• Proceedings of the Korean Society of Precision Engineering Conference
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• 2008.06a
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• pp.577-578
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• 2008

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.223-224
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• 2011

• Polymer(Korea)
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• v.25 no.2
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• pp.293-301
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• 2001

Electrically conductive carbon fiber/high density polyethylene (CF/HDPE) composite films were fabricated by new method, so called electron-ion technology (EIT) and the effects of CF epoxy sizing on the volumetric resistivity. tensile strength and interphase properties of the films were investigated. While epoxy sizing increased conductivity of composite films resulting from enhanced tunneling effect it reduced interphase adhesion between CF and HDPE because polar epoxy sizing and nonpolar HDPE are incompatible. Consequently epoxy sized CF(CF(S)) caused significant reduction in the volumetric resisitivity and tensile strength of composite films when compared with unsized CF(CF(U)). Epoxy sizing reduced nucleating efficiency of CF(S), therefore CF(S)/HDPE composite films showed nonuniform transcrystalline layer when compared with CF(U)/HDPE composite films.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.1
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• pp.33-38
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• 2007

We studied a bonding at low temperature using polymer bump and Non-Conductive Adhesive (NCA), and studied the reliability of the polymer bump/Al pad joints. The polymer bumps were formed on oxidized Si substrates by photolithography process, and the thin film metals were formed on the polymer bumps using DC magnetron sputtering. The substrate used was AL metallized glass. The polymer bump and Al metallized glass substrates were joined together at $80^{\circ}C$ under various pressure. Two NCAs were applied during joining. Thermal cycling test ($0^{\circ}C-55^{\circ}C$, cycle/30 min) was carried out up to 2000 cycles to evaluate the reliability of the joints. The bondability was evaluated by measuring the contact resistance of the joints through the four point probe method, and the joints were observed by Scanning Electron Microscope (SEM). The contact resistance of the joints was $70-90m{\Omega}$ before the reliability test. The joints of the polymer bump/Al pad were damaged by NCA filler particles under pressure above 200 MPa. After reliability test, some joints were electrically failed since thinner metal layers deposited at the edge of bumps were disconnected.

• Polymer Science and Technology
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• v.16 no.1
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• pp.48-56
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• 2005

• Polymer(Korea)
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• v.37 no.4
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• pp.513-517
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• 2013

A novel conductive composite thin film was prepared for the first time by hybridization between polybenzoxazine (PBZ) having high heat resistance property and conductive graphene. Mechanically robust conductive graphene/PBZ composite thin films could effectively be prepared by a simple thermal treatment, which simultaneously induces reduction of graphene oxide (GO) and crosslinking reaction of benzoxazine monomer. Graphene sheets seem to be uniformly dispersed up to 3 wt% graphene content in the composite thin film as shown in the results of chemical/crystal structural and morphological analyses. This efficient route for making graphene/PBZ composite thin film would provide simultaneous improvement of mechanical property as well as electrical conductivity.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.07a
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• pp.1039-1042
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• 2001

A method for designing antireflection (AR) and antistatic (AS) films by the use of conducting polymer as an electrically conductive transparent layer is proposed. The conducting AR film is composed of four-layer with alternating high and low refractive index layer: silicon dioxide (n=1.44) and titanium dioxide (n=2.02) prepared at low temperature by sol-gel method are used as the low and high refractive index layer, respectively. The 3,4-polyethylenedioxythiophene (PEDOT) which has the sheet resistance of 10$^4$$\Omega$/$\square$ is used as a conductive layer. Optical constant of ARAS film was measured by the spectroscopic ellipsometer and from the measured optical constants the spectral properties such as reflectance and transmittance were simulated in the visible region. The reflectance of ARAS films on glass substrate was below 0.8 %R and the transmittance was higher than 95 % in the visible wavelength (400-700 nm). The measured AR spectral properties was very similar to its simulated results.

• Composites Research
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• v.27 no.6
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• pp.242-247
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• 2014

The fabrication of flexible electrodes coated on the surface of a dielectric elastomer film, which is a type of electroactive polymer (EAP), was carried out. Controlled amounts of Xylitol powder were added (10, 30, 50 and 70 wt%) to the commercial conductive polymer (PEDOT:PSS) to enhance resilience of the electrode. To check resilience of the fabricated composite electrodes, tensile tests were carried out using silicone films coated with the polymer electrodes. From the test results, it was found that 70 wt% Xylitol containing conductive polymer had excellent elongation and high failure strains. Furthermore, surface of the silicone film was uniformly polished with various abrading papers to enhance the wettability of the conductive polymers on the surface of the silicone film. It was found that the silicone film polished with #120 abrading paper had the best wettability and guaranteed excellent bonding behavior.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2007.05a
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• pp.3-6
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• 2007

The Light brightness is to enhance the luminescence efficiency of phosphor including conductive material. In preparing the anode layer, phosphors mixed with conductive material prepared with pastes of polymer resin using by screen printing method. When the prepared anode layer bombarded by cold electron from emitter of cathode, it give rise to form the secondary electron from those of conductive materials such as ITO powder. Furthermore, we are expect to enhance the luminescence efficiency more than without conductive material.

• Proceedings of the KSME Conference
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• 2008.11a
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• pp.1908-1912
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• 2008

Conductive polymers, prepared by mixing electrically conductive fillers with a suitable polymeric formulation, are widely used in applications such as interconnecting materials for high density electronic packaging. However, resins of conductive pastes used as binders and vehicles are generally nonconductive, so that they may prevent the electrical contact between conductive fillers and reduce electron transmission. In this study, we improved conductivity of silver paste by the incorporation of cabon nanotubes. It is important to achieve homogeneous dispersion of CNTs to act as reinforcements efficiently in matrix. We carried out acid treatment on nanotubes for their homogeneous dispersion in silver/conducting polymer matrix. The dispersion states of nanotubes were characterized by raman spectra and filed emission scanning electron microscope. The electrical resistivity of CNTs incorporated silver paste was also measured by 4-point probe method.