• The Journal of the Petrological Society of Korea
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• v.5 no.2
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• pp.161-167
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• 1996

The CSD (crystal size distribution) of diopside crystals in the calc-silicate hornfels of the Hwanggangni Formation intruded by the Cretaceous Daeyasan granite shows the patterns of continuous nucleation and growth. There is correlation between the distance from the intrusion contact and the slopes from the linear part of log(population density) vs. size diagrams. In the log(population density) vs. size diagrams of the samples systematically collected from the intrusion contact, two different groups are recognized; the slopes for the samples near the intrusion contact (horizontal distance from the contact less than 50m) are gentler (1500$cm^{-1}$) than those for the samples away from the intrusion contact (2500$cm^{-1}$, distance from the contact greater than 100 m). These differences may reflect the differences in growth rates and crystallization time, or the differences in diopside-forming reactions. All of the log(population density) vs. size diagrams show depletion of smaller crystals. The observed depletion may be due to Ostwald ripening or the changes in nucleation rates as the reactant phases diminishes. Similar grouping is also possible for the observed degree of depletion of smaller crystals; the depletion decreases with increasing distance from the intrusion contact, suggesting temperature-dependent rates of Ostwald ripening.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.248-248
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• 2010

CMOS 축소화가 32nm node를 넘어서 지속적으로 진행되기 위하여 FinFET, Surround Gate and Tri-Gate와 같은 Fully Depleted 3-Dimensional 소자들이 SCE를 다루기 위해서 많이 제안되어 왔다. 하지만 소자의 축소화를 진행함에 있어서 좁고 균일한 patterning을 형성하는 것과 동시에 낮은 Extension Region과 Contact Region에서의 Series Resistance을 제공하여야 하고 Source/Drain Contact Formation을 확보하여야 한다. 그리고 소자의 축소화가 진행됨으로써 Silicide의 응집현상과 Source/Drain Junction의 누설전류에 대한 허용범위가 점점 엄격해지고 있다. ITRS 2005에 따르면 32nm CMOS에서는 Contact Resistivity가 대략 $2{\times}10-8{\Omega}cm2$이 요구되고 있다. 또한 Three Dimensional 소자에서는 Fin Corner Effect가 Channel Region뿐만 아니라 S/D Region에서도 중대한 영향을 미치게 된다. 따라서 본 논문에서 제시하는 Novel S/D Contact Formation 기술을 이용하여 Self-Aligned Dual/Single Metal Contact을 이루어Patterning에 대한 문제점 해결과 축소화에 따라 증가하는 Contact Resistivity 문제점을 해결책을 제시하고자 한다. 이를 검증하기3D MOSFET제작하고 본 기술을 적용하고 검증한다. 또한 Normal Doping 구조를 가진3D MOSFET뿐만 아니라 SCE를 해결하기 위해서 대안으로 제시되고 있는 SB-MOSFET을 3D 구조로 제작하고, 이 기술을 적용하여 검증한다. 그리고 Silvaco simulation tool을 이용하여 S/D에 Metal이 Contact을 이루는 구조가 Double type과 Triple type에 따라 Contact Resistivity에 미치는 영향을 미리 확인하였고 이를 실험으로 검증하여 소자의 축소화에 따라 대두되는 문제점들의 해결책을 제시하고자 한다.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.27 no.3
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• pp.335-342
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• 2003

In this study, the effects of oxide layer formed on the contact parts of TiN coated ball and steel disk in sliding are investigated. Also wear mechanism to from the oxide layer and the characteristics of the oxide layer formation are investigated. AISI 52100 steel ball is used for the substrate of coated ball specimens. Two types of coated ball specimens were prepared by depositing TiN coating with 1 and 4 ${\mu}{\textrm}{m}$ in coating thickness. AISI 1045 steel is used for the disk type counter-body. To investigate the effect of oxide layer on the contact parts of the two materials, the tests were performed both in air for forming oxide layer on the contact parts and in nitrogen environment to avoid oxidation. And to study the effects of surface roughness of counter-body, TiN coating thickness and contact load of sliding test on the characteristics of oxide layer formation on counter-body, various tests were carried out. From the results, the friction characteristics between the two materials was predominated by iron oxide layer that formed on wear track on counter-body and this layer caused the high friction. And the formation rate of the oxide layer on wear track increased as the real contact area between the two materials increased as the contact load increased, the TiN coating thickness decreased and the surface of counter-body smoothened.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2001.11a
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• pp.109-116
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• 2001

