• Journal of the Korea Organic Resources Recycling Association
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• v.26 no.1
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• pp.39-45
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• 2018

Research on FA(Fly ash) is actively carried out, while the research on BA(Bottom ash) is not so, and research on BA recycling field is urgently required. Therefore, in this study, we investigated the lightweight and thermal insulation characteristics of BA mortar by comparing BA mortar made with porous dry BA(air-cooled) and general mortar. To investigate the lightweight of BA, density test, unit volume mass test and SEM(Scanning Electron Microscope) test were performed. BA mortar and general mortar molds were prepared for the thermal insulation test at room temperature and humidity environment determined by KS A 0006 and they were dried at the temperature of $105{\pm}2^{\circ}C$ until the weight became constant. As a result of the lightweight test, the lightweight of BA mortar is about 30% lighter than the general mortar. Therefore, BA is expected to contribute to reduce the building load when used as building material. As a result of thermal insulation test, the thermal conductivity of BA mortar is about 30% better than that of general mortar.

• Journal of The Korean Society of Agricultural Engineers
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• v.57 no.6
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• pp.131-140
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• 2015

This paper presents overall procedure by experimental study in order to deriving design factors of snow removal machine on roof of multi-span greenhouse. For the purpose of the testing, the scale model of the machine was made in the form to drive above the monorail. The test was performed in order to calculating friction coefficient of the machine and shear coefficient between sliced horizontal section of snow at constant temperature and humidity room in National Academic of Agricultural Science. As a result of the laboratory test, shear coefficient between sliced horizontal section of snow were calculated 1.60~2.37. Further investigation, we will study to derive the relationship between the real and scaled model through the field test.

• Journal of Electrical Engineering and Technology
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• v.13 no.6
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• pp.2392-2401
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• 2018

Creepage discharge faults in air on solid insulating material play a vital role in degradation and ageing of material which ultimately leads to breakdown of power equipment. And electric discharge decompose air in to its by-products such as Ozone and $NO_x$ gases. By analyzing air decomposition gases is a potential method for fault diagnostic in air. In this paper, experimental research has been conducted to study the effect of creepage discharge on rate of generation of air decomposition by-products using different insulating materials such as RTV, epoxy and fiberglass laminated sheet. Moreover XRF analysis has been done to analyze creepage discharge effect on these insulating materials. All experiments have been done in an open air test cell under constant temperature and pressure conditions. While analysis has been made for low and high humidity conditions. The results show that the overall concentration of air decomposition by-products under creepage discharge in low humidity is 4% higher than concentration measured in high humidity. Based on this study a mathematical relationship is also proposed for the rate of generation of air decomposition by-products under creepage discharge fault. This study leads to indirect way for diagnostic of creepage discharge propagation in air.

• Proceedings of the KWS Conference
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• 2010.05a
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• pp.80-80
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• 2010

