• Journal of the Korean Society for Geothermal and Hydrothermal Energy
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• v.16 no.3
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• pp.1-7
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• 2020

To provide a design direction for high efficiency thermoelectric module(TEM) dehumidifiers, the effects of design factors of TEM dehumidifiers on dehumidification energy efficiency and performance were numerically investigated. The design factors considered in this study are the TEM capacity, the performance of heat exchangers on the heating and cooling surfaces of the TEM. The higher capacity of the TEM results the higher dehumidification energy efficiency and performance at some operating voltage. The enhanced performance of the heat exchanger on heating surface increased the dehumidification energy efficiency and performance at all the operating voltage. The enhanced performance of the heat exchanger on cooling surface decreased the dehumidification energy efficiency and performance at all operating voltage.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.25 no.6
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• pp.799-803
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• 2001

Miniature heat pipe(MHP) with woven-wired wick was used to cool the CPU of a notebook PC. The pipe with circular cross-section was pressed and bent for packaging the MHP into a notebook PC with very limited compact packaging space. A cross-sectional area of the pipe is reduced about 30% as the MHP with 4mm diameter is pressed to 2mm thickness. In the present study a performance test has been performed in order to review varying of operating performance according to pressed thickness variation and heat dissipation capacity of MHP cooling module that is packaged on a notebook PC. New wick type was considered for overcoming low heat transfer limit when MHP is pressed to thin-plate. The limiting thickness or pressing is shown to be within the range of 2mm∼2.5mm through the performance test with varying the pressing thickness. When the wall thickness of 0.4mm is reduced to 0.25mm for minimizing conductive thermal resistance through the wall of heat pipe, heat transfer limit and thermal resistance of MHP were improved about 10%. In the meantime, it is shown that the thermal resistance and heat transfer limit for the MHP with central wick type are higher than those of MHP with existing wick types. The results of performance test for MHP cooling modules with woven-wired wick to cool a notebook PC shows the stability as cooling system since T(sub)j(Temperature of Processor Junction) satisfy a demand condition of 0∼100$\^{C}$ under 11.5W of CPU heat.

• Journal of the Korea Institute of Military Science and Technology
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• v.4 no.1
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• pp.264-273
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• 2001

The conjugate heat transfer from a protruding module in a horizontal channel with a variation of air temperature is experimentally investigated. It is an aim of this study is to estimate temperature difference between a module and air. This study is performed with a variation of parameters that are air temperatures($T_i,=25^{\circ}C{\sim}55^{\circ}C),$ thermal resistance($R_c=158 K/W),$ air velocities ( 4V_i=0.1$ m/s~l.5 m/s ), and input power (Q=3 W, 7 W ). The results show that as the thermal resistance increases, the effect of air temperatures are decreased. And input power was most effective parameter on the temperature difference between a module and air.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.85-86
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• 2005

In case of attaching thermoelectric module and heat source, the polymer sheet is attached on the $Al_2O_3$ plate, which is cooling side of thermoelectric module, in order to enhance mechanical safety of the system. It is impossible to calculate the exact distribution of temperature and flow pattern of inner gap of thermoelectric module. Therefore CFD analyses was executed to determine the thermo-fluid phenomena and distribution by Fluent. As the result of these analyses, heat transfer was dominated by conduction and the difference of temperature was linear distribution according to the thickness of polymer sheet.

• Proceedings of the SAREK Conference
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• 2006.06a
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• pp.976-981
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• 2006

In case of attaching thermoelectric module and heat source, the polymer pad is attached on the $Al_2O_3$ plate, which is cooling side of thermoelectric module, in order to enhance mechanical safety of the system. It is impossible to calculate the exact distribution of temperature and flow pattern of inner gap of thermoelectric module. Therefore CFD(Computational Fluid Dynamics) analysis was executed to determine the thermo-fluid phenomena and distribution by Fluent. As the result of these analysis, heat transfer was dominated by conduction and the difference of temperature was linear distribution according to the thickness of polymer sheet.

