• Title/Summary/Keyword: Contact Printing

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New Structure of Rigid Spacers for Tight Bonding of Two Plastic Substrates in Plastic LCD

  • Choi, Hong;Jang, Se-Jin;Bae, Ji-Hong;Choi, Yoon-Seuk;Kim, Sang-Il;Shin, Sung-Sik;Kim, Jae-Hoon
    • 한국정보디스플레이학회:학술대회논문집
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    • 2007.08a
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    • pp.352-355
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    • 2007
  • We have developed tight bonding of plastic LCD with new rigid spacer. For tight bonding of two plastic substrates, we designed structures to collect UV or thermal epoxy placed on the top of rigid spacer spontaneously by capillary effect. We confirmed that tight bonded plastic LCD has a good adhesion without induced defects and a high mechanical stability against the various external deformations. This method can be applicable to the fabrication of large plastic LCDs using stamping process.

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감쇄위상변위마스크를 사용하는 메탈레이어 리토그라피공정의 오버레이 보정

  • 이우희;이준하;이흥주
    • Proceedings of the Korean Society Of Semiconductor Equipment Technology
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    • 2004.05a
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    • pp.159-162
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    • 2004
  • Problems of overlap errors and sidelobe printing by the design rule reduction in the lithography process using attenuated phase-shifting masks(attPSM) have been serious. Overlap errors and sidelobes can be simultaneously solved by the rule-based correction using scattering bars with the rules extracted from test patterns. Process parameters affecting the attPSM lithography simulation have been determined by the fitting method to the process data. Overlap errors have been solved applying the correction rules to the metal patterns overlapped with contact/via. Moreover, the optimal insertion rule of the scattering bars has made it possible to suppress the sidelobes and to get additional pattern fidelity at the same time.

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Investigation on Transcription Accuracy of PDMS Stamps to Mold Patterns (PDMS stamp 제조시 패턴의 전사 정확도 연구)

  • Yi, Eun-Ji;Kim, Kyoung-Seob;Kim, Nam-Hoon;Roh, Yong-Han
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2007.11a
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    • pp.99-100
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    • 2007
  • Transferring patterns from mold to PDMS stamp is very useful technology in micro-fabrication, complex and three-dimensional structures. First experimentation, mold's patterns wens transferred to PDMS stamp. Comparing with PDMS stamp and Mold, patterns were transferred about 97.9%. Second experimentation, PDMS stamps were made several times by only one mold, scale and distance of transferred patterns were uniform about 89.3%. We proved that transferring patterns from mold to PDMS stamp is accurate. The uniformity of stamps is the same after mold was used several times. Transferring patterns from mold to PDMS stamp has uniformity and accuracy, it will be useful technology.

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Development of Atmospheric Pressure Plasma Equipment and It's Application to Flip Chip BGA Manufacturing Process (대기압 플라즈마 설비 개발 및 Flip Chip BGA 제조공정 적용)

  • Lee, Ki-Seok;Ryu, Sun-Joong
    • Journal of the Semiconductor & Display Technology
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    • v.8 no.2
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    • pp.15-21
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    • 2009
  • Atmospheric pressure plasma equipment was successfully applied to the flip chip BGA manufacturing process to improve the uniformity of flux printing process. The problem was characterized as shrinkage of the printed flux layer due to insufficient surface energy of the flip chip BGA substrate. To improve the hydrophilic characteristics of the flip chip BGA substrate, remote DBD type atmospheric pressure plasma equipment was developed and adapted to the flux print process. The equipment enhanced the surface energy of the substrate to reasonable level and made the flux be distributed over the entire flip chip BGA substrate uniformly. This research was the first adaptation of the atmospheric pressure plasma equipment to the flip chip BGA manufacturing process and a lot of possible applications are supposed to be extended to other PCB manufacturing processes such as organic cleaning, etc.

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Studies on the fabrication and properties of $La_ 0.7Sr_0.3MnO_3$cathode contact prepared by glycine-nitrate process and solid state reaction method for the high efficient solid oxide fuel cells applications 0.3/Mn $O_{3}$ (고효율 고체산화물 연료전지 개발을 위한 자발 착화 연소 합성법과 고상반응법에 의한 $La_ 0.7Sr_0.3MnO_3$ 양극재료 제조 및 물성에 관한 연구)

