• 한국전기전자재료학회논문지
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• 제33권6호
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• pp.500-504
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• 2020

Heating films were prepared with composites of poly (methyl methacrylate) and conductive graphite. The as-prepared composite was deposited on a PET film and then fabricated using a bar coater to produce a film with uniform thickness. Copper electrodes were attached to both ends of the as-prepared film, and the heating characteristics of the film were analyzed while applying a DC voltage. The electrical conductivity and heating temperature of the heating films depended on the size, structure, content, and the dispersion characteristics of the graphite in the composite. The thermal energy was adjusted by controlling the electrical energy, based on the Joule heating theory. The electrical resistance of the film was altered in proportion to Ohm's law, and the heating temperature was changed according to the structure of the film (interelectrode spacing or electrode length) and the conductive graphite content. When the content of conductive graphite in the film increases, the electrical resistance decreases, and the heating temperature increases; however, there is no significant change above a certain content (50%).

• 한국전기전자재료학회논문지
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• 제28권3호
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• pp.208-212
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• 2015

This study will design the structural optimization of 21 W LED heat sink using the thermal conductive plastic materials. The thermal conductive plastic heat sink is inferior to aluminum heat sinks in thermal properties. This study will solve this problem using formability of thermal conductive plastic heat sink. A heat sink was optimized in terms of the number, and the thickness of fins and the base thickness of the heat sink, using the Heatsinkdesigner software. Also by using SolidWorks Flow simulation and thermal analysis software, the thermal characteristics of the heat sink were analyzed. As the result, the optimized heat sink has 17 fins, which are 1.5 mm thick and a 3.7 mm-thick base. The highest and the lowest temperature were $51.65^{\circ}C$ and $46.24^{\circ}C$ respectively. Based on these results, The thermal conductive plastic heat sink is considered possible to overcome heating problem when designing in complex structure.

• 대한기계학회논문집A
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• 제33권3호
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• pp.201-209
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• 2009

The objective of present research work is to design the heat conductive mould to improve cooling characteristics of the injection mould for a mouse. In order to obtain the high cooling rate of the mould, a heat conductive mould with three different materials was designed. The materials of the base structure, the mid-layer and the molding part of the heat conductive mould were chosen as Cu-Ni alloy (Ampcoloy 940) to improve the heat conductivity of the mould, Ni-Cu alloy (Monel 400) to reduce a thermal stress, injection tool steel (P21), respectively. Through the three-dimensional transient heat transfer analysis and the thermal stress analysis, the effects of the geometrical arrangement of each material on the cooling characteristics and the thermal stress distribution were examined. From the results of the analyses, a proper design of the thermal conductive mould was obtained.

• 열처리공학회지
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• 제34권3호
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• pp.107-115
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• 2021

Al-Si coated boron steel has been widely used as commercial hot stamping steel. When the steel is heated at 900~930℃ for 5 min in an electric furnace, thickness of the coating layer increases as a consequence of formation of intermetallic compounds and diffusion layer. The diffusion layer plays an important roll in blunting the propagation of crack from coating layer to base steel. Change in microstructure and coating layer of Al-Si coated boron steel after conductive heating with higher heating rate than electric furnace has been investigated in this study. Conductive-heated steel showed the martensitic structure with vickers hardness of 505~567. Both intermetallic compounds in coating layer and diffusion layer were not observed in conductive-heated steel due to rapid heating. It has been found that the conductive-heating consisting of rapid heating to 550℃ which is lower than melting point of Al-Si coating layer, slower heating to 900℃, and then 1 min holding at 900℃ is effective in forming intermetallic compound in coating layer and diffusion layer.

