• 제목/요약/키워드: Copper(Cu)

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음수중(飮水中) 동(銅)의 수준(水準)에 따른 흰쥐장기내(臟器內) 동(銅), 철(鐵) 및 아연(亞鉛)의 농도(濃度)에 미치는 영향 (Effects of Drinking Water Supplemented with Copper on Tissue Concentrations of Copper, Iron and Zinc in Rats)

  • 고진복;정복미;김재영;최도점;양차범
    • 한국식품영양과학회지
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    • 제16권2호
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    • pp.63-68
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    • 1987
  • The effects of various levels of copper(Cu) intake on the concentrations of copper, iron (Fe) and 3inc(Zn) in rat tissues were studied in growing rats. For different groups the drinking water was supplemented with 0(control), 25, 50, 100 and 200ppm Cu(as copper sulphate) for 1 day respectively. All animal groups were fed with the control diet (Cu contents, 12.8%mg/kg diet) during the experiment. At the end of the 4 week experiment, body weight gain was slightly lower in the Cu supply groups than in control group. Liver and serum Cu were significantly higher in 50, 100 and 200ppm Cu of male and in 200ppm Cu of female than in control groups. Spleen Cu was significantly increased by the supplementation of Cu. Liver and heart Fe of male and heart Fe of female were increased by incresing supplementary Cu levels. In 50ppm Cu group, liver, spleen and kidney Fe of female increased but the others did not. Fe of tissues was different in male and female rats according to Cu levels supplied. Serum Zn of male and female was significantly lower in 50, 100 and 200ppm Cu groups than in control and 25ppm Cu groups. When supplemented with Cu levels there were no significant differences among groups for liver, kidney, spleen and heart Zn as well as heart and kidney Cu.

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무전해 도금법을 이용한 Sn-Cu 범프 형성에 관한 연구 (Fabrication of Sn-Cu Bump using Electroless Plating Method)

  • 문윤성;이재호
    • 마이크로전자및패키징학회지
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    • 제15권2호
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    • pp.17-21
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    • 2008
  • Sn-Cu계 솔더 범프에서 무전해도금법을 이용한 범프 형성에 대한 연구를 하였다. $20{\mu}m$ via에 전기도금법으로 구리를 채운 웨이퍼 위에 ball형태의 범프를 형성하기 위하여 구리와 주석을 도금하여 약 $10{\mu}m$높이의 범프를 형성하였다. 구리 범프 형성 시 via위에 선택적으로 도금하기 위하여 활성화 처리 후 산세처리를 실시하고 무전해 도금액에 안정제를 첨가하였다. 무전해도금법을 이용하여 주석 범프 형성 시 도금층이 구리 범프에 비해 표면의 균일도가 벌어지는 것으로 관찰되었지만 reflow공정을 실시한 후 ball 형태의 균일한 Sn-Cu 범프를 형성하였다.

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Hydrothermal Synthesis, Crystal Structure and EPR Property of Tetranuclear Copper(II) Cluster [Cu4OCl6(C14H12N2)4]

  • Jian, Fang-Fang;Zhao, Pu-Su;Wang, Huan-Xiang;Lu, Lu-De
    • Bulletin of the Korean Chemical Society
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    • 제25권5호
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    • pp.673-675
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    • 2004
  • The tetranuclear copper(II) cluster compound $[Cu_4OCl_6(C_{14}H_{12}N_2)_4]$ has been synthesized by hydrothermal reaction and studied by X-ray diffraction. The four copper(II) atoms locate four capsheaves of a tetrahedral skeletal structure and a oxygen atom as interstitial atom occupies the center position of the same tetrahedron, and each edge of the Cu-Cu tetrahedron is bridged by one ${\mu}_2$-Cl anion. The copper atom possesses slightly distorted trigonal bipyramidal geometry with three ${\mu}_2$-Cl atoms in equatorial position and the interstitial O atom and one N atom from 3-benzyl-benzimidazole ligand occupying axial position. The Cu-Cu distances are in the range of 3.0986-3.1162 ${\AA}$. The EPR spectrum suggested that the copper(II) ground state $d_{x2-y2}$ and the coordination geometry was trigonal bipyramidal.