  • Shin, Woong-Shun;Park, In-Sik;Kim, Sun-Jae;Park, Sung
    • Electrical & Electronic Materials
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    • v.10 no.2
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    • pp.141-149
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    • 1997
  • L $a_{0.7}$S $r_{0.3}$Mn $O_{3}$ powders were prepared by both GNP(Glycine-Nitrate Process) and solid state reaction method in various of calcination temperature(800-1000.deg. C) and time in air. Also, L $a_{0.7}$S $r_{0.3}$Mn $O_{3}$ cathode contacts on YSZ(Yttria-Stabilized Zirconia) substrate were prepared by screen printing and sintering method as a function of sintering temperature(1100-1450.deg. C) in air. Sintering behaviors have been investigated by SEM(Scanning Electron Microscope) and porosity measurement. Compositional and structural characterization were carried out by X-ray diffractometer and ICP AES(Inductively Coupled Plasma-Atomic Emission Spectrometry) analysis. Electrical characterization was carried out by the electrical conductivity with linear 4 point probe method. As the calcination period increased in solid state reaction method, L $a_{0.7}$S $r_{0.3}$Mn $O_{3}$ phase increased. Although L $a_{0.7}$S $r_{0.3}$Mn $O_{3}$ single phase was obtained only for 48hrs at 1000.deg. C, in GNP method it was easy to get single and ultra-fine L $a_{0.7}$S $r_{0.3}$Mn $O_{3}$ powders with submicron particle size at 650.deg. C for 30min. The particle size and thickness of L $a_{0.7}$S $r_{0.3}$Mn $O_{3}$ cathode contact by solid state reaction method did not change during the heat treatment, while those by GNP method showed good sintering characteristics because initial powder size fabricated from GNP method is smaller than that fabricated from solid state reaction method. Based on enthalpy change from thermodynamic data and ICP-AES analysis, it was suggested to make cathode contact in composition of (L $a_{0.7}$S $r_{0.3}$)$_{0.91}$ Mn $O_{3}$ which have little second phase (L $a_{2}$Z $r_{2}$ $O_{7}$) for high efficient solid oxide fuel cells applications. As (L $a_{0.7}$S $r_{0.3}$)$_{0.91}$Mn $O_{3}$ cathode contact on YSZ substrate was sintering at 1250.deg. C the temperature that liquid phase sintering did not occur. It was possible to obtain proper cathode contacts with electrical conductivity of 150(S/cm) and porosity content of 30-40%.m) and porosity content of 30-40%.

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Electrical Properties of Solar Cells With the Reactivity of Ag pastes and Si Wafer (Ag paste와 실리콘 웨이퍼의 반응성에 따른 태양전지의 전기적 성질)

  • Kim, Dong-Sun;Hwang, Seong-Jin;Kim, Hyung-Sun
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2009.06a
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    • pp.54-54
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    • 2009
  • Ag thick film has been used for electrode materials with the excellent conductivity. Ag electrode is used in screen-printed silicon solar cells as a electrode material. Compared to photolithography and buried-contact technology, screen-printing technology has the merit of fabricating low-priced cells and enormous cells in a few hours. Ag paste consists of Ag powders, vehicles and additives such as frits, metal powders (Pb, Bi, Zn). Frits accelerate the sintering of Ag powders and induce the connection between Ag electrode and Si wafer. Thermophysical properties of frits and reactions among Ag, frits and Si influence on cell performance. In this study, Ag pastes were fabricated with adding different kinds of frits. After Ag pastes were printed on silicon wafer by screen-printing technology, the cells were fired using a belt furnace. The cell parameters were measured by light I-V to determine the short-circuit current, open-circuit voltage, FF and cell efficiency. In order to study the relationship between the reactivity of Ag, frit, Si and the electrical properties of cells, the reaction of frits and Si wafer on was studied with thermal properties of frits. The interface structure between Ag electrode and Si wafer were also measured for understanding the reactivity of Ag, frit and Si wafer. The excessive reactivity of Ag, frit and Si wafer certainly degraded the electrical properties of cells. These preliminary studies suggest that reactions among Ag, frits and Si wafer should optimally be controlled for cell performances.

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Fabrication of field emitters using a filtration-taping-transfer method

  • Song, Ye-Nan;Shin, Dong-Hoon;Sun, Yuning;Shin, Ji-Hong;Lee, Cheol-Jin
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.466-466
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    • 2011
  • There have been several methods to fabricate carbon nanotube (CNT) emitters, which include as-grown, spraying, screen-printing, electrophoresis and bonding methods. Unfortunately, these techniques generally suffer from two main problems. One is a weak mechanical adhesion between CNTs and the cathode. The as-grown, spraying and electrophoresis methods show a weak mechanical adhesion between CNTs and the cathodes, which induces CNT emitters pulled out under a high electric field. The other is a severe degradation of the CNT tip due to organic binders used in the fabrication process. The screen-printing method which is widely used to fabricate CNT emitters generally shows a critical degradation of CNT emitters caused by the organic binder. Such kinds of problems induce a short lifetime of the CNT field emitters which may limit their practical applications. Therefore, a robust CNT emitter which has the strong mechanical adhesion and no degradation is still a great challenge. Here, we introduce a simple and effective technique for fabrication of CNT field emitter, namely filtration-taping-transfer method. The CNT emitters fabricated by the filtration-taping-transfer method show the low turn-on electric fields, the high emission current, good uniformity and good stability. The enhanced emission performance of the CNT emitters is mainly attributed to high emission sites on the emitter area, and to good ohmic contact and strong mechanical adhesion between the emitters and cathodes. The CNT emitters using a simple and effective fabrication method can be applied for various field emission applications such as field emission displays, lamps, e-beam sources, and x-ray sources. The detail fabrication process will be covered at the poster.