전자제품의 소형화, 경량화, 고집적화가 심화됨에 따라 전자제품을 구성하는 회로의 미세화 또한 요구되고 있다. 이러한 요구는 경성회로기판 (rigid printed circuit board, RPCB) 뿐만 아니라 연성회로기판 (flexible printed circuit board, FPCB) 에도 적용되고 있으며 이에 대한 많은 연구 또한 이루어지고 있다. 연성회로기판은 일반적으로 절연층을 이루는 폴리이미드 (polyimide, PI)와 전도층을 이루는 구리로 이루어져 있다. 폴리이미드는 뛰어난 열적 화학적 안정성, 우수한 기계적 특성, 연속공정이 가능한 장점을 가지고 있으나, 고온다습한 환경하에서 높은 흡습성으로 인해 전도층을 이루는 구리와의 접합특성이 저하되는 단점 또한 가지고 있다. 또한 전도층을 이루는 구리는 고온다습한 환경하에서 산화 발생이 용이하기 때문에 접합특성의 감소를 야기할 수 있다. 따라서 본 연구에서는 고온다습한 조건하에서 sputtering and plating 공정을 통해 순수 Cr seed layer를 가지는 연성회로기판의 seed layer의 두께와 시효시간의 변화로 인해 발생하는 접합특성의 변화를 관찰하고 분석하였다. 본 연구에서는 두께 $25{\mu}m$의 일본 Kadena사(社)에서 제작된 폴리이미드 상에 sputtering 공정을 통해 순수 Cr으로 이루어진 각각 두께 100, 200, $300{\AA}$의 seed layer를 형성한 후 전해도금법을 이용, 두께 $8{\mu}m$의 구리 전도층을 형성한 시료를 사용하였다. 제작된 시료는 고온다습한 환경하에서의 접합 특성의 변화를 관찰하기 위하여 $85^{\circ}C$/85%RH 항온항습 조건하에서 각각 24, 72, 120, 168시간 동안 시효처리 한 후, Interconnections Packaging Circuitry (IPC) 규격에 의거하여 접합강도를 측정하였다. 시료의 전도층은 폭 3.2mm 길이 230mm의 패턴을 가지도록, 절연층은 폭 10mm, 길이 230mm으로 구성되었으며 이를 50.8mm/min의 박리 속도로 각 시편당 8회의 $90^{\circ}$ peel test를 실시하였다. 파면의 형상과 화학적 조성을 분석하기 위해 SEM (Scanning electron microscope)과 EDS (Energy-dispersive X-ray spectroscopy)를 사용하였으며, 파면의 조도 측정을 위해 AFM (Atomic force microscope)을 사용하였다. 또한 계면의 화학적 결합상태를 분석하기 위해 XPS (X-ray photoelectron spectroscopy)를 통해 파면을 관찰 분석하였다.

• Proceedings of the KWS Conference
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• 2009.11a
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• pp.75-75
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• 2009

연성회로기판은 일반적으로 절연체를 이루는 폴리이미드와 전도체를 이루는 구리로 구성되어 있다. 폴리이미드는 뛰어난 열적 화학적 안정성, 기계적 특성, 공정성 등의 장점으로 인해 연성회로기판의 절연체로서 제안되었지만 전도체를 이루는 구리와의 접합 특성이 우수하지 않기 때문에 많은 연구가 현재까지 진행되고 있고, 그 결과 연성회로기판의 접합 특성에 많은 개선이 이루어짐과 동시에 다양한 공정 방법이 제안되고 있다. 하지만 고온다습한 환경에서 사용될 경우 폴리이미드의 높은 흡습성과, 구리와 seed layer의 산화 문제로 인해 접합 특성이 저하된다는 단점 또한 가지고 있다. 따라서 본 연구를 통해 고온다습한 조건하에서 seed layer가 80Ni/20Cr 합금으로 구성된 연성회로기판의 seed layer의 두께와 시효시간으로 인해 발생하는 접합 신뢰성의 차이를 관찰하였다. 본 연구에서는 두께 $25{\mu}m$의 폴리이미드 위에 각각 100, 200, $300{\AA}$ 두께의 80Ni/20Cr의 합금 조성을 가지는 seed layer를 스퍼터링 공정을 통해 형성한 후 전해도금법을 이용하여 $8{\mu}m$ 두께의 구리 전도층을 형성하였다. 접합 특성 평가를 위해 ICP 규격에 따라 전도층 패턴을 폭 3.2mm, 길이 230mm로 시편을 제작하여 50.8mm/min의 이송 속도로 각 시편당 8회의 $90^{\circ}$ peel test를 실시하였다. 또한 $85^{\circ}C$/85% 항온항습 조건하에서 각각 24, 72, 120, 168시간 동안 시효 처리 후 같은 방법으로 연성회로기판의 접합 특성을 평가하였다. 파면의 형상과 조성을 분석하기 위해 SEM (Scanning electron microscope)과 EDS (Energy-dispersive X-ray spectroscopy)를 사용하였으며, 파면의 조도 측정을 위해 AFM (Atomic force microscope)을 사용하였다. 또한 파면의 잔여물 분석을 위해 EPMA (Energy probe microanalysis)를 사용하였고 계면의 화학적 결합상태를 분석하기 위해 XPS (X-ray photoelectron spectroscopy)를 통해 파면을 분석하였다.

