• 한국고분자학회지:고분자과학과기술
• /
• 제3권1호
• /
• pp.3-12
• /
• 1992

• 한국정밀공학회지
• /
• 제29권1호
• /
• pp.41-47
• /
• 2012

The LDS(Laser Direct Structuring) is one of the new direct writing methods to fabricate conductive patterns by energy beam. It uses thermoplastic polymers with an additive compound that serves as plating seed after the activation by laser. The advantages of LDS include the miniaturization of electrical components, design flexibility, and a reduced number of production steps. The purpose of this study is to investigate the fundamental mechanism for LDS and the characteristics of conductive patterns by laser parameters. These results were studied by SEM, EDX, and XPS analysis. We have used a 20W pulse-modulated fiber laser and copper electroless plating to fabricate conductive patterns on polymer. The result showed that electroless copper plating seed caused the laser cracking of additive compound. In particular, the additive compound contained in copper metal oxides atoms will be changed to copper metal elements. Also, the characteristics of conductive patterns were dependent on laser parameter, especially laser fluence.

• 한국응용과학기술학회지
• /
• 제30권3호
• /
• pp.472-479
• /
• 2013

The conductive polymer composites recently became increasingly to many fields of industry due to their electrical properties. To understand these properties of composites, electrical properties were measured and were studied relatively. Electrical conductivity measurements showed percolation phenomena. Percolation theories are frequently applied to describe the insulator-to-conductor transitions in composites made of a conductive filler and an insulating matrix. It has been showed both experimentally and theoretically that the percolation threshold strongly depends on the aspect ratio of filler particles. The critical concentration of percolation formed is defined as the percolation threshold. This paper was to study epoxy resin filled with copper. The experiment was made with vehicle such as epoxy resin replenished with copper powder and the study about their practical use was performed in order to apply to electric and electronic industry as well as general field. The volume specific resistance of epoxy resin composites was 3.065~13.325 in using copper powder. The weight loss of conductive composites happened from $350^{\circ}C{\sim}470^{\circ}C$.

• 한국응용과학기술학회지
• /
• 제31권2호
• /
• pp.329-336
• /
• 2014

The conductive polymer composites have attracted considerable attention in the field of industry due to their electrical properties. To understand electrical properties of the composites, their volume specific resistance was measured. Electrical conductivity results showed percolation phenomena. Percolation theories are frequently applied to describe the insulator-to-conductor transitions in the composites composed of conductive filler and insulating matrix. It was found that the percolation threshold strongly depends on the aspect ratio of filler particles. The critical concentration of percolation formed is defined as the percolation threshold. The purpose of this study was to examine electrical properties of the epoxy resins filled with nickel. The sample was prepared using vehicle such as epoxy resin replenished with nickel powder, and the evaluation on their practical use was performed in order to apply them to electric and electronic industry as well as general field. The volume specific resistance of epoxy resin composites was 4.666~13.074 when using nickel powder. Weight loss of the conductive composites took place at $350^{\circ}C{\sim}470^{\circ}C$.

• 한국섬유공학회:학술대회논문집
• /
• 한국섬유공학회 2003년도 가을 학술발표회 논문집
• /
• pp.169-170
• /
• 2003

There was little development in transparent conductive polymer films and their limited studies have been mainly focused on polymer films coated by water-soluble PEDOT doped with the polymeric counteranion poly(4-styrenesulfonate) (PEDOT-PSS)[1-3]. However PEDOT-PSS as coating material has some difficulties because of high viscosity and low solubility in organic solvent except for in water. In this study, in order to extend practical applications of PEDOT and to prepare conductive PC films, we tried to prepare PEDOT-coated PC films and investigated their conductivity and thermal stability. (omitted)

• 한국고분자학회지:고분자과학과기술
• /
• 제2권3호
• /
• pp.149-157
• /
• 1991

• 한국신재생에너지학회:학술대회논문집
• /
• 한국신재생에너지학회 2011년도 춘계학술대회 초록집
• /
• pp.116.1-116.1
• /
• 2011

