• 한국재료학회지
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• 제25권12호
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• pp.683-689
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• 2015

In this study, the properties of Ag-coated $TiO_2$ nanoparticles were observed, while varying the molar ratio of water and $Ag^+$ for the surfactant and $TiO_2$. According to the XRD results, each nanoparticle showed a distinctive diffraction pattern. The intensity of the respective peaks and the sizes of the nanoparticles increased in the order of AT1($R_1=5$)(33.3 nm), AT2($R_1=10$)(38.1 nm), AT3($R_1=20$)(45.7 nm), AT4($R_1=40$)(48.6 nm) as well as AT5($R_2=0.2$, $R_3=0.5$)(41.4 nm), AT6($R_2=0.3$, $R_3=1$)(45.1 nm), AT7($R_2=0.5$, $R_3=1.5$)(49.3 nm), AT8($R_2=0.7$, $R_3=2$)(57.2 nm), which values were consistent with the results of the UV-Vis. spectrum. The surface resistance of the conductive pastes fabricated using the prepared Ag-coated $TiO_2$ nanoparticles exhibited a range 7.0~9.0($274{\sim}328{\mu}{\Omega}/cm^2$) times that of pure silver paste(ATP)($52{\mu}{\Omega}/cm^2$).

• 한국태양에너지학회 논문집
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• 제38권1호
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• pp.45-55
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• 2018

Environmentally benign lead-free solder coated ribbon (e. g. SnCu, SnZn, SnBi${\cdots}$) has been intensively studied to interconnect cells without lead mixed ribbon (e. g. SnPb) in the crystalline silicon(c-Si) photovoltaic modules. However, high melting point (> $200^{\circ}C$) of non-lead based solder provokes increased thermo-mechanical stress during its soldering process, which causes early degradation of PV module with it. Hence, we proposed low-temperature conductive paste (CP) based tabbing method for lead-free ribbon. Modules, interconnected by the lead-free solder (SnCu) employing CP approach, exhibits similar output without increased resistivity losses at initial condition, in comparison with traditional high temperature soldering method. Moreover, 400 cycles (2,000 hour) of thermal cycle test reveals that the module integrated by CP approach withstands thermo-mechanical stress. Furthermore, this approach guarantees strong mechanical adhesion (peel strength of ~ 2 N) between cell and lead-free ribbons. Therefore, the CP based tabbing process for lead free ribbons enables to interconnect cells in c-Si PV module, without deteriorating its performance.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.257-261
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• 2004

Recently, Pb free solder technologies are developed, and start using for many packaging items. But this technology contains many problems. They are very high re-flow temperature and high cost than normal solder paste. Specially, high re-flow temperature effects heavy damage to packaging and occur many crack to packaging. We developed special ACI (anisotropic conductive ink) that becomes substitution of solder paste. This technology cans adhesive lower temperature such as $120\~150^{\circ}C$. Adhesion time is very short, too. This technology is suitable for mass production.

• 한국분말재료학회지
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• 제24권5호
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• pp.395-399
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• 2017

Solder paste is widely used as a conductive adhesive in the electronics industry. In this paper, nano and microsized mixed lead-free solder powder (Sn-Ag-Cu) is used to manufacture solder paste. The purpose of this paper is to improve the storage stability using different types of solvents that are used in fabricating the solder paste. If a solvent of sole acetate is used, the nano sized solder powder and organic acid react and form a Sn-Ag-Cu malonate. These formed malonates create fatty acid soaps. The fatty acid soaps absorb the solvents and while the viscosity of the solder paste rises, the storage stability and reliability decrease. When ethylene glycol, a dihydric alcohol, is used the fatty acid soaps and ethylene glycol react, preventing the further creation of the fatty acid soaps. The prevention of gelation results in an improvement in the solder paste storage ability.

• Smart Structures and Systems
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• 제17권1호
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• pp.123-134
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• 2016

The evolution of the electro-mechanical impedance (EMI) of a piezoelectricity (PZT) sensor was investigated to determine the setting times of cement paste in this study. The PZT sensor coated with non-conductive acrylic resin was embedded in fresh cement paste and the EMI signatures were continuously monitored. Vicat needle test and semi-adiabatic calorimetry test were also conducted to validate the EMI sensing technique. Significant changes in the EMI resonance peak magnitude and frequency during the setting period were observed and the setting times determined by EMI sensing technique were relevant to those measured by Vicat needle test and semi-adiabatic calorimetry test.

• Current Photovoltaic Research
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• 제4권4호
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• pp.140-144
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• 2016

In this paper, core-shell structure of nickel/gold (Ni/Au) conductive layer on poly-methyl-methacrylate (PMMA) micro-ball was fabricated and its conduction property was investigated. Firstly, PMMA micro-ball was synthesized by using dispersion polymerization method. Size of the ball was $2.8{\mu}m$ within ${\pm}7%$ deviation, and appropriate elastic deformation of the PMMA micro-ball ranging from 31 to 39% was achieved under 3 kg pressure. Also, 200 nm thick Ni/Au conductive layer was fabricated on the PMMA micro-ball by uniformly depositing with electroless-plating. Adhesion of the conductive layer was optimized with help of surface pre-treatment, and the layer adhered without peeling-off despite of thermal expansion by collision with accelerated electrons. Composite paste containing core-shell structured particles well cured at low temperature of $130^{\circ}C$ while pressing the test chip onto the substrate to make electrical contact, and electrical resistance of the conductive layer showed stable behavior of about $6.0{\Omega}$. Thus, it was known that core-shell structured particle of the Ni/Au conductive layer on PMMA micro-ball was feasible to flexible electronics.

