• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.11a
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• pp.39-42
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• 2002

Recently, CMP (chemical mechanical polishing) technology has been widely used for global planarization of multi-level interconnection for ULSI applications. However, COO (cost of ownership) and COC (cost of consumables) were relatively increased because of expensive slurry. In this paper, we have studied the possibility of recycle of reused silica slurry in order to reduce the costs of CMP slurry. The post-CMP thickness and within-wafer non-uniformity(WIWNU) were measured as a function of different slurry composition. As a experimental result, the performance of reused slurry with annealed silica abrasive of 2 wt% contents was showed high removal rate and low non-uniformity. Therefore, we propose two-step CMP process as follows In the first-step CMP, we can polish the thick and rough film surface using remaked slurry, and then, in the second-step CMP, we can polish the thin film and fine pattern using original slurry. In summary, we can expect the saving of high costs of slurry.

• International Journal of Advanced Culture Technology
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• v.3 no.2
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• pp.34-41
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• 2015

Bonding strength of a thermal sprayed coating is difficult to measure using a conventional pull-off test method. Scratch test is a potential alternative testing method. An adhesive and a cohesive bond strength of the coating can be measured by the pull-off test while the scratch test performed on the cross-section of the thermal sprayed coating can only demonstrate the cohesive bond strength of the coating. Nevertheless, it is still beneficial to perform the scratch testing on the cross-section of the coating for the sake of comparison thus providing an alternative to the pull-off test. The scratch test method can reduce testing time and cost in the long run due to a significant cost reduction in consumables and energy and time saving from the curing step of the glue used in the pull-off test. This research investigates the possibility of using the scratch test to measure the cohesive bond strength of Mo/NiCrBSi composite coating. The results from the pull-off test and the scratch test indicate that the cohesive bond strengths of the Mo composite coating show similar trend and that the cohesive bond strength are increased when increasing NiCrBSi content.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2017.05a
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• pp.233-235
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• 2017

Forklift tend to work in place rather than moving due to work environment conditions, so they express only the engine operation time without expressing the moving distance unlike a general car's instrument panel. Therefore, various consumables constituting the forklift have a replacement cycle according to the operation time of the engine. However, it is very difficult to judge the exact replacement cycle only by the engine operation time because the working environment differs for each forklift. In this paper, we propose a system that provides position information and moving distance information of forklift to driver using GPS and IMU sensor. By using this system, it is expected that the forklift status information, which is difficult to judge by the existing instrument panel, is provided as easier information, and economic benefits for forklift management and maintenance are expected.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.2
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• pp.138-143
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• 2004

CMP (Chemical Mechanical Polishing) technology for global planarization of multilevel interconnection structure has been widely studied for the next generation devices. Among the consumables for CMP process, especially, slurry and their chemical compositions play a very important role in the removal rates and within-wafer non-uniformity (WIWNU) for global planarization ability of CMP process. However, CMP slurries contain abrasive particles exceeding 1 ${\mu}{\textrm}{m}$ size, which can cause micro-scratch on the wafer surface after CMP process. Such a large size particle in these slurries may be caused by particle agglomeration in slurry supply-line. In this work, to investigate the effects of agglomeration on the performance of oxide CMP slurry, we have studied an aging effect of silica slurry as a function of particle size distribution and aging time during one month. We Prepared and compared the self-developed silica slurry by adding of alumina powders. Also, we have investigated the oxide CMP characteristics. As an experimental result, we could be obtained the relatively stable slurry characteristics comparable to aging effect of original silica slurry. Consequently, we can expect the saving of high-cost slurry.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2011.10a
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• pp.499-502
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• 2011

The advances in Information Technology have made examining the condition of vehicles possible with using various functions of a Smart Phone. Users have not realized the necessity of auto diagnosis system, for previous system required professional knowledge about vehicles. Because of this inconvenience, special system which is easy to use and quick to grasp its condition by smart phone is asked for users. In this research, auto diagnosis system is designed in Windows Phone. The replacement cycles for auto consumables, examining vehicle problems, and information of eco driving indicator are delivered in real time for auto drivers by using OBD-II information which is through wifi module in OBD-II protocol adaptor connector.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.7
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• pp.568-574
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• 2000

