• 마이크로전자및패키징학회지
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• 제11권3호
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• pp.83-89
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• 2004

NTC 써미스터를 내장시킨 소형의 열전 냉각 모듈을 제작하고 LD와 같은 광통신부품에 적용하기 위한 온도제어 및 항온유지 특성을 분석하였다 BiTe계 열전반도체 21쌍으로 구성된 열전 모듈은 크기 $7.2 mm{\times}9 mm{\times}2.2 mm$이고, 내장된 써미스터의 빠른 응답속도로 인해 정밀온도제어가 가능하다. 열전 모듈은 성능 지수(Z) $2.5{\times}10^{-3}$/K, 300 K에서 최대 온도차(${\Delta}T_{max}$) 72 K, 최대 흡열량($Q_{max}$) 2.2W 값을 나타내었으며 온도 제어 정밀도는 대기 중에서 ${\pm}0.1^{\circ}C$내였다. 이는 광통신 부품의 작동 환경 안정성을 확보할 수 있는 항온제어용 소형 열전 모듈로서 적용이 가능하다.

• Journal of Mechanical Science and Technology
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• 제17권7호
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• pp.1063-1072
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• 2003

Direct immersion cooling has been considered as one of the promising methods to cool high power density chips. A fluorocarbon liquid such as FC-72, which is chemically and electrically compatible with microelectronic components, is known to be a proper coolant for direct immersion cooling. However, boiling in this dielectric fluid is characterized by its small value of the critical heat flux. In this experimental study, we tried to enhance the critical heat flux by increasing the nucleate boiling area in the heat spreader (Conductive Immersion Cooling Module). Heat nux of 2 MW/㎡ was successfully removed at the heat source temperature below 78$^{\circ}C$ in FC-72. Some modified boiling curves at high heat flux were obtained from these modules. Also, the concept of conduction path length is very important in enhancing the critical heat flux by increasing the heat spreader surface area where nucleate boiling occurs.

• 한국태양에너지학회:학술대회논문집
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• 한국태양에너지학회 2012년도 춘계학술발표대회 논문집
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• pp.248-254
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• 2012

In the situation of expanding domestic solar power supply business long-term performance modeling of a proposed solar-cooling and cleaning system to increase electromotive force and light transmission is carried out to test the effectiveness of the system. To test the effectiveness of the system, the data which comparing the solar power planet installing the system to not installing at the same time is used. A difference between the utilization factor of each comparison group were recorded. Approximately from one year to two years Field Test was performed, Result of apply to cooling/cleaning technology, Each of plant by From least 7 percent up to 16 percent utilization factor increased, and the cooling / cleaning is output through improved as a result of the determined.

• 대한기계학회논문집B
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• 제26권7호
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• pp.1022-1030
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• 2002

The experiments were performed with a $31{\times}31{\times}7mm^3$ simulated 3-dimensional module on the thermal conductive board of a parallel plate channel. The convective thermal conductance for the path from the module surface directly to airflow and conjugate thermal conductance for the path leading from the module to the floor by way of a module support, then, to the airflow were determined with several combinations of module-support-construction(210, 0.32, 0.021 K/W)/floor-material(398, 0.236W/mK) and channel height(15-30mm). As the result, it was found that the conjugate thermal conductance and the temperature distribution around the module depend on the thermal resistance of the module support, and the channel height. These configurations were designed to investigate on the feasibility of using the substrate as an effective heat spreader in the forced convective air-cooling of surface mounted heat source. The experimental results were discussed in the light of interactive nature of heat transfer through two paths, one directed from the module to the airflow and the other via the module support and the floor to the air.

• 한국산학기술학회논문지
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• 제16권8호
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• pp.5074-5081
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• 2015

플라스틱 제품의 휨을 개선하기 위한 방법은 사출성형 공정에서 일어나는 불균일한 냉각을 균일하게 만들어 플라스틱 제품의 잔류응력을 제거하는 방법이다. 본 연구는 균일한 냉각을 위하여 펠티에 소자를 사용하여 급속가열 냉각 장치를 개발하였다. 급속냉각 가열 장치(RCHD)를 제작하여 전통적인 수냉 장치(TWCD)방식과 급속냉각 가열 장치방식에 따른 휨을 비교 분석하였고, 비결정성 수지인 ABS 수지를 사용하였다. 사출성형 조건인 보압시간, 금형온도, 냉각시간, 보압에 따라 휨의 변화량을 측정 비교하였고, 비결정성 ABS 수지에서 급속가열 냉각 장치 냉각방식이 전통적인 수냉방식 보다 휨이 더 적게 발생하고, 위의 결과들로 보아 조금 더 균일하게 냉각되는 것을 알 수 있었다. ABS 폴리머의 분포 상태를 SEM 사진을 통해서 확인하였다. 전통적인 수냉방식은 폴리머의 분포상태가 조밀하게 분포되어 있고, 급속냉각 가열 방식은 전통적인 수냉방식 보다 넓게 분포되어 있었다. 이것은 냉각이 균일하게 이루어지고, 금형의 온도가 서서히 진행되면서 폴리머의 입자가 커지게 되는데, 이것은 내부응력이 줄어든 것을 의미한다.