황산동전해액(黃酸銅電解液) 중 은(銀(Ag)) 제거(除去)를 위한 연구(硏究) (A Study on the Removal of Silver in Copper Electrolyte)

  • 소순섭;안재우
    • 자원리싸이클링
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    • 제17권5호
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    • pp.60-65
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    • 2008
  • 고순도 동 제조를 위해 황산동 전해액중에 존재하는 은(Ag)을 제거하기 위한 기초연구를 실시하였다. 이온교환수지법, 활성탄 흡착법, 구리분말 및 세선을 이용한 치환법, CuS침전법 등을 이용하여 Ag제거에 대한 실험을 실시하였으며, 은(Ag)제거 반응에 영향을 미칠 수 있는 반응온도, 반응시간, 첨가량 등에 대해 고찰하였다. 이들 방법중 CuS 침전법과 Lewatit TP214를 이용한 이온교환수지 방법이 효과적이었는데 특히 Lewatit TP214를 사용한 경우 초기 동전해액중, Ag 농도가 10ppm서 0.1ppm 이하 수준까지 제거가 가능하였다.

구리/에폭시 계의 필 접착력 분석 (Peel Strength Analyses of Copper/Epoxy System)

  • 최광성;유진;이호영
    • 한국표면공학회지
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    • 제29권4호
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    • pp.238-252
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    • 1996
  • In order to study the effect of interface oxides on the adhesion strength of the copper/epoxy system, copper foils were immersed in black oxide or brown oxide forming solutions before lamination with epoxy prepregs, and variation of peel strength with the treatment time were investigated. Results showed that peel strength decreased rapidly up to 1 minute of treatment lime and remained constant in the case of the black oxide treated specimens, which was accompanied by the thickening of $Cu_2O$ at the Copper/Epoxy interface during the period. In contrast, peel strength increased rapidly up to 1 minute of treatment time and remained constant in the case of the brown oxide treated specimens, which could be ascribed to the thickening of CuO. Subsequent heat treatments of the Copper/Epoxy laminations at $120^{\circ}C$ in air showed that peel strength remained constant in the case of the black oxide treated specimens but decreased gradually in the case of the brown oxide treated specimens. Following XPS analyses revealed that the latter was possibly caused by the coalescence of CuO at the Copper/Epoxy interface into $Cu_2O$.

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Preparation of Copper Nanoparticles in Cellulose Acetate Polymer and the Reaction Chemistry of Copper Complexes in the Polymer

  • Shim, Il-Wun;Noh, Won-Tae;Kwon, Ji-Woon;Jo, Jung-Young;Kim, Kyung-Soo;Kang, Dong-Hee
    • Bulletin of the Korean Chemical Society
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    • 제23권4호
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    • pp.563-566
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    • 2002
  • Copper complexes have been directly incorporated into cellulose acetate (CA) and the resulting light blue colored homogeneous films of 5-20 wt.% copper acetate complex concentrations are found to be thermally stable up to 200 $^{\circ}C$. The reaction chem istry of Cu in CA has been investigated by reacting them with small gas molecules such as CO, H2, D2, O2, NO, and olefins in the temperature range of 25-160 $^{\circ}C$, and various Cu-hydride, -carbonyl, -nitrosyl, and olefin species coordinated to Cu sites in CA are characterized by IR and UV/Vis spectroscopic study. The reduction of Cu(II) complexes by reacting with H2 gas at the described conditions results in the formation of Cu2O and copper metal nanoparticles in CA, and their sizes in 30-120 nm range are found to be controlled by adjusting metal complex concentration in CA and/or the reduction reaction conditions. These small copper metal particles show various catalytic reactivity in hydrogenation of olefins and CH3CN; CO oxidation; and NO reduction reactions under relatively mild conditions.

구리⋅알킬암모늄화합물계 목재방부제 (ACQ) 유효성분의 목재 흡착 특성 (Adsorption Characteristics of Alkaline Copper Quat Preservative Components in Wood)

  • 이종신;최광식
    • Journal of the Korean Wood Science and Technology
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    • 제42권4호
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    • pp.491-498
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    • 2014
  • ACQ 목재 방부처리 현장에서 약액의 농도관리에 필요한 기초 자료를 얻기 위하여 ACQ 약액을 회수하여 재사용하는 과정에서 일어나는 약액의 농도 변화, 처리 목재의 약제 흡수량 그리고 Cu (CuO로써)와 DDAC의 유효성분 비율변화 등을 조사하였다. 목재 수종은 낙엽송, 미송, 라디에타소나무를 사용하여 조사하였다. ACQ 약액을 회수하여 재사용하는 과정에서 재사용 횟수가 증가함에 따라 약액의 농도는 감소하였으며, 농도 감소경향은 유효성분의 종류별로 다르게 나타나 Cu보다는 DDAC의 농도 감소가 크게 나타났다. Cu의 농도감소는 처리 수종에 크게 영향을 받지 않았으나, DDAC의 경우에는 약액 흡수가 많은 수종에서 농도 감소의 폭이 크게 나타났다. 약액의 재사용 횟수에 관계없이 Cu의 목재 흡수량은 일정한 수준을 유지하였으나 DDAC 흡수량은 재사용 횟수의 증가와 함께 지속적으로 감소하였다. 약액의 재사용 횟수의 증가로 DDAC 농도가 감소하면 Cu의 흡수량이 증가하였으며, 이것은 처리 목재 내 흡착반응 과정에서 경쟁 관계에 있는 DDAC의 양이 감소함에 따라 상대적으로 Cu의 흡착량이 많아지기 때문인 것으로 판단하였다.

