• 한국정밀공학회지
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• 제12권4호
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• pp.119-126
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• 1995

This paper presents a non-contact measuring system using one point measuring method to measure surface profiles of dies and clay models for practical use in the field of production engineering. The system has a laser beam probe similar to a measuring probe in a contact measuring system and CCD linear sensor used to detect 300mm measurement range, displacement of measured surfaces, from an origin. There is no mechanical interference between this measuring system and a measured surface in this system. In this measuring system, it was needed 500-600ms including data processing time to measure one point. The experiments showed that the standard deviation was 800 .mu.m and the reproducibility was also 100-210 .mu. m.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 춘계학술대회 논문집
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• pp.603-606
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• 2000

This dissertation is concerned with ultra-precision profile measurement of aspheric surfaces using contact probing technique. A contact probe has been designed as a sensing device to obtain measuring resolutions in nanometer regime utilizing a leaf spring mechanism and a capacitive-type sensor. The contact probe is attached on the z-axis during measurement while aspheric objects are supported on an precision xy-stage whose lateral motions are monitored by a set of two orthogonal plane mirror type laser interferometers. Experimental results show that the contact probing technique developed in this investigation is capable of providing a repeatability of 50 nanometers with a $\pm$3$\sigma$ uncertainty of 300 nanometers. Thermal disturbance is found the most significant factor that should be precisely controlled for accurate measurement.

• 한국전기전자재료학회논문지
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• 제20권9호
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• pp.749-755
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• 2007

Recently, novel MEMS probe cards can support reliable wafer level chip test with high density probing capacity. However, manufacturing cost and process complexity are crucial weak points for low cost mass production. To overcome these limitations, we have developed micro spring structured MEMS probe card. For fabrication of micro spring module, a wire bonder and electrolytic polished gold wires are used. In this case, stringent tension force control is essential to guarantee the low level contact resistance of micro spring for reliable probing performance. For this, relation between tension force of fabricated probe card and contact resistance is characterized. Compare to conventional probe cards, developed MEMS probe card requires fewer fabrication steps and it can be manufactured with lower cost than other MEMS probe cards. Also, due to the small contact scratch patterns, we expect that it can be applied to bumping types chip test which require higher probing density.

• Design & Manufacturing
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• 제14권2호
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• pp.21-27
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• 2020

Recently, LCD (Liquid Crystal Display) has been replaced by OLDE (Organic Light Emitting Diode) in high resolution display industry. In the process of OLDE production, it inspects defective products by sending a signal using a probe during OLED panel inspection. At this time, the cause of the detection of failure is divided into two. One is the self-defect of the OLED panel and the other is the poor contact occurring in the process of contact between the two. The second case is unknown at the time of testing, which increases the time for retesting. To this end, we made a system that can identify in real time whether the probe is in contact during the inspection. A contact probe unit was designed for the system, and a stage system was implemented. An inspection system was constructed through S / W and circuit configuration for actual inspection. Finally, a system that can check contact and non-contact in real time was constructed.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.90-93
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• 2003

This paper described about the ultra-precision profile measurement of aspheric surfaces using contact probing technique. A contact probe has been designed as a sensing device to obtain measuring resolutions in nanometer regime utilizing a circle leaf spring mechanism and a capacitive-type sensor. The, contact probe is attached on the z-axis during measurement while aspheric object are supported on the diamond turning machine(DTM). The machine xz-axis motions are monitored by a set of two orthogonal plane mirror type laser interferometers. Experimental results show that the contact probing technique developed of on-machine measurement system in this investigation is capable of providing a repeatability of 10 nanometers with a $\pm$20 uncertainty of 200nmPv.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2002년도 추계학술대회 논문집
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• pp.391-395
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• 2002

