• Title/Summary/Keyword: Conductive polymer

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A Study of Electrospun PVDF on PET Sheet

  • Chanunpanich, Noppavan;Lee, Byung-Soo;Byun, Hong-Sik
    • Macromolecular Research
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    • v.16 no.3
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    • pp.212-217
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    • 2008
  • PVDF ($Kynar^{(R)}$ 761) nanofibers were made by electrospinning with an external voltage of 6-10 kV, a traveling distance of 7-15 cm and a flow rate of 0.4-1 mL/h. Although the mean diameter of the fibers has not changed significantly, the conditions affected the change in diameter distribution. This was attributed to interactions, both attraction and repulsion, between the positive charges on the polymer solutions and the electrically grounded collector. Higher voltages and traveling distance increased the level of attraction between the positive charge on the polymer solution and the electrically grounded collector, resulting in a narrow diameter distribution, In addition, a high flow rate allowed a high population of uniformly charged solutions to travel to the grounded collector, which resulted in a narrow diameter distribution. The optimum conditions for electrospinning of PVDF in DMAc/acetone (3/7 by wt) were a collector voltage of 6 kV, a syringe tip to collector of 7 cm, a flux rate of 0.4 mL/h and 10 kV, 10 cm, 1 mL/h, Since PVDF is widely used as a filtration membrane, it was electrospun on a PET support with a rotating drum as a grounded collector. Surprisingly, some straight nanofibers were separated from the randomly deposited nanofibers. The straight nanofiber area was transparent, while the randomly deposited nanofiber area was opaque. Both straight nanofibers and aligned nanotibers could be obtained by manipulating the PET drum collector. These phenomena were not observed when the support was changed to an Al sheet. This suggests that a pseudo dual collector was generated on the PET sheet. No negative charge was created because the PET sheet was not a conductive material. However, less charge was created when the sheet was not perfectly attached to the metal drum. Hence, the nanotibers jumped from one grounded site to the nearest one, yielding a straight nanofiber.

Development of bio-inspired hierarchically-structured skin-adhesive electronic patch for bio-signal monitoring (생체정보 진단을 위한 생체모사 계층구조 기반 피부 고점착 전자 패치 개발)

  • Kim, Da Wan
    • The Journal of the Convergence on Culture Technology
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    • v.8 no.5
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    • pp.749-754
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    • 2022
  • High adhesion and water resistance of the skin surface are required for wearable and skin-attachable electronic patches in various medical applications. In this study, we report a stretchable electronic patch that mimics the drainable structure pattern of the hexagonal channels of frog's pads and the sucker of an octopus based on carbon-based conductive polymer composite materials. The hexagonal channel structure that mimics the pads of frogs drains water and improves adhesion through crack arresting effect, and the suction structure that mimics an octopus sucker shows high adhesion on wet surfaces. In addition, the high-adhesive electronic patch has excellent adhesion to various surfaces such as silicone wafer (max. 4.06 N/cm2) and skin replica surface (max. 1.84 N/cm2) in dry and wet conditions. The high skin-adhesive electronic patch made of a polymer composite material based on a polymer matrix and carbon particles can reliably detect electrocardiogram (ECG) in dry and humid environments. The proposed electronic patch presents potential applications for wearable and skin-attachable electronic devices for detecting various biosignals.

Surface Treatment of Transparent Conductive films and Polymer Materials (투명전도막 및 고분자 재료의 표면처리)

  • Lee, Bong-Ju;Lee, Hyun-Kyu;Chung, Soo-Bok;Lee, Kyung-Sub;Kim, Hyung-Kon;Chung, Hyoan-Ki
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.05a
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    • pp.15-17
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    • 2001
  • A new possibility of our atmospheric cold plasma torch has been examined on the surface treatment of an air-exposed vulcanized rubber compound. The plasma treatment effect was evaluated by the bondability with another rubber compound using a polyurethane adhesive.

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Electrical properties of polyethylene composite films filled with nickel powder and short carbon fiber hybrid filler

  • Mironov, V.S.;Kim, Seong Yun;Park, Min
    • Carbon letters
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    • v.14 no.2
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    • pp.105-109
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    • 2013
  • Effects of the amount of nickel powder (Ni) in Ni-carbon fiber (CF) hybrid filler systems on the conductivity(or resistivity) and thermal coefficient of resistance (TCR) of filled high density polyethylene were studied. Increases of the resistivity and TCR with increasing Ni concentration at a given hybrid filler content were observed. Using the fiber contact model, we showed that the main role of Ni in the hybrid filler system is to decrease the interfiber contact resistance when Ni concentration is less than the threshold point. The formation of structural defects leading to reduced reinforcing effect resulted in both a reduction of strength and an increase of the coefficient of thermal expansion in the composite film; these changes are responsible for the increases of both resistivity and TCR with increasing Ni concentration in the hybrid filler system.