동 도금 수세 폐수로부터 구리 분말 제조에 관한 연구 (A Study on the Manufacture of the Cu Powder from Electrochemical Recovery of Waste Rinse Water at the Cu Electroplating Process)

  • 김영석;한성호
    • 한국표면공학회지
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    • 제36권2호
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    • pp.194-199
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    • 2003
  • Polarization measurements were peformed to investigate the electrochemical behavior of copper ions and limiting current density in waste rinse water from copper electroplating processes. A newly designed cyclone type electrolyzer was tested to recover the copper powder. Synthetic solutions were prepared using analytical grade $CuSO_4$ to the desired waste water concentration and pH was adjusted with $H_2$$SO_4$. Electrowinning was peformed at room temperature and the solution was cycled with a pump. Results showed that more than 99 percent of Cu was recovered and the size of the recovered Cu powder ranges from 0.1 - $0.5\mu\textrm{m}$. The chemical composition of the Cu powder mainly consists of $Cu_2$O and Cu and can be easily reduced to pure Cu powder.

구리 프탈로시아닌 촉매의 VOCs 산화 특성 (Characteristics of VOCs Oxidation using Copper Phthalocyanine Catalysts)

  • 서성규;윤형선
    • 한국대기환경학회지
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    • 제20권4호
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    • pp.515-521
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    • 2004
  • The catalytic oxidation of volatile organic compounds (methanol. acetaldehyde) has been characterized using the copper phthalocyanine catalyst in a fixed bed flow reactor under atmospheric pressure. The catalytic activity for pretreatment conditions was examined by this reaction system. The catalytic activity was ordered as follows: metal free-PC<Cu ($\alpha$)-PC<Cu ($\beta$)-PC The formaldehyde, carbon monoxide as a partial oxidation product of methanol and acetaldehyde over Cu ($\alpha$)-PC catalyst were detected and the conversions of methanol and acetaldehyde were accomplished above 95% over Cu ($\alpha$) -PC, Cu ($\beta$) - PC catalyst at 35$0^{\circ}C$. The pretreated metal free -PC, Cu($\alpha$)-PC, Cu($\beta$)-PC catalysts have been characterised by TGA, EA and XRD analysis. The catalytic activity pretreated with air and $CH_3$OH mixture (P-4) or air only (P-5) was very excellent. XRD and EA results showed that Cu($\alpha$)-PC, Cu($\beta$)-PC were destroyed an(1 new metal oxide such as CuO were formed.

Mechanical and Antibacterial Properties of Copper-added Austenitic Stainless Steel (304L) by MIM

  • Nishiyabu, Kazuaki;Masai, Yoshikaze;Ishida, Masashi;Tanaka, Shigeo
    • 한국분말재료학회지
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    • 제9권4호
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    • pp.227-234
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    • 2002
  • For the austenitic stainless steel (304L) manufactured by metal injection molding(MIM), the effects of copper content and sintering temperature on the mechanical properties, antibacterial activities, corrosion resistance, and electric resistances were investigated. The specimens were prepared by injection molding of the premixed powders of water-atomized 304 L and Cu with poly-acetyl binders. The green compacts were prepared with various copper contents from 0 to 10 wt.% Cu, which were debound thermally at 873 K for 7.2 ks in $N_2$gas atmosphere and subsequently sintered at various temperatures from 1323 K to 1623 K for 7.2 ks in Ar gas atmosphere. The relative density and tensile strength of the sintered compacts showed the minimum values at 5 and 8 wt.% Cu, respectively. Both the relative density and the tensile strength of the specimen with 10 wt.% Cu sintered at 1373 K showed the highest values, higher than those of copper-free specimen. Antibacterial activities investigated by the plastic film contact printing method for bacilli and the quantitative analysis of copper ion dissolved in water increased as the increase of the copper content to stainless steels. It was also verified by the measurement of pitting potential that the copper addition in 304 L could improve the corrosion resistance. Furthermore the electric conductivity increased with the increase of copper content.