• Journal of Institute of Convergence Technology
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• v.1 no.1
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• pp.5-8
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• 2011

Thermal analysis of a cooling module using Peltier elements are performed using a commercial software, CFD-ACE+. A standard k-e two-equation turbulent model is applied in order to represent the turbulent shear stress. Computed values are compared with the theoretical values for the validation. The effect of mass flow rates and transferred heat amounts on the temperature distributions inside the cooling system is analyzed. It was found that the increase in the mass flow rates causes the exit temperature rise. The increase in the absorbed heat amount diminished the overall temperature on the fin surfaces. In the present analysis, the material characteristics of the Peltier element itself are not considered. In the future, the effect of the turbulence models and material characteristics will be studied in detail.

• Journal of Mechanical Science and Technology
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• v.14 no.9
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• pp.997-1004
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• 2000

The experiments were conducted by using water and paraffin slurry to investigate the effect of a chip spacing in the multichip module on the cooling characteristics from an in-line $4{\times}3$ array of discrete heat sources which were flush mounted on the top wall of a channel. The experimental parameters were chip spacing in a multichip module, heat flux of simulated VLSI chip, mass fraction of paraffin slurry, and channel Reynolds number. The removable heat flux at the same chip surface temperature decreased as the chip spacing decreased at the first and fourth rows. The local heat transfer coefficients for the paraffin slurry were larger than those for water, and the chip spacing on the local heat transfer coefficients for paraffin slurry influenced less than that for water. The enhancement factor for paraffin slurry showed the largest value at a mass fraction of 5% regardless of the chip spacing, and the enhancement factors increased as the chip spacing decreased. This means that the paraffin slurry is more effective than water for cooling of the highly integrated multichip module.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.20 no.1
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• pp.199-204
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• 2020

In case of the silicon solar panel being used in Korea, the production specification is designed to give maximum output at the limit of -0.5 to 0.05℃, so the output of 0.45~0.55% decreases when the temperature rises by 1℃. As a result, the photovoltaic power generation is reduced according to the surface temperature rise of the photovoltaic module due to the characteristics of the solar cell. The decrease in output reduces the efficiency of photovoltaic power generation, and if the efficiency decreases, the result is that the profit of electricity sales according to the amount of photovoltaic power generation decreases. Therefore, this paper proposes a method of spraying cooling air to the lower (or surrounding) of the photovoltaic module when it is identified above the set temperature by the temperature detection sensor. In addition, the amount of power generated is increased by utilizing the lost solar energy, and by applying cooling function through cooling air, the power generation can be further increased.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.23 no.6
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• pp.421-429
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• 2011

Experimental and theoretical studies on cooling performance of two-channel thermoelectric air-cooling system in parallel flow are conducted. The effects of operating temperature to physical properties of thermoelectric module (TEM) are experimentally examined and used in the analysis of an air-cooling system considering thermal network and energy balance. The theoretical predicted temperature variation and cooling capacity are in good agreement with measured data, thereby validating analytic model. The heat absorbed rate increases with increasing the voltage input and decreasing thermal resistance of the system. The power consumption of TEM is linearly proportional to mean temperature differences due to variations of the physical properties on operation temperature of TEM. Furthermore thermal resistance of hot side has greater effects on cooling performance than that of cold side.

• Korean Journal of Air-Conditioning and Refrigeration Engineering
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• v.22 no.3
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• pp.171-179
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• 2010

Thermal performance of louver fin and plate fin in a thermoelectric cooling system with a duct-flow type fan arrangement is analytically evaluated. The thermoelectric cooling system consists of a thermoelectric module and two heat exchanger fins. The analytic results show that the optimized louver fin has lower thermal resistance than plate fin. The COP and heat absorbed rate of the thermoelectric cooling system with optimized louver fins are 10.3% and 5.8% higher than optimized plate fins, respectively.