In this study, the effects of oxide layer formed on the contact parts of TiN coated ball and steel disk in sliding are investigated. Also wear mechanism to form the oxide layer and the characteristics of the oxide layer formation are investigated. AIS152100 steel ball is used for the substrate of coated ball specimens. Two types of coated ball specimens were prepared by depositing TiN coating with 1 and 4um in coating thickness. AISI1045 steel is used for the disk type counter-body. To investigate the effect of oxide layer on the contact parts of the two materials, the tests were performed both in ambient for forming oxide layer on the contact parts and in nitride environment to avoid oxidation. And to study the effects of surface roughness of counter-body, TiN coating thickness and contact load of sliding test on the characteristics of oxide layer formation on counter-body, various tests were carried out. From the results, the friction characteristics between the two materials was predominated by iron oxide layer that formed on wear track on counter-body and this layer caused the high friction. And the formation rate of the oxide layer on wear track increased as the real contact area between the two materials increased as the contact load increased, the TiN coating thickness decreased and the surface of counter-body smoothened.

• Proceedings of the Korean Society of Tribologists and Lubrication Engineers Conference
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• 2004.11a
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• pp.269-274
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• 2004

It is important to decide the minimum film thickness and viscosity variations of a multigrade lubricant in the contact surface under the high pressure conditions. By carrying out acceleration, deceleration, and various sliding-rolling ratio movement between two contact bodies, it is experimented that film formation variations in the contact surface are captured with multigrade lubricants in order to exactly investigate the variations of film formations. Optical interference images are continuously captured with high resolution CCD camera during the captured period of acceleration, deceleration. The friction forces between the contacting bodies are also measured simultaneously with the film formation.

• Current Photovoltaic Research
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• v.3 no.1
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• pp.10-15
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• 2015

Cu doping by copper or $Cu_2Te$ materials enhances p+ formation in CdTe near the back contact interface, allowing better formation of ohmic contact. However, the Cu in CdTe junction is also considered as a principal component of CdTe cell degradation. In this paper, Na-doped ZnTe layer was employed as a back contact material to improve the stability of CdTe solar cells. As a process variable, post $CdCl_2$ treatment of CdS/CdTe film was conducted before or after depositing ZnTe:Na on CdTe. The change of the photovoltaic properties of CdTe cells were investigated with aging time. Low-temperature photoluminescence analysis was conducted to describe the degradation mechanism. The result showed that the CdTe solar cells with better stability compare to Cu contact were achieved using an optimized ZnTe:Na back contact.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.29 no.2 s.233
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• pp.205-213
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• 2005

The drop ejection process from a micro nozzle is investigated by numerically solving the conservation equations for mass and momentum. The liquid-gas interface is tracked by a level set method which is extended for two-fluid flows with irregular solid boundaries. Based on the numerical results, the liquid jet breaking and droplet formation behavior is found to depend strongly on the pulse type of forcing pressure and the contact angle at the gas-liquid-solid interline. The negative pressure forcing can be used to control the formation of satellite droplets. Also, various nozzle shapes are tested to investigate their effect on droplet formation.

