• Progress in Superconductivity and Cryogenics
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• v.6 no.4
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• pp.27-31
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• 2004

This paper describes the development and fabrication of a high temperature superconducting motor which consists of HTS rotor and air-core stator. The machine was designed for the rated power of 100hp at 1800 rpm. The HTS field windings are composed of the double-pancake coils wound with AMSC's SUS-reinforced Bi-2223 tape conductor. These were assembled on the support structure and fixed by a bandage of glass-fiber composite. The cooling system is based on the heat transfer mechanism of the thermosyphon by using GM cryocooler as cooling source. The cold head is in contact with the condenser of a Ne-filled thermosyphon. The rotor assembly was tested independently at the stationary state and combined with stator. Characteristic parameters such as reactances, inductances, and time constants were determined to obtain a consistent overview of the machine operation properties. This motor has met all design parameters by demonstrating HTS field winding, cryogenic refrigeration systems and an air-core armature winding cooled with air. The HTS field winding could be cooled down below 30K. No-load test of open-circuit characteristics(OCC) and short-circuit characteristics(SCC) and load test with resistive load bank were conducted in generator mode. Maximum operating current of field winding at 30K was 120A. From OCC and SCC test results synchronous inductance and synchronous reactance were 2.4mH, 0.49pu, respectively. Efficiency of this HTS machine was 93.3% in full load(100hp) test. This paper will present design, construction, and basic experimental test results of the 100hp HTS machine.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.2004-2006
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• 1996

A thermally driven polysilicon micro actuator has been fabricated using surface micromachining techniques. It consists of P-doped polysilicon as a structural layer and TEOS (tetracthylorthosilicate) as a sacrificial layer. The polysilicon was annealed for the relaxation of residual stress which is the main cause to its deformation such as bending and buckling. And the newly developed HF VPE (vapor phase etching) process was also used as an effective release method for the elimination of sacrificial TEOS layer. The thickneas of polysilicon is $2{\mu}m$ and the lengths of active and passive polysilicon cantilevers are $500{\mu}m$ and $260{\mu}m$, respectively. The actuation is incurred by die thermal expansion due to the current flow in the active polysilicon cantilever, which motion is amplified by lever mechanism. The moving distance of polysilicon micro actuator was experimentally conformed as large as $21{\mu}m$ at the input voltage level of 10V and 50Hz square wave. The actuating characteristics are investigated by simulating the phenomena of heat transfer and thermal expansion in the polysilicon layer. The displacement of actuator is analyzed to be proportional to the square of input voltage. These micro actuator technology can be utilized for the fabrication of MEMS (microelectromechanical system) such as micro relay, which requires large displacement or contact force but relatively slow response.

• Journal of the Korean Society of Safety
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• v.28 no.4
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• pp.38-42
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• 2013

This study performed the quantitative distribution analysis of created voids to an insulator when applying general flame and DC short-circuit current to 2.5 $mm^2$ HIV (600 V Grade Heat-Resistant Polyvinyl Chloride Insulated Wires). The diameter of cross-section of HIV normal product and the radius of conductor were measured to be 3.3 mm and 1.8 mm. The exterior of HIV exposed to general flame showed severe carbonization and its interior exhibited voids created by dechlorination reaction. This study observed the characteristics that, when the shortcircuit current applied for 2 seconds from a DC 12 V lead battery, the conductor and neighboring insulator were melted, causing the insulator adhering to the conductor. On average, 87 voids were created on 10 mm of the HIV. The average diameter of voids was 0.25 mm. In addition, it was found that, when the short-circuit current applied for 4 seconds, the interior of insulator in contact with conductor severely carbonized and showed exfoliation phenomenon. On average, 47 voids were created, with more voids at the bottom. The average diameter of voids was 0.20 mm. When the short-circuit current for 6 seconds, most parts of upper part of conductor was carbonized, 20 voids were created. The average diameter of voids was measured to be 0.24 mm. It could be seen that the created voids received little influence by the type of energy source and the number of created voids was reduced as the energy supply time increased.