• Transactions of the Korean Society of Mechanical Engineers
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• v.18 no.10
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• pp.2751-2761
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• 1994

A numerical investigation on the three-dimensional laminar natural convection heat transfer in the periodically fully developed PCB channel has been performed. When heat generating blocks mounted on the adiabatic wall make a channel with their facing shrouding wall, the flow inside the channel becomes periodically fully developed. A single module in the periodically fully developed region is chosen for computational domain in order to save computer storage and computational time. The periodic boundary condition is applied in the anlaysis. The effects of the parameters such as the Rayleigh number, the number of the modules, and the height of channel are examined to obtain the optimum condition for the enhancement of the cooling effectiveness. The result shows that the cooling effect is improved with increasing Rayleigh number and channel height, and decreasing the number of the module. The result also indicates that increasing the height of the channel and number of the module is recommended for a limited space.

• Journal of the Korean Society for Geothermal and Hydrothermal Energy
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• v.14 no.3
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• pp.29-34
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• 2018

To present the design direction of the thermoelectric module (TEM) refrigerator, analysis of the effect of the design parameters on the energy efficiency and performance of the refrigerator is performed. The design parameters considered are the cooling capacity of the TEM and the heat transfer performance of the heating and cooling surface of the TEM. The heat transfer performance is the most effective design parameter for improving cooling power. The smaller ΔT and cooling capacity of the TEM make the higher efficiency of the refrigerator.

• Transactions of the Korean Society of Automotive Engineers
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• v.22 no.2
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• pp.1-6
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• 2014

In-wheel driving inverter inside engine room sometimes operates in the harsh environment like high temperature of about $105^{\circ}C$. Especially, the size and power density of the inverter has become smaller and more increased. Thus, it is essential to manage the temperature of the inverter with IGBT (Insulated Gate Bipolar Transistor) switching devices for performance and endurance, because the temperature can be getting increase. In this paper, we performed the thermal flow analysis of inverter models with wave type and pin fin type cooling channels, and investigated the heat transfer characteristics of the inverter models using cooling water on channels at 8 L/min and $65^{\circ}C$. Also, we compared the thermal performance under various conditions such as coolant flow rate and layered power module structure. Therefore, we determined the feasibility of the initial inverter models and the thermal performance enhancement.

• Journal of the Korean Electrochemical Society
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• v.14 no.4
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• pp.253-260
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• 2011

In this study, computational simulation was performed for thermal management of modules consisting of 10 batteries. Simplified structure and equivalent thermal resistance network was applied to maintain the thermal properties. Verification test of the mesh were in progress to ensure the reliability of 2.6 mm in the narrow gap between the battery, resulting in at least three divided mesh between the shape of the grid was required. Type of air from rear of the module, type of air from top of the module and type of air from bottom of the module were applied and effective cooling methods are discussed based on the location of fan and air intake of the modules. Maximum temperature and temperature differences of modules that directly affect the performance of the module were compared, and also behavior of the fluid was confirmed by comparing the air flow. The best maximum temperature is shown type of air from bottom of the module to $40.27^{\circ}C$ and type of air from top of the module shows smallest temperature difference $0.73^{\circ}C$.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.15 no.7
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• pp.4072-4080
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• 2014

The Peltier Module has been used to dissipate the heat from electronic devices and electronic components. In this module, a heat sink is used to release the operating heat into the air outside. This study addressed the heat transfer characteristics for a heat sink with an inner tunnel. Under forced and natural convection conditions, the heat transfer characteristics were different. Therefore, the cooling and heating performances were studied for the heat sink, which has an inner tunnel. The heat transfer conditions were also evaluated by performing an experimental test, which investigated the heat transfer characteristics related to the variance in time and temperature distribution. Experiments on the heat transfer characteristics of the heat sink were conducted based on the forced and natural convection and temperature distribution changes. In the cooling experiment, the A- and B-shaped cooling pin heat sinks decreased the temperature of the forced convection than the temperature of natural convection. In the forced and natural convection, the A- and B-shaped decreased to a minimum of $-15^{\circ}C$. Under the forced and natural convection conditions, A- and B-shaped cooling pin heat sinks decreased the temperature when the voltage was increased. In the heating experiment, the A- and B-shaped cooling pin heat sinks increased the temperature of the forced convection than the temperature of natural convection. In forced convection, when the voltage was $15^{\circ}C$, the temperature of the A-shaped cooling pin heat sink increased to $150^{\circ}C$, and the temperature of the B-shaped cooling pin heat sink increased to $145^{\circ}C$. Under forced and natural convection conditions, the A- and B-shaped cooling pin heat sinks showed an increase in temperature with increasing voltage.