• Journal of Electrochemical Science and Technology
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• 제14권2호
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• pp.194-204
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• 2023

Models based on diffusion-limited aggregation (DLA) have been extensively used to explore the mechanisms of dendritic particle aggregation phenomena. The physical and chemical properties of systems in which DLA aggregates emerge are given in their fractal. In this paper, we present a comprehensive study of the growth of electrodeposited copper dendrites in flat plate electrochemical cells from a fractal perspective. The effects of growth time, applied voltage, copper ion concentration, and electrolyte acidity on the morphology and fractal dimension of deposited copper were examined. 'Phase diagram' set out the variety of electrodeposited copper fractal morphology analysed by metallographic microscopy. The box counting method confirms that the electrodeposited dendritic structures manifestly exhibit fractal character. It was found that with the increase of the voltage and copper ion concentration. The fractal copper size becomes larger and its morphology shifts towards a dendritic structure, with the fractal dimension fluctuating around 1.60-1.70. In addition, the morphology of the deposited copper is significantly affected by the acidity of the electrolyte. The increase in acidity from 0.01 to 1.00 mol/L intensifies the hydrogen precipitation side reactions and the overflow path of hydrogen bubbles affects the fractal growth of copper dendrites.

• 마이크로전자및패키징학회지
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• 제29권4호
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• pp.77-82
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• 2022

PCB 기판의 구리 식각 시 전기도금된 배선과 기지층의 전도층은 다른 에칭 특성을 가지며 이로 인한 배선의 과에칭과 배선기저부의 언터컷 현상이 보고되고 있다. 본 연구에서는 구리 에칭의 조성 변화에 따른 구리 에칭 특성에 대하여 연구하였다. 분극법과 OCV (open circuit voltage)를 이용하여 에칭액의 전기도금 구리와 기지층 구리의 최적 과산화수소와 황산의 농도를 얻었다. OCV와 ZRA (zero resistance ammeter)분석법을 이용하여 억제재의 효과를 비교하였다. 구리배선과 기지층간의 갈바닉 전류를 ZRA 방법을 이용하여 측정 비교하였다. 갈바닉 전류를 최소화하는 억제재를 ZRA를 이용한 갈바닉 쌍으로부터 선택할 수 있었다.

• Corrosion Science and Technology
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• 제12권5호
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• pp.253-258
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• 2013

Effects of copper hydroxide(II) on the curing and the corrosion resistance of electrocoating were investigated by MEK rubbing test, electrochemical impedance spectroscopy (EIS) and Thermo-gravimetric analysis (TGA). Curing performance of electrocoating was lowered with increasing the content of copper hydroxide(II) as evidenced by the MEK rub performance which decreased with increasing the content of copper hydroxide(II). This indicates copper hydroxide(II) affected the blocked isocyanate reaction in the coatings, by the decomposition of copper hydroxide(II) to CuO and $H_2O$ during reaction of isocyanate with nuclephiles. Corrosion resistance of coatings also decreased with the content of copper hydroxide. This reflects the higher barrier property in coatings with higher curing performance.

• 한국결정성장학회지
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• 제8권1호
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• pp.131-137
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• 1998

구리입자를 코딩한 분말 합성은 Kelex 100 solvent extraction으로부터 silica powder에 수소압력 stripping copper에 의하여 생성하였다. Solvent extraction의 범위내인 일정한 조건에서 loading level과 stripping rate등을 재생하였으며 stripping copper kinetics는 divalent상태에서 metallic 상태로 감소하면서 silica 입자에 침적하였다. Copper들은 seed 입자에 heterogeneous 핵을 형성하면서 이들은 agglomeration 상태로 생성되었고 불균일한 분말로 형성하였다.

