• Applied Chemistry for Engineering
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• v.16 no.5
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• pp.689-692
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• 2005

In order to improve the electrochemical performances of Li-ion batteries when spinel $LiMn_2O_4$ is employed as a cathode active material, binary conductive agents were prepared using two different particle-sized carbons like Super P Black and $Vulcan^{(R)}$ XC-72R. The electrochemical performances of the $LiMn_2O_4$ cell system using binary conductive agents were evaluated in terms of specific charge and discharge capacities and cycle life. The cell with binary conductive agent in the 3:7 weight ratios of Super P Black and $Vulcan^{(R)}$ XC-72R showed better electrochemical performances due to the proper combination of ionic diffusion rate and electric contact.

• 전자공학회논문지 IE
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• v.43 no.4
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• pp.122-127
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• 2006

A series of conductive filler were prepared with electroless plating method. Base conductive materials of the filler were nickel and copper. The cores were prepared with Nylon 6 and rayon in different aspect ratio. Also, various complexes were made with ABS resin and conductive filler with different filler feed ratio. The conductivity of the filler was measured with conductivity analyzer and the size distributions of fillers was measured with laser particle size analyzer. Electromagnetic wave shielding efficiency of each complex film was measured with flange circular coaxial transmission line sample holder within the 1MHz$\sim$1GHz bandwidth range. From this study, the conductivity of filers surpass that of other carbon films. It is available that the filler made of fibrous materials can be applied in plastic molding industry of electric appliances as a EMI filler.

• Korean Journal of Metals and Materials
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• v.46 no.8
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• pp.516-523
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• 2008

The effect of glass-frit size on microstructural evolution and electrical resistance of conductive silver paste was investigated. Silver paste was prepared by mixing 70 wt% commercial silver powder with $1.6{\mu}m$, 3 wt% Bi based glass-frit and 27 wt% organic vehicle. Two different sizes of glass-frit were obtained by ball-milling of commercial glass-frit ($3{\mu}m$) for 3 and 5 days, which had an average particle size of 1.0 and $0.5{\mu}m$. The smaller glass-frit was melt at low sintered temperature and rapidly spread between the silver particles, which is induced the dense networking among silver particles and strong adhesiveness to $Al_2O_3$ substrate. The silver film with smaller glass-frit sintered at $500^{\circ}C$ showed the small pore size and low porosity resulting in low electrical resistivity of $4{\mu}{\Omega}cm$.

• Elastomers and Composites
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• v.46 no.4
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• pp.290-294
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• 2011

The surface resistance of poly(3,4-ethylenedioxythiophene)-polystyrene sulfonate (PEDOT/PSS), which has appeared to be one of the most successful conductive polymers, is affected by the solvent. In this paper, pellet-type PEDOT/PSS was suspended in $H_2O$, ethanol (EtOH), ethylene glycol (EG) or dimethylsulfoxide (DMSO), and coated on PET film. The surface resistances of the films made from EG or DMSO suspension were observed to be lower, nearly by 2 orders of magnitude, than that made from $H_2O$ suspension. No significant difference among four kinds of films was observed when the thermal properties and chemical structures were investigated by TGA and XPS, respectively. However, particle size of PEDOT/PSS was in the range of $1-3{\mu}m$ in EG or DMSO, on the other hand, less than $0.1{\mu}m$ in $H_2O$. It is considered that the particle size of PEDOT/PSS in the suspension plays an important role for the surface resistance.

• Transactions on Electrical and Electronic Materials
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• v.13 no.4
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• pp.212-214
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• 2012

Both the electrically positive and negative particles in a cell of quick response-liquid powder display (QR-LPD) are surrounded by conductive electrodes on the upper and lower substrate and the dielectric materials of the barrier ribs. Particles in a cell are attached to or detached from the other materials by image force, electric field, Coulomb's force, and Van der Waals' force. Through these forces, the moving particles form an image but induce clumping phenomena. Particles having a large kinetic energy by a large q/m value crash into the opposite electrode with high speed at a large driving voltage and quickly lose electrically charged material. As a result, these particles are clumped and degrade panel performance. The clumped particles in a cell are observed by microscopic photographs and ascertained by a response time. When the bias voltage is increased to 0.68-0.76 $V/{\mu}m$, particle clumping occurs abruptly and the response time increases sharply. This particle clumping is similarly observed after the number of driving times at the driving voltage (0.42-0.64 $V/{\mu}m$).