• Journal of Advanced Marine Engineering and Technology
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• v.39 no.9
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• pp.940-946
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• 2015

In this paper, we study a method that amplifies the output gain of a high voltage pulse using 300 kHz or higher frequency. We conducted a study on a method for amplifying the output gain using the resonance between the capacitance components of the load and the parasitic components of the circuit, instead of the conservative method for amplifying the pulse-amplitude by raising the voltage of the power stage. In particular, the method simplifies the circuit configuration throughout the appliance of flyback-type topology instead of the bridge-type. There are advantages that prevent damage from overload and the heat in the output circuit through the hard switching by amplifying the gain of the output voltage applying to the load as given by the capacitance component of the output electrode to the output pulse waveform. This study proposed a method to enhance the spatial and electrical efficiency of the contact-type heating device through the dielectric heating method applied to the field of medical and industrial heating.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.429.2-429.2
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• 2014

ZnO nanowire is known as synthesizable and good mechanical properties. And, stimuli-responsive polymer is widely used in the application of tunable sensing device. So, we combined these characteristics to make precise tunable sensing devise. In this work, we investigate the dependence of ZnO nanowire alignment and morphology on si substrate using nanosphere template with various conditions via hydrothermal process. Also, pH-temperature dependant tuning ability of nanostructure was studied. The brief experimental scheme is as follow. First, Zno seed layer was coated on a si wafer ($20{\times}20mm$) by spin coater. And then $1.15{\mu}m$ sized close-packed PS nanospheres were formed on a cleaned si substrate by using gas-liquid-solid interfacial self-assembly method. After that, zinc oxide nanowires were synthesized using hydrothermal method. Before the wire growth, to specify the growth site, heat treatment was performed. Finally, NIPAM(N-Isopropylacrylamide) was coated onto as-fabricated nanostructure and irradiated by UV light to form the PNIPAM network. The morphology, structures and optical properties are investigated by FE-SEM(Field Emission Scanning electron Microscopy), XRD(X-ray diffraction), OM(Optical microscopy), and WCA(water contact angle).

• Membrane Journal
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• v.16 no.2
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• pp.153-158
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• 2006

The crosslinked poly(vinyl alcohol) (PVA) mwmbranes with poly(styrene sulfonic acid-co-maleic acid) (PSSA-MA) were used to measure the water vapor and air permeabilities at 25 and $35^{\circ}C$. In addition, the contact angles of crosslinked PVA membranes were observed and increased with PSSA-MA contents. The water vapor permeability of 15300 Baller (1 Baller=$10^{-10}cm^3(STP){\cdot}cm/cm^2{\cdot}s{\cdot}cmHg$) was shown the maximum value at $35^{\circ}C$ when PSSA-MA=7 wt% membrane was used. The gas permeability of 146 Barrer was indicated the maximum at PSSA-MA=7 wt% at $35^{\circ}C$ and $P(H_2O)/P(Air)$ was the highest value 109.2 at $25^{\circ}C$.

• Korean Journal of Materials Research
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• v.9 no.2
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• pp.173-180
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• 1999

Thermally evaporated ZnTe films were investigated as a back contact material for CdS/CdTe solar cells. Two deposition methods, coevaporation and double-layer methods, were used for Cu doping in ZnTe films. ZnTe layers (0.2$\mu\textrm{m}$ thick) were deposited either on glass or on CdS/CdTe substrates without intentional heating of the substrates. Post-deposition annealing was performed at 200,300 and $400^{\circ}C$ for 3,6 and 9 minutes, respectively. Band gap of 2.2eV was measured for both undoped and doped films and a slight change in the shape of absorption spectra was observed in Cu-doped samples after annealing at $400^{\circ}C$. The resistivity of as-deposited ZnTe decreased from 10\ulcorner~10\ulcornerΩcm down to 10\ulcornerΩcm as Cu concentration increased from 0 to 14 at.%. There was not a noticeable change in less of annealing temperature up to $300^{\circ}C$ whereas films annealed at $400^{\circ}C$ revealed hexagonal (101) orientations as well. Some of Cu-doped ZnTe revealed x-ray diffraction (XRD) peaks related with Cu\ulcornerTe(x=1.75~2). Grain growth was observed from about 20nm in as-deposited films to 50nm after annealing at $400^{\circ}C$ by scanning electron microscopy (SEM). Cu distribution in ZnTe films was not uniform according to Auger electron spectroscopy (AES) measurements.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.5 no.2
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• pp.42-58
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• 1999

