• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.2
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• pp.97-103
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• 2008

In this investigation, conductivity of conductive inks was measured. A particular attention has been given to the effect of metal powders with various conductivity on the overall conductivity of the bulk ink. The conductivity of various solutions simulating conductive inks consisting of copper and silver was measured and the results have been discussed in relation to various applications of conductive inks in practice. A conductivity model simulating systems consisting of various materials has been introduced and the results were discussed. Materials of good conductivity are adversely affected by mixing with materials of poor conductivity simply through serial connection. However, parallel connection has rather little effect on the overall conductivity. The practical implication of various mixtures of materials on conductive inks has been discussed.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.1
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• pp.126-131
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• 2008

In this investigation, various factors affecting manufacturing conductive inks are presented, examined and discussed. The discussion includes inherent difficulties in making conductive inks successful and at the same time offers ways in which these difficulties might be overcome. One of the solutions to overcome such difficulties is to use low melting metals and alloys. This aspect is also detailed.

• 한국정보디스플레이학회:학술대회논문집
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• 2007.08a
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• pp.721-723
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• 2007

Commercial conductive metal inks are available, but metals used in these have unsuitable work function for efficient OLED device performance. Metals with low work function tend to oxidize easily, which makes it challenging to develop low work function metal inks. In this research we describe printed low work function Al cathode.

• Polymer Science and Technology
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• v.19 no.1
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• pp.35-39
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• 2008

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1491-1494
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• 2005

We have studied ink-jet printing method for patterning conductive line on flexible plastic substrates. Synthesized silver nano-particles of ${\sim}$20nm were used for the conductive ink and the printed patterns exhibit a smooth line whose linewidth is below 100 ${\mu}m$. This ink-jet printing technique can be applied to flexible displays and electronics.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.2.3-2.3
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• 2011

With increased interest in printed devices, various metal nano inks have been investigated as candidates materials for printed electrodes and wiring as well as conductive film substituting photo-lithography process. Recent advances in organic conductive polymer allow us to fabricate high performance printed device. Meanwhile, there was several attempts to fabricate conductive films by mixing conductive polymer with metal nano-particle or nano-wires. The presence of Ag nanowires in conductive polymer mixture have shown good potential in organic photovoltaic devices.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.799-802
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• 2008

The metal films ink-jetted using the conductive ink based on a mixture of copper and silver nanoparticles were investigated. The porosity and resistivity of films were minimized by adjusting the mixing ratio of Cu and Ag nanoparticles. We demonstrated that the printed tracks with good conductivity could be obtained at sufficiently lower annealing temperatures where plastic substrates could be used.

• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.12.1-12.1
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• 2009

For the micro conductive line, memory device fabrication process use many expensive processes such as manufactur-ing of photo mask, coating of photo resist, exposure, development, and etching. However, direct printing technology has the merits about simple and cost effective processes because nano-metal particles contained inks are directly injective without mask. And also, this technology has the advantage about fabrication of fine pattern line on various substrates such as FPCB, PCB, glass, polymer and so on. In this work, we have fabricated the fine and thick metal pattern line on flexible PCB substrate for the next generation electronic circuit using Ag nano-particles contained ink. To improve the line tolerance on flexible PCB, metal lines are fabricated by sequential prinitng method. Sequential printing method has vari-ous merits about fine, thick and high resolution pattern lines without bulge.

• Journal of Powder Materials
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• v.20 no.2
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• pp.120-124
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• 2013

This study is carried out to develop the new process for the fabrication of ultra-fine electrodes on the flexible substrates using superhydrophobic effect. A facile method was developed to form the ultra-fine trenches on the flexible substrates treated by plasma etching and to print the fine metal electrodes using conductive nano-ink. Various plasma etching conditions were investigated for the hydrophobic surface treatment of flexible polyimide (PI) films. The micro-trench on the hydrophobic PI film fabricated under optimized conditions was obtained by mechanical scratching, which gave the hydrophilic property only to the trench area. Finally, the patterning by selective deposition of ink materials was performed using the conductive silver nano-ink. The interface between the conductive nanoparticles and the flexible substrates were characterized by scanning electron microscope. The increase of the sintering temperature and metal concentration of ink caused the reduction of electrical resistance. The sintering temperature lower than $200^{\circ}C$ resulted in good interfacial bonding between Ag electrode and PI film substrate.

• Journal of the Korean Ceramic Society
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• v.49 no.5
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• pp.417-422
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• 2012

Copper nano particles have been considered as the materials for conductive ink due to its good thermal, electrical conductivity and low cost. However, copper nanoparticles oxidize easily, decreasing dispersion stability and electrical conductivity. Therefore, it is important to develop a method to minimize oxidation of copper nano particles to improve its dispersion stability property in copper nano ink. In this study, copper nano particles were coated with 1-Octanethiol VSAM(Vaporized Self Assembled Multilayers) to prevent oxidation and coated copper powders were dispersed in conductive ink successfully by studying its relationship of different chain length of solvents to 1-Octanethiol coating layer to fabricate nano ink. Various alcohol solvents, such as 1-Hexanol, 1-Octanol, and 1-Decanol were used. The coating layer was observed using FESEM and TEM. Furthermore, dispersion of copper nano particles in nano inks, was characterized using Turbiscan analyzer, viscometer, and contact angle measurement tool.