We have been optimized tungsten(W) plug CMP(chemical mechanical polishing) characteristics using two different kinds of component of slurry and two different kinds of pad which have different hardness. The comparison of oxide film roughness on around W plug after polishing has been carried out. And W plug recess for consumable sets and dishing effect at dense area according to the rate of over-polishing has been investigated. Also the analysis of residue on surface after cleaning have been performed. As a experimental result we have concluded that the consumable set of slurry A and hard pad was good for W plug CMP process. After decreasing the rate of chemical reaction of silica slurry and adding two step buffering we could reduce the expanding of W plug void however we are still recognizing to need a more development for those kinds of CMP consumables.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.41-44
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• 2003

As the device feature size is reduced to the deep sub-micron regime, the chemical mechanical polishing (CMP) technology is widely recognized as the most promising method to achieve the global planarization of the multilevel interconnection for ULSI applications. However, cost of ownership (COO) and cost of consumables (COC) were relatively increased because of expensive slurry. In this paper, the effects of different slurry composition on the oxide CMP characteristics were investigated to obtain the higher removal rate and lower non-uniformity. We prepared the various kinds of slurry. In order to save the costs of slurry, the original slurry was diluted by de-ionized water (DIW). And then, alunima abrasives were added in the diluted slurry in order to promote the mechanical force of diluted slurry.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.651-652
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• 2005

Chemical mechanical polishing (CMP) has emerged as the planarization technique of choice in integrated circuit manufacturing. Especially, polishing pad is considered as one of the most important consumables because of its properties. Generally, conventional polishing pad has irregular pores and asperities. If conditioning process is except from whole polishing process, smoothing of asperities and pore glazing occur on the surface of the pad, so repeatability of polishing performances cannot be expected. In this paper, CMP pad with microstructure was made using micro-molding technology and repeatability of ILD(interlayer dielectric) CMP performances and was evaluated.

• Korean Journal of Metals and Materials
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• v.47 no.3
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• pp.195-201
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• 2009

This paper is concerned with effects of Mn and heat-input on the mechanical properties of EGW welds. Four different kinds of welding consumables were fabricated by varying Mn contents such as 1.3, 1.5, 1.7, 2.0%Mn and each consumable was welded for EGW on four heat-input conditions between 190 and 340 KJ/Cm. Mn contents were decreased as heat-input increases and alloy elements (C, Si, Ti, B, Al) to deoxidize easily also revealed similar tendency to Mn. Their microstructure, Charpy impact property and strength were investigated, and it is found that Charpy impact property and strength exhibit a strong dependence on change of microstructure by Mn contents and heat-input. The increase of Mn contents or the decrease of heat-input made the microstructure fine and increase volume fraction of acicular ferrite, thereby leading to the great improvement of Charpy impact property and strength. In case of single EGW, optimum Mn contents are over 1.7% for the toughness and strength.

• Korean Chemical Engineering Research
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• v.47 no.5
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• pp.615-619
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• 2009

(+)-$Tr{\ddot{o}}ger$'s base in $Tr{\ddot{o}}ger$'s base racemates that inhibits thromboxane A2($T{\times}A2$) synthase has been used to treat arteriosclerosis. Separation of (+)-$Tr{\ddot{o}}ger$'s base by chromatography has become a major concern. However separation experiments of (+)-$Tr{\ddot{o}}ger$'s base need time and consumables so that simulation with Aspen Chromatography could save time and costs by predicting the efficiency of separation. Injection amount and eluent flow rate were varied to compare the resolutions and yields of TB(-) and TB(+). Highest resolution and yield were attained at the eluent rate of 0.25 mL/min. Isotherms representing the relationship between mobile phase concentration and stationary phase concentration were changed to get the best separation with Ideal Adsorbed Solution(IAS) Statistical Lanmuir isotherms.