• 한국표면공학회:학술대회논문집
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• 한국표면공학회 2016년도 추계학술대회 논문집
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• pp.124.1-124.1
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• 2016

In this work, uniform thickness and good adhesion of electrodeposited copper layer were achieved on AZ91 Mg alloy in alkaline noncyanide copper solution containing pyrophosphate ion by employing appropriate zincate pretreatment. Without zincate pretreatment, the electrodeposited copper layer on AZ91 Mg alloy was porous and showed poor adhesion which was explained by small number of nucleation sites of copper due to rapid dissolution of the magnesium substrate in the pyrophosphate solution. The zincate pretreatment was found as one of the most important steps that can form a conducting layer to cover AZ91 surface which decreased the dissolution rate of AZ91 Mg alloy about 40 times in the copper pyrophosphate solution. Electrodeposited copper layer on AZ91 Mg alloy after an appropriate zincate pretreatment showed good adhesion and uniform thickness with bright surface appearance, independent of the deposition time but the surface roughness of the electrodeposited copper layer increased with increasing Cu deposition time.

• Journal of information and communication convergence engineering
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• 제8권1호
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• pp.99-102
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• 2010

Large-scaled area and aligned copper oxide nanowires have been synthesized by a vapor-phase approach to the facial synthesis of copper oxide nanowires supported on the surface of a copper gasket. The effects of annealing temperature and time were investigated. Long and aligned nanowires can only formed within a narrow temperature range from 400 to $500^{\circ}C$ for 4 hrs. Annealing copper gasket in static air produces large-area, uniform, but not well vertically aligned nanowires along the copper gasket surface. The surface of copper gasket is converted into bicrystal CuO nanowires was observed after the copper gasket is annealed under static air condition.

• 한국세라믹학회지
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• 제33권11호
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• pp.1245-1252
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• 1996

The charcteristics for the copper-contained spinel ferrites such as NiCu-and ZnCu ferrites with various copper content are investigated in this study which can provide a explanation for the behavior of copper in sintering at a low temperatuer. The bulk density and the grain size for these sintered ferrites were increased with the larger amount of copper in compositions. In microstructure of copper-contained spinel ferrites copper exists in the grain boundary which is sintering process. Electrical resistivity and frequency range with maximum Q-facor of NiCu-or ZnCu ferrites were decreased as increasing of copper content in ferrite composition.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.414-417
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• 2003

A copper-clad aluminium composite bar is lighter and less expressive than a commercial copper alloy bar. Copper-clad aluminium composite bar can be fabricated by hot hydrostatic extrusion process. In this work, the effect of die angle on the compressive properties of copper-clad aluminium composites fabricated using hydrostatic extrusion process was investigated experimentally. The results showed that optimum half die angle was in the range of 40$^{\circ}$ to 50$^{\circ}$ for an extrusion ratio of 19. The results also showed that the half die angle had little influence on the compressive strength of copper-clad aluminium composites. A diffusion layer increased with increasing die angle.

• 대한화학회지
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• 제64권2호
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• pp.61-66
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• 2020

In this study, we investigate the structural and electronic properties of copper oxide clusters, Cu_nO_n (n = 9 - 15). To find the lowest energy structures of copper oxide clusters, we use ReaxFF and density functional theory calculations. We calculate many initial copper oxide clusters using ReaxFF quickly. Then we calculate the lowest energy structures of copper oxide clusters using B3LYP/LANL2DZ model chemistry. We examine the atomization energies per atom, average bond angles, Bader charges, ionization potentials, and electronic affinities of copper oxide clusters. In addition, the second difference in energies is investigated for relative energies of copper oxide clusters.

• 한국안전학회지
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• 제15권4호
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• pp.28-34
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• 2000

Copper clad aluminum composite materials are being used for economic and structural purposes, The development of an efficient production method of copper clad aluminum composite material rods by extrusion is very important. This paper describes experimental investigations in the direct extrusion of copper clad aluminum rods through conical dies. There are several parameters that have an influence on determining a sound clad extrusion. These variables are extrusion temperature, extrusion ratio, semi-cone angle of die, extrusion force, extrusion velocity, friction of between the container and billet, percentage of copper used and ratio of flow stress of copper to aluminum. In order to investigate the influence of extrusion temperature, extrusion ratio, semi-cone angle of die on the hot direct extrudability of the copper clad aluminum composite material rods, the experimental study have been performed with these variation.