• Applied Biological Chemistry
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• v.46 no.1
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• pp.7-11
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• 2003

Cloning and expression of copper-binding peptide gene in E. coli was carried out to enhance the copper-chelation capacity. E. coli was transformed with pET vector containing the copper-binding region of potato polyphenol oxidase gene and polyhistidine-coding DNA, and the copper content of E. coli harboring each vector was measured. No increase in intracellular copper was observed in E. coli harboring PPOCBpET32 vector, which contains DNA for polyphenol oxidase copper-binding region. Intracellular copper content of E. coli harboring pE728a vector, which contains one hexahistidine unit DNA, was 2,500 ppm after culturing without kanamycin, whereas E. coli harboring pET-his vector, which contains nine hexahistidine unit DNAs was 3,200 ppm.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.2 s.39
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• pp.9-13
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• 2006

The copper lines in COF are usually fabricated by subtractive method. As the width of lines are smaller, the subtractive method has a lateral etching problems. In semi-additive method, copper lines are fabricated by lithographic technique followed by electroplating method. Fine line patterns of $10-40{\mu}m$ were used for this study. Two different types of thick photoresist, AZ4620 and PMER900, were employed for PR mold. Copper lines were fabricated by electroplating method. The crack were found in fine copper lines due to high residual stress when normal copper electroplating bath were used. The via filling copper electroplating bath were replaced the normal electroplating bath and then cracks were not found in the fine copper lines. During substrate etching, the lateral etching of copper lines were not occurred.

• Journal of Electrochemical Science and Technology
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• v.11 no.1
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• pp.60-67
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• 2020

In this study, copper (II) oxide powder for electroplating was prepared by recovering CuCl₂ from NaClO₃ type etching wastes via recovered non-sintering two step chemical reaction. In case of alkali copper carbonate [mCuCo₃·nCu(OH)₂], first reaction product, CuCo₃ is produced more than Cu(OH)₂ when the reaction molar ratio of sodium carbonate is low, since m is larger than n. As the reaction molar ratio of sodium carbonate increased, m is larger than n and Cu(OH)₂ was produced more than CuCO₃. In the case of m has same values as n, the optimum reaction mole ratio was 1.44 at the reaction temperature of 80℃ based on the theoretical copper content of 57.5 wt. %. The optimum amount of sodium hydroxide was 120 g at 80℃ for production of copper (II) oxide prepared by using basic copper carbonate product of first reaction. At this time, the yield of copper (II) oxide was 96.6 wt.%. Also, the chloride ion concentration was 9.7 mg/L. The properties of produced copper (II) oxide such as mean particle size, dissolution time for sulfuric acid, and repose angle were 19.5 mm, 64 second, and 34.8°, respectively. As a result of the hole filling test, it was found that the copper oxide (II) prepared with 120 g of sodium hydroxide, the optimum amount of basic hydroxide for copper carbonate, has a hole filling of 11.0 mm, which satisfies the general hole filling management range of 15 mm or less.

• Korean Chemical Engineering Research
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• v.46 no.6
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• pp.1069-1074
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• 2008

In this work, we made a study for the 3D SAM formation of octanethiol, decanethiol, and dodecanethiol on copper nanoparticles and we verified stability of the copper particle depending on the ratio of dodecanethiol to copper. The reaction was performed in a one-phase system under nitrogen atmosphere and the thiolated copper particles could be obtained by centrifugation. We could confirm that the nanoparticles consisted of a spherical shape of 3~6 nm from TEM images. FT-IR, XPS and TGA results showed that alkanethiols were chemisorbed via thiol group and the packing density of the alkanethiols on copper surface increased with the alkyl chain lengths. XRD patterns gave us useful information about superlattice formations. Finally, $Cu_2O$ was formed when the molar ratio of dodecanethiol to copper is less than unity and copper nanoparticles formed more compact 3D SAMs when the molar ratio of dodecanethiol to copper was 1.25.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.26 no.3
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• pp.101-108
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• 2016

Each year, more than seven hundred thousand tons of copper slag are generated in Korea as a byproduct during the production of copper. Due to the large amount of copper slag produced, there has been increased interest in the use of copper slag as a construction material. To evaluate the potential of copper slag as a construction material, laboratory evaluations were conducted in this study, and three particle shapes and replacement rates of river sand were selected as experimental variables. Strength, air-void characteristics, and sulfuric acid resistance were the three properties evaluated to assess whether copper slag can be used as a construction material. Test results indicate that the gradation of copper slag has an effect on strength, and the maximum strength was achieved when 60 % of river sand was replaced with copper slag. In addition, when compared with ordinary Portland cement mortar, replacing river sand with copper slag reduced air void size and increased sulfuric acid resistance.

