• Journal of the Microelectronics and Packaging Society
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• v.11 no.3 s.32
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• pp.83-89
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• 2004

NTC thermistor embedded miniature thermoelectric module was fabricated for the precise temperature control of optical communication device such as laser diode (LD). The miniature thermoelectric module ($7.2 mm{\times}9 mm{\times}2.2 mm$) consists of 21 BiTe thermoelectric couples, the operating temperature is precisely controlled by embedded thermistor with quick response. The figure-of-merit (Z), maximum temperature difference (${\Delta}T_{max}$), maximum cooling capacity ($Q_{max}$) of the miniature thermoelectric module were $2.5{\times}10^{-3}$/K, 72 K, 2.2 W respectively and temperature could be controlled in range of ${\pm}0.1^{\circ}C$ accuracy in air. The fabricated miniature thermoelectric module is suitable for applications of the optical communication packaging.

• Journal of Mechanical Science and Technology
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• v.17 no.7
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• pp.1063-1072
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• 2003

Direct immersion cooling has been considered as one of the promising methods to cool high power density chips. A fluorocarbon liquid such as FC-72, which is chemically and electrically compatible with microelectronic components, is known to be a proper coolant for direct immersion cooling. However, boiling in this dielectric fluid is characterized by its small value of the critical heat flux. In this experimental study, we tried to enhance the critical heat flux by increasing the nucleate boiling area in the heat spreader (Conductive Immersion Cooling Module). Heat nux of 2 MW/㎡ was successfully removed at the heat source temperature below 78$^{\circ}C$ in FC-72. Some modified boiling curves at high heat flux were obtained from these modules. Also, the concept of conduction path length is very important in enhancing the critical heat flux by increasing the heat spreader surface area where nucleate boiling occurs.

• 한국태양에너지학회:학술대회논문집
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• 2012.03a
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• pp.248-254
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• 2012

In the situation of expanding domestic solar power supply business long-term performance modeling of a proposed solar-cooling and cleaning system to increase electromotive force and light transmission is carried out to test the effectiveness of the system. To test the effectiveness of the system, the data which comparing the solar power planet installing the system to not installing at the same time is used. A difference between the utilization factor of each comparison group were recorded. Approximately from one year to two years Field Test was performed, Result of apply to cooling/cleaning technology, Each of plant by From least 7 percent up to 16 percent utilization factor increased, and the cooling / cleaning is output through improved as a result of the determined.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.26 no.7
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• pp.1022-1030
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• 2002

The experiments were performed with a $31{\times}31{\times}7mm^3$ simulated 3-dimensional module on the thermal conductive board of a parallel plate channel. The convective thermal conductance for the path from the module surface directly to airflow and conjugate thermal conductance for the path leading from the module to the floor by way of a module support, then, to the airflow were determined with several combinations of module-support-construction(210, 0.32, 0.021 K/W)/floor-material(398, 0.236W/mK) and channel height(15-30mm). As the result, it was found that the conjugate thermal conductance and the temperature distribution around the module depend on the thermal resistance of the module support, and the channel height. These configurations were designed to investigate on the feasibility of using the substrate as an effective heat spreader in the forced convective air-cooling of surface mounted heat source. The experimental results were discussed in the light of interactive nature of heat transfer through two paths, one directed from the module to the airflow and the other via the module support and the floor to the air.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.8
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• pp.5074-5081
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• 2015

A method for improving the warpage of the plastic part is a method of removing residual stress of the plastic product. that a non-uniform cooling are appeared in the injection molding process make uniform cooling. this study was developed the Rapid heating and cooling device used peltier module for uniform cooling. Make the Rapid heating and cooling device(RCHD), for Traditional water cooling device(TWCD) method and the Rapid heating and cooling method warpage were compared and were analyzed and the materials used amorphous ABS polymer. various warpage were compared for the process parameters such as packing pressure, packing time, resin temperature, mold temperature, In the amorphous ABS polymer, TWCD method has higher warpage than RCHD method and show the result to be a bit more uniform cooling. The distribution state of the ABS polymer was confirmed Through the Scanning electron microscope. In the TWCD method the distribution state of the polymer be densely distributed, and RCHS method be distributed wider than TWCD method. this is that injection molded parts be seen that cooling was made uniformly, As the temperature of the mold is gradually progress, Particles of the polymer is increased this is that internal stress was reduced.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.28 no.6
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• pp.774-782
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• 2004