• 한국군사과학기술학회지
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• 제27권1호
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• pp.15-23
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• 2024

In order to avoid the high observability due to the cavity resonance or electromagnetic wave leakages from the bridge of a battleship or the cockpit of an aircraft, this paper presents a transparent conductive oxide coated structure to prevent the incoming/outgoing electromagnetic waves. Currently, most of the RCS reduction technologies were focused on radar absorbing material such as paints based on conductive or magnetic materials in the fuselage, and there is not much research on countermeasures for achieving the low observability of materials that required optical transparency in actual weapon systems. In this study, the transmission/reflection and absorption performance of the ITO coated structure according to the change of the surface resistance of the transparent conductor were analyzed. Finally, the relationship between the electromagnetic and optical characteristics was established through fabrication and measurement.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제49권12호
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• pp.698-704
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• 2000

Mechanical performances of beam shaped and bridge-shaped conductive polymer actuator have been measured and analyzed varying polymerization conditions and operating conditions such as applied current, polymerizing time, frequency of the current and kinds of electrolytes. For the application of conductive polymer actuator to micropump, the diaphragm structure has been fabricated, which is composed of polypyrrole, solid polymer electrolyte and parylene. Measured results how the possibility of the practical application of conductive polymer actuator.

• Advances in nano research
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• 제3권1호
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• pp.49-54
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• 2015

The structure represents symmetrical metal electrode (gate 1) - front $SiO_2$ layer - n-Si nanowire FET - buried $SiO_2$ layer - metal electrode (gate 2). At the symmetrical gate voltages high conductive regions near the gate 1 - front $SiO_2$ and gate 2 - buried $SiO_2$ interfaces correspondingly, and low conductive region in the central region of the NW are formed. Possibilities of applications of nanosize FETs at the deep inversion and depletion as a distributed capacitance are demonstrated. Capacity density is an order to ${\sim}{\mu}F/cm^2$. The charge density, it distribution and capacity value in the nanowire can be controlled by a small changes in the gate voltages. at the non-symmetrical gate voltages high conductive regions will move to corresponding interfaces and low conductive region will modulate non-symmetrically. In this case source-drain current of the FET will redistributed and change current way. This gives opportunity to investigate surface and bulk transport processes in the nanosize inversion channel.

• Corrosion Science and Technology
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• 제6권2호
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• pp.44-49
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• 2007

Dimensionally stable anodes have been widely used to cathodically protect the metallic materials in corrosive environments including concrete structure as the insoluble anode. Lifespan of the anode for concrete construction can be determined by NACE TM0294-94 method. Lifespan of conductive oxide electrode would be affected by thermal treatment condition in the process of sol-gel coatings. This work aims to evaluate the effect of thermal treatment temperature on the lifespan of the $RuO_{2}$ electrode. $450^{\circ}C$ treated conductive oxide electrode showed the excellent properties and its lifespan was evaluated to be over 88 years in 3% NaCl, 4% NaOH, and simulated pore water. This behavior was related to the formation of $RuO_{2}$.

• 마이크로전자및패키징학회지
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• 제12권1호
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• pp.9-16
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• 2005

This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.237.2-237.2
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• 2013

ReRAM cell, also known as conductive bridging RAM (CBRAM), is a resistive switching memory based on non-volatile formation and dissolution of conductive filament in a solid electrolyte [1,2]. Especially, Chalcogenide-based ReRAM have become a promising candidate due to the simple structure, high density and low power operation than other types of ReRAM but the uniformity of switching parameter is undesirable. It is because diffusion of ions from anode to cathode in solid electrolyte layer is random [3]. That is to say, the formation of conductive filament is not go through the same paths in each switching cycle which is one of the major obstacles for performance improvement of ReRAM devices. Therefore, to control of nonuniform conductive filament formation is a key point to achieve a high performance ReRAM. In this paper, we demonstrated the enhanced repeatable bipolar resistive switching memory characteristics by spreading the Ag nanocrystals (Ag NCs) on amorphous GeSe layer compared to the conventional Ag/GeSe/Pt structure without Ag NCs. The Ag NCs and Ag top electrode act as a metal supply source of our devices. Excellent resistive switching memory characteristics were obtained and improvement of voltage distribution was achieved from the Al/Ag NCs/GeSe/Pt structure. At the same time, a stable DC endurance (>100 cycles) and an excellent data retention (>104 sec) properties was found from the Al/Ag NCs/GeSe/ Pt structured ReRAMs.