• Title/Summary/Keyword: Conductive parallel pattern

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Crack Monitoring of RC beam using Surface Conductive Crack Detection Patterns based on Parallel Resistance Network (병렬저항회로에 기반한 표면 전도성 균열감지패턴을 사용한 콘크리트 휨 부재의 균열 감지 )

  • Kyung-Joon Shin;Do-Keun Lee;Jae-Heon Hong;Dong-Chan Shin;Jong-Hyun Chae
    • Journal of the Korea institute for structural maintenance and inspection
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    • v.27 no.5
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    • pp.67-74
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    • 2023
  • A large number of concrete structures are built and used around the world. To ensure their safe and continuous use, these structures require constant inspection and maintenance. While man-powered inspection and maintenance techniques are efficient, they can only provide intermittent status checks at the time of on-site inspection. Therefore, there is a growing need for a system that can continuously monitor the condition of the structure. A study was conducted to detect cracks and damage by installing a conductive coating on the surface of a concrete structure. A parallel resistance pattern that can monitor the occurrence and progression of cracks was developed by reflecting the structural characteristics of concrete structure. An empirical study was conducted to veryfy the application of the proposed method. The crack detection pattern was installed on the reinforced concrete beams, and the crack monitoring method was verified through applying a load on the beams.

Patent Trend Report for PCB Parallel Build-up (PCB일괄적층에 관한 특허동향분석)

  • Jeong, In-Seong;Lee, Young-Uk
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.06a
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    • pp.14-15
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    • 2006
  • Application of the parallel Build-up is increasing continuously. This report presents about the PCB Build-up technology since 2000. Among the parallel build-up technologies, PALAP application - after making the via, filling the via with electric conductive paste, then expose to make wiring pattern and put them by layer without any glue or middle - is actively developing, especially DENSO company.

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Dielectric Breakdown Analysis of Bone-Like Materials with Conductive Channels (전도채널을 갖는 뼈와 유사한 재료의 절연파괴 해석)

  • Lee, Bo-Hyun;Lin, Song;Beom, Hyeon-Gyu
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.35 no.6
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    • pp.583-589
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    • 2011
  • The dielectric breakdown of bone-like materials subject to purely electric fields is investigated. In general, these materials consist of some layers with stronger dielectric strength and others with weaker dielectric strength in a parallel staggered pattern. The growth of the conductive channel is impeded during penetration of the weaker layer in the bone-like material because the electric-field concentration is relieved. The electric-field distribution around the head of the tubular channel is obtained from finite element analysis. The dielectric strength of the bone-like material is evaluated using the J integral, and some parameters affecting the dielectric strength are determined. It is shown that the J-integral values are reduced with an increase in the breakdown area in the weaker layer. It is also found that the ratio of the permittivity of the weaker layer to that of the stronger layer can strongly affect the dielectric breakdown.