The Electrical Characteristics of the Antistatic Wafer Carrier (대전 방지용 웨이퍼 캐리어의 전기적 특성)

  • Chea, Jong-Yun;Yoon, Jong-Kuk;Kang, Ok-Gu;Ryu, Bong-Jo;Koo, Kyung-Wan
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.63 no.2
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    • pp.319-324
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    • 2014
  • The wafer carrier is made of PP, PC, PE resin which have excellent heat and chemical resistance and electrical properties. However, particle generation has become a problem due to static electricity generated in the carrier. Some conductive material such as carbon black (CB) and carbon fiber (CF) are added for the purpose of anti-static, however, additional for motility and particle contamination problems due to high carbon content occurs. In this paper, the electrical characteristics and workability are observed and compared by adding low Carbon Nono Tube(CNT) to each PP, PC and PE resin to solve the problem.

A Development of Coatable Conductive Polymer (코팅가능한 전도성 고분자 개발)

  • 김종은;심재훈;서광석;윤호규;구자윤;박영인
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 1998.11a
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    • pp.223-226
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    • 1998
  • Organic conducting N-methyl phenazinium TCNQ (7,7,8,8-tetracyanoquinonedimethane) ion radical salt was synthesized and characterized by FTIR, EA. After blending this material with PMMA using NMP/DMF, the solution was bar-coated on a PET film and dried at 40$^{\circ}C$. The optical micrograph showed the fibril crystals. The surface resistivity was 10$\^$5/ $\Omega$/$\square$. The conductivity decreased considerably at temperatures above 80$^{\circ}C$, although it decreased slightly at RT and 4$^{\circ}C$.

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Thermal and Electrical Properties of Conductive Polymer and PMMA, Eccogel Blend (도전성 고분자와 PMMA 및 Eccogel Blend의 열적 성질 및 전기적 특성에 관한 연구)

  • Park, Seong-Ja;Kim, Byung-Chul;Kim, Dong-Keun;Seul, Soo-Duk
    • Elastomers and Composites
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    • v.24 no.3
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    • pp.185-192
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    • 1989
  • The thermal degradation of the homopolymer poly(methyl methacrylate)(PMMA)/tetra cyano quino dimethane(TCNQ) blend and Eccogel/TCNQ blend were carried out using the thermogravimetric method in the stream of nitrogen gas with 60ml/min at various heating rate from 1 to $20^{\circ}C/min$. Friedman and Ozawa mathermatical methods were used to obtain the value of activation energy. Produced electrical properties and activation energy by electric conductivity method that used LCR meter.

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Fabrication and Straining Model of a CNT/EAP Composite Film (카본나노튜브/도전성폴리머(CNT/EAP) 복합재 필름의 제조 및 특성분석)

  • Zhang, Shuai;Kim, Cheol
    • Proceedings of the Korean Society For Composite Materials Conference
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    • 2005.11a
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    • pp.117-120
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    • 2005
  • The relationship between strain and applied potential was derived for composite actuators consisting single-wall carbon nanotubes (SWNTs) and conductive polymers (CPs). During deriving the relationship, an electrochemical ionic approach is utilized to formulate the electromechanical actuation of the composite film actuator. The results show that the well-aligned SWNTs composite actuator can give good actuation responses and high actuating forces available. The actuation is found to be affected by both SWNTs and CPs components and the actuation of SWNTs component has two kinds of influences on that of the CPs component: reinforcement at the positive voltage and abatement at the negative voltage. CNT/EAP was fabricated successfully using the chemical polymerization method.

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Development of a Paper Strain Gauge using Inkjet-printing Technology (잉크젯 인쇄기술을 이용한 종이 스트레인게이지 개발)

  • Lee, Young Tae
    • Journal of the Semiconductor & Display Technology
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    • v.14 no.2
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    • pp.23-27
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    • 2015
  • In this paper, eco-friendly paper strain gauge was fabricated in the way of printing strain gauge on paper substrate, using PEDOT:PSS ink and inkjet printer technology. As a p-type conductive high polymer, PEDOT:PSS is known to be piezoresistive effect. I formed a strain gauge by connecting in parallel 5 lines of $60{\mu}m$ width printed with PEDOT:PSS. To minimize surrounding influence such as temperature, I formed wheat-stone bridge by combining 4 strain gauges (quarter-bridge strain gauge) which were made up of PEDOT:PSS 5 lines and measured. In quarter-bridge strain gauge, only two strain gauges, facing each other, arranged in strain and horizontal direction were deformed while the other two strain gauge of vertical direction were not. Therefore, quarter-bridge strain gauge showed the output of half bridge. The fabricated quarter-bridge strain gauge had output sensitivity of $105.6{\mu}V/V{\cdot}mm$ and its output linearity was relatively good.

Basic Research For The 3DCD (3D Circuit Devices) (3DCD (3D Circuit Devices) 개발을 위한 기초 연구)

  • Yun, Hae Yong;Kim, Ho Chan
    • Journal of the Korean Society for Precision Engineering
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    • v.31 no.12
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    • pp.1061-1066
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    • 2014
  • Generally electrical circuits are fabricated as PCB(Printed Circuit Board) and mounted on a casing of the product. And it requires lots of other parts and some labor for assembly. Recently a molding technology is increasingly applied to embed simple circuits on a plastic casing. The technology is called as MID(Molded Interconnected Device). Therefore this paper introduces a new MID fabrication process by using direct 3D printing technology.