• 한국신재생에너지학회:학술대회논문집
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• 2007.06a
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• pp.250-253
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• 2007

An evaporated Ti/Pd/Ag contact system is most widely used to make high-efficiency silicon solar cells, however, the system is not cost effective due to expensive materials and vacuum techniques. Commercial solar cells with screen-printed contacts formed by using Ag paste suffer from a low fill factor and a high shading loss because of high contact resistance and low aspect ratio. Low-cost Ni and Cu metal contacts have been formed by using electroless plating and electroplating techniques to replace the Ti/Pd/Ag and screen-printed Ag contacts. Ni/Cu alloy is plated on a silicon substrate by electro-deposition of the alloy from an acetate electrolyte solution, and nickel-silicide formation at the interface between the silicon and the nickel enhances stability and reduces the contact resistance. It was, therefore, found that nickel-silicide was suitable for high-efficiency solar cell applications. The Ni contact was formed on the front grid pattern by electroless plating followed by anneal ing at $380{\sim}400^{\circ}C$ for $15{\sim}30$ min at $N_{2}$ gas to allow formation of a nickel-silicide in a tube furnace or a rapid thermal processing(RTP) chamber because nickel is transformed to NiSi at $380{\sim}400^{\circ}C$. The Ni plating solution is composed of a mixture of $NiCl_{2}$ as a main nickel source. Cu was electroplated on the Ni layer by using a light induced plating method. The Cu electroplating solution was made up of a commercially available acid sulfate bath and additives to reduce the stress of the copper layer. The Ni/Cu contact was found to be well suited for high-efficiency solar cells and was successfully formed by using electroless plating and electroplating, which are more cost effective than vacuum evaporation. In this paper, we investigated low-cost Ni/Cu contact formation by electroless and electroplating for crystalline silicon solar cells.

• International Journal of Advanced Culture Technology
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• v.11 no.1
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• pp.221-231
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• 2023

Nowadays, more and more countries are paying attention to basic teaching, so it can be found that they are carrying out a new round of basic teaching reform. The fundamental purpose is to adapt to the economic, cultural and technological development of the 21st century, so that their nationals will not be eliminated in the competition of the world environment, the spiritual civilization and material life of the nationals can be further improved, and they can have an advantage in the competition and catch up with the advanced level of the world. The cultivation of preschoolers' mental health determines the future development of a person. Through the long-term practice of art teaching at the Longyuan Branch of the District Third Kindergarten of Guangxi, This paper summarizes some effective teaching methods to cultivate children's connection ability and sense of security through aesthetic education.Firstly, preschoolers' contact ability was studied, and the aspects such as the definition of contact ability and the reasons for the formation of contact ability were explored. Secondly, the development of preschoolers' sense of security, what to avoid in order to develop a good sense of security and the effects of security on children were investigated. Finally, several specific teaching cases were written based on these theories. Through these cases, aesthetic education was utilized to promote preschoolers' contact ability and develop a sense of security. The study mainly draws the following conclusions that if children want to have a successful career, a happy family in the future, it is crucial to have the ability of connect and security in childhood. Aesthetic education can promote the formation of children's ability of connection and security.Finally, I write specific teaching cases based on the above theories and practice, through which these cases use aesthetic education to promote the formation of children's contact ability and sense of security.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.39 no.10
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• pp.25-34
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• 2002

In this paper, silicidation induced Schottky contact area was obtained using the current voltage(I-V) characteristics of shallow cobalt silicided p+-n and n+-p junctions. In reverse bias region, Poole-Frenkel barrier lowering influenced predominantly the reverse leakage current, masking thereby the effect of Schottky contact formation. However, Schottky contact was conclusively shown to be the root cause of the modified I-V behavior of n+-p junction in the forward bias region. The increase of leakage current in silicided n+-p diodes is consistent with the formation of Schottky contact via cobalt slicide penetrating into the p-substrate or near to the junction area and generating trap sites. The increase of reverse leakage current is proven to be attributed to the penetration of silicide into depletion region in case of the perimeter intensive n+-p junction. In case of the area intensive n+-p junction, the silicide penetrated near to the depletion region. There is no formation of Schottky contact in case of the p+-n junction where no increase in the leakage current is monitored. The Schottky contact amounting to less than 0.01% of the total junction was extracted by simultaneous characterization of forward and reverse characteristics of silicided n+-p diode.