• Proceedings of the Korea Concrete Institute Conference
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• 2008.11a
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• pp.581-584
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• 2008

In this study, it is willing to present that fundamental data for proposing quantitatively shrinkage cracking evaluation method such as plat-ring type restrained test method. To examine suitable size of specimen of plat-ring type restrained test method, Evaluated concrete about restrained shrinkage crack properties of numerical analysis of 3D solid element using the MIDAS program, drying shrinkage deformation, restrained shrinkage stress, crack area and crack point with inside ring diameter of specimen in 100mm, 150mm, 200mm and high of Specimen in 30mm, 50mm after curing in condition of constant temperature and usual habit of temperature 20${\pm}$3$^{\circ}$C, humidity 60${\pm}$5%. As a result, it was available about suitable estimation with inside ring diameter of specimen in more than 150mm and high of Specimen in 50mm. Hereafter, it is considered that the study concerning environmental condition and mixing factor in plat-ring type restrained test method is need.

• Proceedings of the Korea Concrete Institute Conference
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• 2004.11a
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• pp.501-504
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• 2004

This paper proposes degree of hydration based shrinkage prediction model of 40MPa HPC. This model shows degree of hydration which is defined as the ratio between the hydrated cement mass and the initial mass of cement is very closely related to shrinkage deformation. In this study, degree of hydration was determined by CEMHYD-3D program of NIST. Verification of the predicted degree of hydration is performed by comparison between test results of compressive strength and estimated one by CEMHYD-3D. Proposed model is determined by statistical nonlinear analysis using the program Origin of Origin Lab. Co. To get coefficients of the model, drying shrinkage tests of four specimen series were followed with basic material tests. Testes were performed in constant temperature /humidity chamber, with difference moisture curing ages to know initial curing time effect. Verification with another specimen, collected construction field of FCM bridge, was given in the same condition as pre-tested specimens. Finally, all test results were compared to propose degree of hydration based model and other code models; AASHTO, ACI, CEB-FIP, JSCE, etc.

• Journal of Fisheries and Marine Sciences Education
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• v.18 no.2
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• pp.77-84
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• 2006

This research evaluates thermal comfort by comparing the case of maintain cooing temperature of room with the case of raising it at the point of time that human body begins to adapt. An experiment uses constant temperature & humidity chamber 2 places. Pretesting room make up summer season environment, the testing room control by air-conditioner. In condition that maintain temperature of $33^{\circ}C$. The subjects stay in the pretesting room during the 30 minute for the heat storage amount of the normal summertime. The subjects stay in the testing room under each case (case 1: maintaining $24^{\circ}C$, case 2: maintaining $26^{\circ}C$, case 3: up $1^{\circ}C$ after maintaining $24^{\circ}C$ during 30 minute, case 4: up $1^{\circ}C$ after maintaining $26^{\circ}C$ during 40 minute). 1. Result of comparison of case 1 and case 2 appears that thermal sensitive vote examine from slight cool to cool and thermal comfort examine slight comfort by temperature rise at human body adaptation point of time.2. Test of case 3 and case 4 appear similar value at thermal sensitive vote and thermal comfort.3. Through the case 2 and case 4, continuous thermal comfort maintain at $24^{\circ}C$, if raise $26^{\circ}C$, same thermal comfort maintain after a human body adaptation temperature rising effect bring energy saving.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.11 s.254
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• pp.1417-1424
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• 2006

In order to evaluate variation of fatigue life of mechanical components including engineering plastics, it is important to estimate probabilistic strain-life curves to accurately define the variation of fatigue characteristics. This paper intends to provide new assessment of P-$\varepsilon$-N (probabilistic strain-life curves) for considering the variation of fatigue characteristics in polyacetal. The fatigue strain controlled tests were conducted under constant 50% humidity and room temperature condition by a universal testing machine at strain ratio, R=0. A practical procedure is introduced to evaluate probabilistic strain-life curves. Three probabilistic distributions were used for generating P-$\varepsilon$-N curves such as normal, 2-parameter and 3-parameter Weibull. In this study, 3-parameter Weibull distribution was found to be most appropriate among assumed distributions when the probability distributions of the fatigue characteristic were examined using chi-square and Kolmogorov-Smirnov test. The more appropriate P-$\varepsilon$-N curves for these materials are generated by the proposed method considering 3-parameter Weibull distribution.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.