• 대한기계학회논문집A
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• 제28권6호
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• pp.774-782
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• 2004

This article presents a numerical and experimental investigation for the single-phase forced laminar convective heat transfer through arrays of micro-channels in micro heat exchangers to be used for cooling power-intensive semiconductor packages, especially the stacked multi-chip modules. In the numerical analysis, a parametric study was carried out for the parameters affecting the efficiency of heat transfer in the flow of coolants through parallel rectangular micro-channels. In the experimental study, the cooling performance of the micro heat exchanger was tested on prototypes of stacked multi-chip modules with difference channel dimensions. The simulation results and the experiment data were acceptably accordant within a wide range of design variations, suggesting the numerical procedure as a useful method for designing the cooling mechanism in stacked multi-chip packages and similar electronic applications.

• International Journal of Air-Conditioning and Refrigeration
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• 제9권1호
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• pp.1-10
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• 2001

The present study investigated the effects of experimental parameters on the thermal characteristics of an in-line 6x1 array of discrete heat sources for a test multichip module using water, PF-5060 and paraffin slurry. The parameters were heat flux of 10-40W/$cm^2$. Reynolds number of 3,000~20,000 and mass fraction up to 10% for paraffin slurry The size of paraffin slurry was within 10~40$\mu$m before and after experiments. The local heat transfer coefficients for the paraffin slurry were larger than those for water. Thermally fully developed conditions were observed after the third or fourth row (five or seven times of the chip length) and the paraffin slurry showed effective cooling performance at the high heat flux The paraffin slurry with the mass fraction of 5% showed the most efficient cooling performance when the heat transfer and the pressure drop in the test section are considered simultaneously. The experimental data at the fourth and sixth rows are best agreed with the values predicted by the Malina and Sparrow`s correlation among other correlations, and the empirical correlations for water and 5% paraffin slurry were obtained at the first and sixth rows when the channel Reynolds number is over 3,000.

• 한국전자통신학회논문지
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• 제7권6호
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• pp.1437-1442
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• 2012

현대인들에게 있어 지방제거는 성인병 예방 및 미용 측면에서 큰 관심사항이지만, 지방흡입술 등 수술적 방법은 치료효과가 확실한 반면, 심각한 부작용을 초래할 수 있고, 회복기간이 길다는 단점이 있다. 따라서 본 연구에서는 현대인들의 비만 제거에 도움이 될 수 있는 비수술적 치료법들을 비교, 분석하고 최근 각광받고 있는 열전냉각 기반 치료법을 고찰한다. 그리고 최종적으로 열전냉각 비만 치료를 위한 열전냉각 기본 제어회로를 설계한 후, 가정된 히트로드에 대해 열전냉각 장치를 설계한다.

• 설비공학논문집
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• 제11권2호
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• pp.224-235
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• 1999

The present study investigated the effects of the experimental parameters on the cooling characteristics of the multichip module cooled by the indirect liquid cooling method using water, PF-5060, and paraffin slurry. The experimental parameters were coolants including Paraffin slurry with mass fraction of 2.5~7.5%, heat flux of 10~40W/$\textrm{cm}^2$ for the simulated VLSI chips and Reynolds numbers of 3,000~20,000. The size of paraffin slurry was constant as 10~40${\mu}{\textrm}{m}$ before and after the experiment. The chip surface temperatures for paraffin slurry were lower than those for water and PF-5060. The local heat transfer coefficients for the paraffin slurry were larger than those for water and the local heat transfer coefficients reached a row-number-independent and thermally-fully-developed value approximately after the third row. The local Nusselt numbers for paraffin slurry with a mass fraction of 7.5% were larger by 20~38% than those for water. The paraffin slurry with a mass fraction of 5% shelved the best thermal and hydrodynamic characteristics when local heat transfer and pressure drop were considered simultaneously.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.2444-2448
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• 2007

The multi channel of DDI which is the core part of the LCD-TV has been propelled. When multi channel in DDI is introduced, it brings a thermal problem because of the increased power. To solve the thermal problem of the DDI it needs to be investigated each at the package level and module level. It is important to extract the junction temperature(Tj) of DDI clearly from the system level. The objective of this research is to construct a compact model. The compact model is to reduce LCD module including DDI. When the compact model is used, it will be able to easily handle the boundary condition and accurately predict the temperature. Consequently, the temperature of DDI can be calculated easily at the system level. Through this research,we also proposed the cooling plan of DDI for a protection of overheating. The cooling plan was utilized in DDI design.