• The Korean Journal of Pesticide Science
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• v.6 no.3
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• pp.175-182
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• 2002

This experiment was conducted to investigate the effects of acid rain in spraying copper hydroxide 77% wettable power(WP) on leaf surface morphology and crop injury of the garlic(Allium sativum L.). Leaf chlorosis, hooked leaves, wrinkled epidermal cells and increased stomata open of garlic were induced by foliar application of simulated acid rain(SAR). It was become to be severe in application of copper hydroxide solution after application of SAR, but those yield of garlic was not significantly different from the untreated control. Leaf chlorosis was sharply increased above 100 ppm of copper ions. Amount of solved copper ions in copper hydroxide solution was remarkably increased below pH 5.5 and the residue in garlic leaves was significantly increased by application of copper hydroxide solution after spraying SAR compared with application of copper hydroxide solution only. When calcium carbonate was applied together with copper hydroxide leaf chlorosis was less than copper hydroxide only.

• Journal of Korea Foundry Society
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• v.25 no.6
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• pp.259-264
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• 2005

The copper clad steel wire is used extensively as lead wires of electronic components such as capacitors, diodes and glass sealing lamp because the wire combines the strength and low thermal expansion characteristic of Fe-Ni steel with the conductivity and corrosion resistance of copper. In order to fabricate the copper clad steel wire, several processes including electro-plating, tubecladding extrusion process and dip forming process have been introduced and applied. The electroplating process for the production of copper clad steel wire shows poor productivity and induces environmental load generation such as electroplating solution. The dip forming process is suitable to mass production of copper clad steel such as trolley wire. and need expensive manufacturing facilities. The present paper describes the improvement of the conventional continuous casting process to fabricate copper clad steel wire, which its core metal is low thermal expansion Fe-Ni alloy and its sheath material is copper. In particular, the formation of intermetallic compound at interface between core and sheath was investigated in order to introduce optimum continuous casting process parameter for fabrication of copper clad steel wire with higher electrical conductivity. The mechanical strength of copper clad steel wire was also investigated through wiredrawing process with of 95% in total reduction ratio.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.217-220
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• 2009

Conductive adhesives have been investigated for use in microelectronics packaging as a lead-free solder substitute due to their advantages, such as low bonding temperature. However, high resistivity and poor mechanical behavior may be the limiting factors for the development of conductive adhesives. The metal fillers and the polymer resins provide electrical and mechanical interconnections between surface mount device components and a substrate. As metal fillers used in conductive adhesives, silver is the most commonly used due to its high conductivity and the stability. However the cost of conductive adhesives with silver fillers is much higher than usual lead-free solders and silver has poor electro-migration performance. So, copper can be a promising candidate for conductive filler metal due to its low resistivity and low cost, but oxidation causes this metal to lose its conductivity. In this study, electrically conductive adhesives (ECAs) using surface modified copper fillers were developed. Especially, in order to overcome the problem associated with the oxidation of copper, copper particles were coated with silver, and the silver-coated copper was tested as a filler metal. Especially the effect of silver coating on the electrical resistance just after curing and after aging was investigated. As a result, it was found that the electrical resistance of ECA with silver-coated copper filler was clearly lower and more stable than that of ECA with pure copper filler after curing process. And, during high temperature storage test, the degradation rate of electrical resistance for ECA with silver coated copper filler was quite slower than that for ECA with pure copper filler.

• Resources Recycling
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• v.28 no.3
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• pp.3-14
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• 2019

Copper is one of the first metals utilized by humankind about 11,500 years ago. But copper is not plentiful metallic element in the earth's crust. Copper has a high thermal and electric conductivity and is relatively corrosion resistant. In principle copper is virtually 100 % recyclable as an element without loss of quality. The recycling of copper scrap reduces the energy consumption and environmental burden, comparing to the primary metal production. Currently, approximately 30% of the global copper supply provides by recycling. Copper scrap is smelted in primary and secondary smelter. Type of furnace and process steps depend on the quality and grade of scrap. Depending on copper content of the secondary raw material, refining is required, which is usually done through electrorefining. This work provides an overview of the primary copper production and recycling process.

• Journal of radiological science and technology
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• v.44 no.1
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• pp.39-46
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• 2021

This study confirmed the usefulness of the copper filter according to the mode change by comparing and analyzing the energy change according to the application of the copper filter and the change in effective dose and image quality according to the distance to the subject in the DR(Digital Radiography) system. The average energy increased when the copper filter was applied and the reduction rate by 50% of mAs was increased as the thickness of the copper filter increased according to the application of the 10 kVp rule in AEC mode. The effective dose decreased as the thickness increased when the copper filter was applied in AEC(Automatic Exposure Control) mode and manual mode according to the application of the 10 kVp rule, and the decrease rate decreased with increasing 10 kVp increments. As a result of analyzing the dicom images for AEC mode and manual mode with Image J. the PSNR(Peak Signal to Noise Ratio) values were approximate values of less than 30 dB for each mode and for each copper filter thickness. When the copper filter was applied, the average energy increased, so when the 10 kVp rule was applied, the mAs for each mode could be reduced, and the effective dose could also be reduced. However, as the distance and tube voltage increased, the reduction rate of mAs decreased, and the quality of the image was found to decrease when the copper filter was applied, but there was no difference in quality of the image when the copper filter thickness increased.