This article presents a numerical and experimental investigation for the single-phase forced laminar convective heat transfer through arrays of micro-channels in micro heat exchangers to be used for cooling power-intensive semiconductor packages, especially the stacked multi-chip modules. In the numerical analysis, a parametric study was carried out for the parameters affecting the efficiency of heat transfer in the flow of coolants through parallel rectangular micro-channels. In the experimental study, the cooling performance of the micro heat exchanger was tested on prototypes of stacked multi-chip modules with difference channel dimensions. The simulation results and the experiment data were acceptably accordant within a wide range of design variations, suggesting the numerical procedure as a useful method for designing the cooling mechanism in stacked multi-chip packages and similar electronic applications.

• International Journal of Air-Conditioning and Refrigeration
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• v.9 no.1
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• pp.1-10
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• 2001

The present study investigated the effects of experimental parameters on the thermal characteristics of an in-line 6x1 array of discrete heat sources for a test multichip module using water, PF-5060 and paraffin slurry. The parameters were heat flux of 10-40W/$cm^2$. Reynolds number of 3,000~20,000 and mass fraction up to 10% for paraffin slurry The size of paraffin slurry was within 10~40$\mu$m before and after experiments. The local heat transfer coefficients for the paraffin slurry were larger than those for water. Thermally fully developed conditions were observed after the third or fourth row (five or seven times of the chip length) and the paraffin slurry showed effective cooling performance at the high heat flux The paraffin slurry with the mass fraction of 5% showed the most efficient cooling performance when the heat transfer and the pressure drop in the test section are considered simultaneously. The experimental data at the fourth and sixth rows are best agreed with the values predicted by the Malina and Sparrow`s correlation among other correlations, and the empirical correlations for water and 5% paraffin slurry were obtained at the first and sixth rows when the channel Reynolds number is over 3,000.

• The Journal of the Korea institute of electronic communication sciences
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• v.7 no.6
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• pp.1437-1442
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• 2012

The contemporary peoples focus on treatment of obesity in order to prevent the adult disease and to manage the beauty. Although surgical treatment of obesity shows the reliable cure effect, it could cause side effects and has a disadvantage that postoperative recovery period is long. Accordingly, this paper compares and analyzes the non-operative treatments which can be of help to treat obesity. Also, it considers the obesity therapy based on the Peltier cooling system. And finally a basic control circuit based on Peltier module is designed for Peltier cooling-based obesity therapy system.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.11 no.2
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• pp.224-235
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• 1999

The present study investigated the effects of the experimental parameters on the cooling characteristics of the multichip module cooled by the indirect liquid cooling method using water, PF-5060, and paraffin slurry. The experimental parameters were coolants including Paraffin slurry with mass fraction of 2.5~7.5%, heat flux of 10~40W/$\textrm{cm}^2$ for the simulated VLSI chips and Reynolds numbers of 3,000~20,000. The size of paraffin slurry was constant as 10~40${\mu}{\textrm}{m}$ before and after the experiment. The chip surface temperatures for paraffin slurry were lower than those for water and PF-5060. The local heat transfer coefficients for the paraffin slurry were larger than those for water and the local heat transfer coefficients reached a row-number-independent and thermally-fully-developed value approximately after the third row. The local Nusselt numbers for paraffin slurry with a mass fraction of 7.5% were larger by 20~38% than those for water. The paraffin slurry with a mass fraction of 5% shelved the best thermal and hydrodynamic characteristics when local heat transfer and pressure drop were considered simultaneously.

• Proceedings of the KSME Conference
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• 2007.05b
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• pp.2444-2448
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• 2007

The multi channel of DDI which is the core part of the LCD-TV has been propelled. When multi channel in DDI is introduced, it brings a thermal problem because of the increased power. To solve the thermal problem of the DDI it needs to be investigated each at the package level and module level. It is important to extract the junction temperature(Tj) of DDI clearly from the system level. The objective of this research is to construct a compact model. The compact model is to reduce LCD module including DDI. When the compact model is used, it will be able to easily handle the boundary condition and accurately predict the temperature. Consequently, the temperature of DDI can be calculated easily at the system level. Through this research,we also proposed the cooling plan of DDI for a protection of overheating. The cooling plan was utilized in DDI design.