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Dispersion Characteristics of Ag Pastes and Properties of Screen-printed Source-drain Electrodes for OTFTs (Ag Pastes의 분산 특성 및 스크린 인쇄된 OTFTs용 전극 물성)

  • Lee, Mi-Young;Nam, Su-Yong
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.9
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    • pp.835-843
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    • 2008
  • We have fabricated the source-drain electrodes for OTFTs by screen printing method and manufactured Ag pastes as conductive paste. To obtain excellent conductivity and screen-printability of Ag pastes, the dispersion characteristics of Ag pastes prepared from two types of acryl resins with different molecular structures and Ag powder treated with caprylic acid, triethanol amine and dodecane thiol as surfactant respectively were investigated. The Ag pastes containing Ag powder treated with dodecane thiol having thiol as anchor group or AA4123 with carboxyl group(COOH) of hydrophilic group as binder resin exhibited excellent dispersity. But, Ag pastes(CA-41, TA-41, DT-41) prepared from AA4123 fabricated the insulating layer since the strong interaction between surface of Ag powder and carboxyl group(COOH) of AA4123 interfered with the formation of conduction path among Ag powders. The viscosity behavior of Ag pastes exhibited shear-thinning flow in the high shear rate range and the pastes with bad dispersion characteristic demonstrated higher shear-thinning index than those with good dispersity due to the weak flocculated network structure. The output curve of OTFT device with a channel length of 107 ${\mu}m$ using screen-printed S-D electrodes from DT-30 showed good saturation behavior and no significant contact resistance. And this device exhibited a saturation mobility of $4.0{\times}10^{-3}$ $cm^2/Vs$, on/off current ratio of about $10^5$ and a threshold voltage of about 0.7 V.

The Study of the Printability on the Phenol Free Heat-Set Web Inks(III) - Effects of the Emulsification of Ink on Print Quality - (Phenol Free Heat-Set 윤전 잉크의 인쇄적성에 관한 연구 (제3보) - 잉크 유화가 인쇄품질에 미치는 영향 -)

  • Ha, Young-Baeck;Oh, Sung-Sang;Lee, Won-Jae
    • Journal of Korea Technical Association of The Pulp and Paper Industry
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    • v.44 no.4
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    • pp.77-84
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    • 2012
  • The lithographic process depends on a satisfactory ink-in-water emulsion being formed during printing and the speed of wet presses makes the choice of fountain solution vitally important as the ink and fount must react quickly to form a stable emulsion. Ink and water come into contact with each other on the rolls of the press and are forced together in the roll nips. The water is not soluble in the ink since it is slightly fat. Instead, an emulsion is formed, a heterogeneous mass consisting of small water drops mixed into the ink, if the water feed is too great. This emulsification can affect the properties of an off-set ink and negatively affect the printability. So we investigated the effects of the emulsification of phenol free heat-set ink and existing heat-set ink on printed quality, such as amount of ink transfer, printed density, print-through and uniformity. We used Duke emulsification tester for the emulsification of inks, and used IGT printability tester for printed quality. The printed quality were measured by densitometer and were evaluated by the image analysis system. Compared to conventional printing ink, phenol-free ink showed better results of the printability at the emulsification.

Cytotoxicity(MTT) evaluation of dental instruments made of polymers (치과용 폴리머 기구의 세포독성(MTT) 평가)

  • Choi, Eun-Mi
    • Journal of the Korea Convergence Society
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    • v.12 no.8
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    • pp.187-195
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    • 2021
  • In order to assess the cell toxicity of 10 instruments made of polymers, the MTT assay which utilizes the L-929 cell was selected. Specimens were eluted at a temperature of 37℃ for 24 hours at a rate of 4g per 20mL, RPMI 1640, and then was positively and negatively contrasted with a control test solution, in accordance with the Notification No. 2020-12 Protocols of Medical Apparatus Biological Safety from the Ministry of Drug and Food Safety. As a result of 24 hours of incubation in 37℃, 5% CO2 Incubator and assessment using an ELISA reader, the results of Intraoral camera indiciated a cellular viability of more than 70% at a 50% eluate. But, the Plastic impression tray, 3D printing tweezer, Impression disposable syringe, Dental floss holder, Hand implant scaler, Surgical retractor, Oral scanner tip, Dental mirror, and the Water pick tip all reported a cellular viability of more than 70% at a 100% eluate, which indicates that do not exhibit cytotoxicity, thus allowing it to be used in contact with the mucous membrane of the oral cavity.