Packaging materials and articles that are used in food contact applications can transfer constituents in the foodstuffs. This kind of risk of possible health hazards to consumers has been generally recognized for a long time with the consequence of establishing corresponding food regulations in most developed countries. However, the language of these laws, their interpretation, and their level of enforcement vary from country to country. Accordingly, the actual migrating levels from packaging materials can be varied depending on the migration testing methods as prescribed in the national legislation in each countries. Therefore, there are needs of elimination of non-tariff trade barriers raised by sanitary and phytosanitary or technical measures under the Final Act of the UR Agreement. In this connection, the EU and USA are currently in an ongoing process of legislation harmonization to overcome potential barriers to free trade. In general, regulations governing component transfer in the USA are more complicated and comprehensive than similar regulations in Europe. In future, standard migration testing procedures for microwave heat susceptor materials and for the use of fatty food simulant should be established and also harmonized among countries. The objective of this investigation is to compare the current regulations for migration testing for plastic containers and packaging materials in USA, EU and Korea or Japan. For those regulations, Korean standards are required to be kept up with the international standards. By doing this, the related Korean regulation could be amended along with the worldwide progress for harmonization.

• Tribology and Lubricants
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• v.36 no.5
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• pp.267-273
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• 2020

This study experimentally investigates hydrophobic surfaces fabricated via additive manufacturing. Additive manufacturing, commonly known as 3D printing, is the process of joining materials to fabricate parts from 3D model data, usually in a layer-upon-layer manner. Digital light processing is used to fabricate hydrophobic surfaces in this study. This method uses photo-curable resins and ultraviolet (UV) sources. Moreover, this technique generally has faster shaping speeds and is advantageous for the fabrication of small components because it enables the fabrication of one layer at a time. Two photo-curable resins with different compositions are used to fabricate micro-patterns of hydrophobic surfaces. The resins are composed of a photo-initiator, monomer, and oligomer. Experiments are conducted to determine suitable process conditions for the fabrication of hydrophobic surfaces depending on the type of resin. The most important factors affecting the process conditions are the UV exposure time and slice thickness. The fabrication capability according to the process conditions is evaluated using the side and top views of the micro-patterns observed using a microscope. The micro-patterns are collapsed and intertwined when the exposure time is short because sufficient light (heat) is not applied to cure the photo-curable resin with a given slice thickness. On the other hand, the micro-patterns are attached to each other when the exposure time is prolonged because the over-curing time can cure the periphery of a given shape. When the slice is thicker, the additional curing area is enlarged in each slice owing to the straightness of UV light, and the slice surface becomes rough.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2002.10a
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• pp.1033-1036
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• 2002

Wafer bonding methods such as fusion and anodic bonding suffer from high temperature treatment, long processing time, and possible damage to the micro-scale sensor or actuators. In the localized bonding process, beating was conducted locally while the whole wafer is maintained at a relatively low temperature. But previous research of localized heating has some problems, such as non-uniform soldering due to non-uniform heating and micro crack formation on the glass capsule by thermal stress effect. To address this non-uniformity problem, a new heater configuration is being proposed. By keeping several points on the heater strip at calculated and constant potential, more uniform heating, hence more reliable wafer bonding could be achieved. The proposed scheme has been successfully demonstrated, and the result shows that it will be very useful in hermetic packaging. Less than 0.2 ㎫ contact Pressure were used for bonding with 150 ㎃ current input for 50${\mu}{\textrm}{m}$ width, 2${\mu}{\textrm}{m}$ height and 8mm $\times$ 8mm, 5mm$\times$5mm, 3mm $\times$ 3mm sized phosphorus-doped poly-silicon micro heater. The temperature can be raised at the bonding region to 80$0^{\circ}C$, and it was enough to achieve a strong and reliable bonding in 3minutes. The IR camera test results show improved uniformity in heat distribution compared with conventional micro heaters. For gross leak check, IPA (Isopropanol Alcohol) was used. Since IPA has better wetability than water, it can easily penetrate small openings, and is more suitable for gross leak check. The pass ratio of bonded dies was 70%, for conventional localized heating, and 85% for newly developed FP scheme. The bonding strength was more than 30㎫ for FP scheme packaging, which shows that FP scheme can be a good candidate for micro scale hermetic packaging.