Materials with a combination of high electrical conductivity and optical transparency are important components of many electronic and optoelectronic devices such as liquid crystal displays, solar cells, and light emitting diodes. In this study, to fabricate a low-resistance and high optical transparent electrode film for organic photovoltaic, the following steps were performed: the design and manufacture of an electroforming stamp mold, the fabrication of thermal roll imprinted (TRI) poly-carbonate (PC) patterned films, the manufacture of high-conductivity and low-resistance Ag paste which was filled into patterned PC film using a doctor blade process and then coated with a thin film layer of conductive polymer by a spin coating process. As a result of these imprinting processes the PC films obtained a line width of $10{\pm}0.5{\mu}m$, a channel length of $500{\pm}2{\mu}m$, and a pattern depth of $7.34{\pm}0.5{\mu}m$. After the Ag paste was used to fill part of the patterned film with conductive polymer coating, the following parameters were obtained: a sheet resistance of $9.65{\Omega}$/sq, optical transparency values were 83.69 % at a wavelength of 550 nm.

• 폴리머
• /
• 제24권5호
• /
• pp.673-681
• /
• 2000

플라즈마 처리가 나일론 6 직물의 표면 특성과 폴리아닐린/나일론 6 복합직물의 전도도에 미치는 영향을 연구하였다. 산소 플라즈마로 처리한 나일론 6 직물의 표면을 XPS 분석을 통해 확인한 결과 C-O, C-OH 등의 관능기가 도입되었으며, 이는 직물과 폴리아닐린의 결합력을 향상시켜 전기 전도도와 폴리아닐린 부착량을 증가시켰다. 또한 산소 플라즈마로 처리된 폴리아닐린/나일론 6 복합직물은 세탁과 마모에서도 우수한 안정성을 나타내었다. 초음파 처리는 매질에 발생된 cavitation과 진동에 의해 직물 내부로 아닐린을 확산시키는데 효과적이었으며, 이는 폴리아닐린/나일론 6 복합직물의 전기 전도도를 크게 향상시켰다. 아닐린의 농도와 중합욕에 침지 휫수가 증가함에 따라 전기 전도도와 복합직물의 형태안정성에 대한 영향을 살펴보았는데, 단량체 농도는 0.5M 까지는 증가함에 따라 전도도가 향상되었으며, 침지 횟수가 증가함에 따라서도 전도도가 향상되었다.

• 폴리머
• /
• 제38권6호
• /
• pp.782-786
• /
• 2014

세라믹 방열 복합체의 특성 비교를 위해 casting method로 제작하였으며, 이들의 광학적 이미지와 단면 FE-SEM 분석을 실시하였다. 각각의 복합체의 열전도성 특성을 비교 분석하였으며, silicon carbide(SiC)의 분산도 문제를 해결하기 위해 wetting process를 도입하여 SiC/epoxy 복합체를 제작하였다. 기존의 방법에서 발견된 복합체 내공극과 분산도 문제가 wetting process를 통해 향상되었으며, 충전제 함량에 따른 열전도성 특성을 분석하였다. SiC 복합체의 함량에 따른 공극률 해석을 통해 70 wt% SiC 복합체에서 가장 높은 열전도도 값을 보였으며, 이들의 단면 FE-SEM 분석을 통해 복합체 내의 충전제 분산도를 확인하였다.

• 폴리머
• /
• 제24권2호
• /
• pp.268-275
• /
• 2000

고전기장을 이용하여 제조한 도전성 탄소섬유/폴리에틸렌 복합필름에 있어서 고분자 점착하층의 두께가 제조된 필름의 체적비저항과 인장강도에 미치는 효과에 대하여 연구하였다. 탄소섬유(CF) 함량과 CF 층밀도에 따라 제조된 필름의 체적비저항과 인장강도의 점착하층에 대한 의존성의 양상은 복잡하게 나타났다. 이는 점착하층의 증가에 따라서 필름 하층면에 중심부나 위쪽에 비하여 CF 농도가 낮은 절연성 고분자층의 두에가 증가하고 필름 상층면 근처에서는 CF의 함침에 필요한 고분자 매트릭스의 양이 적어져 매트릭스 함침이 불충분하여 기공이 포함된 구조를 형성시키는 효과와 증가된 매트릭스의 유동성을 바탕으로 CF 분산성이 향상되고 동시에 보다 치밀한 구조가 형성되는 두 가지 상반되는 효과의 상대적 기여 정도의 차이를 통하여 설명할 수 있었다. 이들 결과는 전자파 차폐용 고도전성 고분자 차폐필름의 제조에 있어서 전기적 성질과 기계적 성질의 최적화하는데 중요하다.