This paper described about the ultra-precision profile measurement of aspheric surfaces using contact probing technique. A contact probe has been designed as a sensing device to obtain measuring resolutions in nanometer regime utilizing a leaf spring mechanism and a capacitive-type sensor. The contact probe is attached on the z-axis during measurement while aspheric objects are supported on the single point diamond turning machine(SPDTM). The machine xz-axis motions are monitored by a set of two orthogonal plane mirror type laser interferometers. Experimental results show that the contact probing technique developed of On-machine Measurement System in this investigation is capable of providing a repeatability of 20 nanometers with a $\pm$20 uncertainty of 300 nanometers.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2010년도 춘계학술대회 논문집
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• pp.12-12
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• 2010

The hall probe measurement system was used to measure the critical current distribution of superconducting coated conductor. The system consists of reel to reel moving apparatus, 7 array hall probe, a rotary encoder and permanent magnet. The magnetic field profile across the width of superconducting coated conductor using Bean's critical state model was calculated. The effect of various parameters of the formulas on the magnetic field distribution and the effect of shape and size of artificial defects, which were formed on the surface of SmBa2Cu3O7-d(SmBCO) coated conductor using laser marking system, on the hall probe magnetic field signal of the hall probe measurement system was investigated.

• 한국소음진동공학회논문집
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• 제14권6호
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• pp.495-502
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• 2004

This paper presents the vibration analysis and the performance evaluation of cantilevers with probing tips for non-contact scanning probe microscopy. One of the current issues of the scanning probe microscopy technology is to increase the measurement speed, which is closely tied with the dynamic characteristics of cantilevers. The primary concern in this research is to investigate the relation between the maximum possible speed of non-contact scanning probe microscopy and the dynamic characteristics of cantilevers. First, the finite element analysis is made for the vibration characteristics of various cantilevers in use. The computed natural frequencies of the cantilevers are in good agreement with measured ones. Then, each cantilever is tested with topographic measurement for a standard sample with the scanning speed changed. The performances of cantilevers are analyzed along with the natural frequencies of cantilevers. Experiments are also performed to test the effects of how to attach cantilevers in the piezo-electric actuator. Finally, measurement sensitivity has been analyzed to enhance the performance of scanning probe microscopy.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2003년도 춘계학술대회논문집
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• pp.263-268
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• 2003

This paper presents a result of performance evaluation fur non-contact scanning probe microscopy with respect to the vibration characteristics of cantilevers with tips. One of the current issues of the scanning probe microscopy technology is to increase the measurement speed, which is closely tied with the dynamic characteristics of cantilevers. The primary concern in this research is to investigate the relation between the maximum possible speed of non-contact scanning probe microscopy and the dynamic characteristics of cantilevers. First, the finite element analysis is made fur the vibration characteristics of various cantilevers in use. The computed natural frequencies of the cantilevers are in good agreement with measured ones. Then, each cantilever is tested with topographic measurement for a standard sample with the scanning speed changed. The performances of cantilevers are analyzed along with the natural frequencies of cantilevers. Experiments are also performed to test the effects of how to attach cantilevers in the piezo-electric actuator. Finally, measurement sensitivity has been analyzed to enhance the performance of scanning probe microscopy.

• 비파괴검사학회지
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• 제36권4호
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• pp.288-294
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• 2016

Flexible ECT (eddy current array) probe를 사용하여 판재 및 용접부에 존재하는 notch 결함을 MS-5800E와 OmniScan MX 장비로 검출능력을 비교하고, 주파수와 lift-off를 변수로 신호의 특성을 비교하고자 하였다. 실험 결과, 500, 1000, 1500 kHz를 사용하였을 때 notch 깊이가 증가할수록 신호의 진폭이 증가하는 것으로 나타났고, lift-off 변화에 따른 신호의 진폭은 선형적으로 감소하였다. 또한 용접부 결함은 probe와 시험체의 접촉면에 밀접한 관계가 있다. Probe와 시험체의 접촉면이 양호한 경우 검출감도가 우수하고 그렇지 않은 경우에는 검출감도가 떨어지는 것을 알 수 있었다.