치지 않았다. 구리이온 농도가 증가시킬 경우 Chlorophyll-a 농도가 크게 감소함을 볼 수 있으며, 구리 이온 농도가 0.2 ppm 이상일 때 조류가 효과적으로 제거됨을 알 수 있다. 황산구리를 용해시킨 구리이온이나 전기분해를 통해 얻은 구리이온을 투여한 경우 별차이가 없었으며 5일 후 조류 제거효율은 0.4 ppm이상의 농도에서는 90%이상이었다.

• Journal of Nutrition and Health
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• 제28권5호
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• pp.387-396
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• 1995

This study was undertaken to investigate the effect of increase in the ratio of zinc to copper and alcohol consumption on serum lipid content in Sprague-Dawley male rats during five weeks. Sixty rats were divided into six groups, CZ < zinc 30ppm diet >, CZA < zinc 30 ppm diet plus alcohol 5% solution >, HZ < zinc 300ppm diet >, HZA < zinc 300ppm diet plus alcohol 5% solution >, SHZ < zinc 600ppm diet >, SHZA < zinc 600 ppm diet plus alcohol 5% solution >. High ratio of zinc to copper groups < HZ, SHZ > were significantly decreased in high-density lipoprotein (p<0.01) and increased in total cholesterol, triglyceride, total lipid in serum(p<0.001, p<0.001, p<0.01). Triglyceride levels of serum in alcohol groups < CZA, HZA, SHZA > were significantly higher (p<0.001) than non-alcohol group < CCZ, HZ, SHZ >. Copper levels of serum were reduced in group high ratio of zinc to copper. These results present that high ratio of zinc to copper increase cholesterol(p<0.001) and alcohol consumption increase triglyceride(p<0.001) in serum. This close association to lipid metabolism in rats draw attention to the potential significance of zinc and alcohol nutriture in relation to cardiovascular disease.

• Corrosion Science and Technology
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• 제10권4호
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• pp.143-150
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• 2011

Copper electroplating has been applied to various fields such as decorative plating and through-hole plating. Technical realization of high strength copper preplating for wear-resistant tools and molds in addition to these applications is the aim of this work. Brighters and levelers, such as MPSA, Gelatin, Thiourea, PEG and JGB, were added in copper sulfate electrolyte, and the effects of these organic additives on the hardness were evaluated. All additives in this work were effective in increasing the hardness of copper electrodeposits. Thiourea increased the hardness up to 350 VHN, and was the most effective accelarator in sulfate electrolyte. It was shown from the X-ray diffraction analysis that preferred orientation changed from (200) to (111) with increasing concentration of organic additives. Crystallite size decreased with increasing concentration of additive. Hardness was increased with decreasing crystallite size, and this result is consistent with Hall-Petch relationship, and it was apparent that the hardening of copper electrodeposits results from the grain refining effect.

• 한국재료학회지
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• 제18권3호
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• pp.163-168
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• 2008

The morphology of three-dimensional (3D) cross-linked electrodeposits of copper and tin was investigated as a function of the content of metal sulfate and acetic acid in a deposition bath. The composition of copper sulfate had little effect on the overall copper network structure, whereas that of tin sulfate produced significant differences in the tin network structure. The effect of the metal sulfate content on the copper and tin network is discussed in terms of whether or not hydrogen evolution occurs on electrodeposits. In addition, the hydrophobic additive, i.e., acetic acid, which suppresses the coalescence of evolved hydrogen bubbles and thereby makes the pore size controllable, proved to be detrimental to the formation of a well-defined network structure. This led to a non-uniform or discontinuous copper network. This implies that acetic acid critically retards the electrodeposition of copper.

• 한국표면공학회지
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• 제5권3호
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• pp.77-85
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• 1972

A method of preparation of synthetic ignorgaic coating on copper (patina) has been presented . An Eh--pH diagram was constructed for the present Cu-H2O-SO$_4$ system using the most recently available thermodynamic data. In the path of the patination at room temperature the general behaviour of copper in acidic copper sulfate solutions with potassium chlorate as an oxidizing agent appeared to follow those predictable in this Eh-pH diagram. In the presence 0.05 molar cupric sulfate at a temperature of about 28$^{\circ}C$ a green brochantite (CuSO$_4$$.$3Cu(OH)$_2$) layer was formed on copper sheet in 20 days. In a solution having an initial pH of 3.5 the development of a brochantite coating has been observed to take place in two stages. In the first, a layer of cuprous oxide formed on the copper at a relatively rapid rate. In the ensuing step the outer layer of cuptrite was oxidized at much slower rate to form brochantite. The syntetic coatings appeared to consist of crystal-lites of brochanitite growing perpendicular to the cuprose oxide surface. The outer tips of the -crystallites were reasily broken off and gave to the layer a rather chalky character. Underneath, at the brochantite Cu$_2$O interface, however, the green layers were firmely attached. The effect of reagent concentration , solution agitation , and moderate temperature increase were investigated to improve the quality of coating. So also in a qualitative way were the effect of light.

• 한국세라믹학회지
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• 제37권8호
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• pp.799-804
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• 2000

Coulometric titration experiments have been done for copper doped cobaltous oxide (Co1-xCux)1-$\delta$ O with various dopant concentrations. We present the obtained experimental data and compare our results to those of previous thermogravimetric investigation. The experimental data are fitted by theoretical calculations based on various defect models. For this modeling, we considered different types fo major defects like copper in substitutional and interstitial lattice sites as well as copper vacancy. We also introduced the copper evaporation effect during titration experiment into our consideration.

• 한국안전학회지
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• 제15권4호
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• pp.28-34
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• 2000

Copper clad aluminum composite materials are being used for economic and structural purposes, The development of an efficient production method of copper clad aluminum composite material rods by extrusion is very important. This paper describes experimental investigations in the direct extrusion of copper clad aluminum rods through conical dies. There are several parameters that have an influence on determining a sound clad extrusion. These variables are extrusion temperature, extrusion ratio, semi-cone angle of die, extrusion force, extrusion velocity, friction of between the container and billet, percentage of copper used and ratio of flow stress of copper to aluminum. In order to investigate the influence of extrusion temperature, extrusion ratio, semi-cone angle of die on the hot direct extrudability of the copper clad aluminum composite material rods, the experimental study have been performed with these variation.