• 한국재료학회지
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• 제28권9호
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• pp.528-533
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• 2018

In recent years, solar cells based on crystalline silicon(c-Si) have accounted for much of the photovoltaic industry. The recent studies have focused on fabricating c-Si solar modules with low cost and improved efficiency. Among many suggested methods, a photovoltaic module with a shingled structure that is connected to a small cut cell in series is a recent strong candidate for low-cost, high efficiency energy harvesting systems. The shingled structure increases the efficiency compared to the module with 6 inch full cells by minimizing optical and electrical losses. In this study, we propoese a new Conductive Paste (CP) to interconnect cells in a shingled module and compare it with the Electrical Conductive Adhesives (ECA) in the conventional module. Since the CP consists of a compound of tin and bismuth, the module is more economical than the module with ECA, which contains silver. Moreover, the melting point of CP is below $150^{\circ}C$, so the cells can be integrated with decreased thermal-mechanical stress. The output of the shingled PV module connected by CP is the same as that of the module with ECA. In addition, electroluminescence (EL) analysis indicates that the introduction of CP does not provoke additional cracks. Furthermore, the CP soldering connects cells without increasing ohmic losses. Thus, this study confirms that interconnection with CP can integrate cells with reduced cost in shingled c-Si PV modules.

• 마이크로전자및패키징학회지
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• 제17권4호
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• pp.41-48
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• 2010

본 연구에서는 일액형 이방 도전성 페이스트(anisotropic conductive paste, ACP) 혼합 조성의 상온 보관성을 향상시키기 위해 2-methyl imidazole 경화 촉매제를 5종의 각기 다른 물질로써 encapsulation하였다. Encapsulation용 분말 물질들은 DSC를 통해 그 융점을 관찰하였으며, 이를 통해 encapsulation용 분말 물질들을 액상으로 용융시켜 encapsulation하는 공정이 가능함을 확인할 수 있었다. Encapsulation된 2-methyl imidazole 분말을 포함한 ACP 혼합물질의 상온 보관성을 평가하기 위하여 시간에 따른 점도 변화가 관찰되었다. 그 결과, stearic acid와 carnauba wax로 encapsulation된 2-methyl imidazole 분말을 포함한 혼합물질에서 향상된 상온 보관성을 관찰할 수 있었으며, 이러한 formulation은 기본 혼합물질과도 유사한 경화 거동을 보임을 확인할 수 있었다. 최종적으로 stearic acid와 carnauba wax로 encapsulation된 2-methyl imidazole 분말을 포함한 혼합물질을 사용하여 RFID 칩을 제조된 안테나 패턴이 형성된 PET 기판에 고속 플립칩 본딩을 실시하였다. 이 경우 측정된 접합 강도는 기본 혼합물질에 비해 약 37%의 수준인 것으로 측정되었다.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2011년도 춘계학술대회 초록집
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• pp.116.1-116.1
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• 2011

Materials with a combination of high electrical conductivity and optical transparency are important components of many electronic and optoelectronic devices such as liquid crystal displays, solar cells, and light emitting diodes. In this study, to fabricate a low-resistance and high optical transparent electrode film for organic photovoltaic, the following steps were performed: the design and manufacture of an electroforming stamp mold, the fabrication of thermal roll imprinted (TRI) poly-carbonate (PC) patterned films, the manufacture of high-conductivity and low-resistance Ag paste which was filled into patterned PC film using a doctor blade process and then coated with a thin film layer of conductive polymer by a spin coating process. As a result of these imprinting processes the PC films obtained a line width of $10{\pm}0.5{\mu}m$, a channel length of $500{\pm}2{\mu}m$, and a pattern depth of $7.34{\pm}0.5{\mu}m$. After the Ag paste was used to fill part of the patterned film with conductive polymer coating, the following parameters were obtained: a sheet resistance of $9.65{\Omega}$/sq, optical transparency values were 83.69 % at a wavelength of 550 nm.

• 산업기술연구
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• 제3권
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• pp.87-94
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• 1983

Heating characteristics of red pepper paste packed in report pouches of various thicknesses and their storage stability were investigated to determine the adequate processing conditions that good bacteriological safty and minimal quality changes could be obtained, when sterilized by using a steam-air system retort. A heat penetration into pouch-packed red pepper paste was carried out through by a conductive heat transfer, indicating a simple logarithmic heating curve, and the smaller thickness revealed the higher heat penetration rate, suggesting the possibility of high temperature-short time sterilization of red pepper paste. The processing conditions with Fo-value of 4.5 or higher were sufficient for keeping up bacterial safty, but based on C-value, better quality retention was obtained at pouch thickness of 15mm under the processing temperature of $120^{\circ}C$. Subsequent storage study revealed that the red pepper paste packed in 15mm and processed at $120^{\circ}C$ with Fo=4.5 could be held without any spoilage and overall acceptance change, when stored for 6 months at room temperature under the relative humidity of 70%. After 3 months storage in $38^{\circ}C$ under saturation humidity, overall acceptance of red pepper paste were judged not to be maintainable on the acceptable level, but it may be suggested that above the results could be kept up a desirable quality without any remarkable deterioration.