• The Transactions of the Korean Institute of Power Electronics
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• v.16 no.2
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• pp.173-181
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• 2011

This paper proposes photovoltaic thermal hybrid module to get the electrical and thermal performance of building integrated photovoltaic(BIPV) system. BIPV system is decreased the system efficiency because output of PV is decreased by the thermal rising on generating. In order to improve the efficiency of BIPV module, water cooling system is applied and generated thermal is used the warm water system. Water cooling system uses the flux control algorithm considering water temperature and power loss. Electrical and thermal performance of proposed photovoltaic thermal hybrid module is confirmed through the actual experiment and herby proved the valid of this paper.

• Proceedings of the KIPE Conference
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• 2010.07a
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• pp.95-96
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• 2010

This paper proposes photovoltaic thermal hybrid module to get the electrical and Thermal performance of building integrated photovoltaic(BIPV) system. BIPV system is decreased the system efficiency because output of PV is decreased by the thermal rising on generating. In order to improve the efficiency of BIPV module, water cooling system is applied and generated thermal is used the warm water system. Water cooling system uses the flux control algorithm considering water temperature and power loss. Electrical and thermal performance of proposed photovoltaic thermal hybrid module is confirmed through the actual experiment and herby proved the valid of this paper.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.11 no.1
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• pp.13-20
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• 2010

The development of the console for exterior advertizing LCD Panel(LCD Console) is the purpose of this study with regard to importance of display industry. In this study, the most important point is to develop the cooling system for LCD Console. It is developed by using systematic application techniques and statistical tests and analysis to integrate commercial components, cooling fan, heat sink, thermo electronic modules etc, of it. This study, at first, shows design/manufacturing process of the cooling system and the setting process of control factors to control through experimentation. Next, after constructing the complete console, 46 inch LCD Panel and the cooling system are built in, the performance test of it is shown through experimentation.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.9 no.4
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• pp.497-503
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• 1997

In the present study, the cooling package using the heat pipe has been developed to improve the thermal performance in the point of cooling characteristics of the electronic chip placed to the subrack being readily assembled and disassembled in ATM switching system. As the preliminary experiments, the cooling performances between a conventional way using a cooling fin and a proposed method applying the heat pipe are compared and analyzed. The cooling performance at a simulated electronic component packaging a heat pipe module is approximately achieved up to $5.0W/cm^2$ heat flux and the allowable temperature at the heated chip is sustained in the range within $70^{\circ}C$. From the results, it is confirmed that temperature oscillations are also settled by inserted wick in the evaporator section. From the user's viewpoint, the method to assemble and disassemble the heat pipe easily has been devised.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.22 no.6
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• pp.888-898
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• 1998

The present study investigated the effects of the experimental parameters on the cooling characteristics of the multichip module cooled by the indirect liquid cooling method using water and paraffin slurry. The experimental parameters are mass fraction of 2.5 ~ 7.5% for paraffin slurry, heat flux of 10 ~ 40 W/cm$^{2}$ for the simulated VLSI chips and Reynolds numbers of 5,300 ~ 15,900. The apparatus consisted of test section, paraffin slurry maker, pump, constant temperature baths, flowmeter, etc. The test section made of in-line, four-row array of 12 heat sources for simulating 4 * 3 multichip module which was flush mounted on the top wall of a horizontal rectangular channel with the aspect ratio of 0.2. The inlet temperature was 20 deg. C for all experiments. The size of paraffin slurry was constant as 10 ~ 40 .mu.m befor and after the experiment. The chip surface temperatures for paraffin slurry with the mass fraction of 7.5% showed lower by 16 deg. C than those for water when the heat flux is 40 W/cm$^{2}$. The local heat transfer coefficients for the paraffin slurry with the mass fraction of 7.5% were larger by 17 ~ 25% than those for water at the first and the fourth row. The local heat transfer coefficients reached to a row-number-independent, thermally fully developed value approximately after the third row. The local Nusselt numbers at the fourth row for paraffin slurry with the mass fraction of 7.5% were larger by 23 ~ 29% than those for water.