• Journal of the Korean Electrochemical Society
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• v.10 no.2
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• pp.88-93
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• 2007

Nano-sized Sn particles were coated with Ni-P layer using an electroless deposition method and their anodic performance was tested for lithium secondary batteries. Uniform coating layers were obtained, of which the thickness was controlled by varying the $Ni^{2+}$ concentration in the plating bath. It was found that the Ni-P layer plays two important roles in improving the anodic performance of Sn powder electrode. First, it prevents the inter-particle aggregation between Sn particles during the charge/discharge process. Second, it provides an electrical conduction pathway to the Sn particles, which allows an electrode fabrication without an addition of conductive carbon. A pseudo-optimized sample showed a good cyclability and high capacity ($>400mAh\;g^{-1}$) even without conductive carbon loading.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.10a
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• pp.366-369
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• 2005

Electrochemical discharge machining (ECDM) has been found to be potential fur the micro-machining of non-conductive materials such as ceramics or glass. However this machining process has its own inherent problem that the reproducibility is too low to get the available geometric accuracy fur micromachining applications. One main challenge in reaching this goal is the control of the hydrogen built around the tool-electrode in which happen the discharges. This paper proposes the methods to improve the geometric accuracy using powder-mixed ECDM process. The experimental results show the effects of powder producing improved geometric accuracy by averaging and decreasing the concentration of spark energy.

• Korean Journal of Materials Research
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• v.17 no.1
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• pp.50-55
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• 2007

Ultra-fine Copper powder for a conductive paste in electric-electronic field have been synthesized by chemical reduction of aqueous $CuSO_4$ with hydrazine hydrate $(N_2H_4{\cdot}H_2O)$ as a reductor. The effect of reaction conditions such as dispersant and reaction temperature on the particle size and shape for the prepared Cu powders was investigated by means of XRD, SEM, TEM and TGA. Experiments showed that type of dispersant and reaction temperature were affected on the particle size and morphology of the copper powder. When the carboxymethyl cellulose (CMC) was added as a dispersant the relative mono-dispersed and spherical Cu powder was obtained. Cu powders with particle size of approximately 140nm and narrow particle size distribution were obtained from 0.3M $CuSO_4$ with adding of 0.03M CMC and 40ml $N_2H_4{\cdot}H_2O$ at a reaction temperature of $70^{\circ}C$.

• Korean Journal of Materials Research
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• v.5 no.8
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• pp.929-935
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• 1995

In order to develop COG (Chip On Glass) technology for LCD module interconnecting the driver IC to Al pad electrode on the glass substrate, Anisotropic Conductive Adhesive(ACA) process, the most promising one among COG technologies, was investigated. ACA process was carried out by two steps, dispensing of ACA resin in the bonding area and curing by W radiation. Load on the chip was ranged from 2.0 to 15kg and the chip was heated at about 12$0^{\circ}C$. In resin, the density of conductive particles coated with Au or Ni at the surface were 500, 1000, 2000 and 4000 particles/$\textrm{mm}^2$, and the diameter of particles were 5, 7 and 12${\mu}{\textrm}{m}$. As a result of the experiments, ACA process using ACA particle of diameter and density of 5${\mu}{\textrm}{m}$ and 4000 particles/$\textrm{mm}^2$ respectively shows optimum characteristic with the stabilzed bonding properties and contact resistance.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.39 no.5
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• pp.425-433
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• 2015

In this paper, we have numerically investigated two-dimensional dielectrophoretic (DEP) motions of a single particle suspended freely in a viscous fluid, interacting with a nearby nonconducting planar wall, under an externally applied uniform direct-current electric field. Particularly, we solve the Maxwell equation with a large sharp jump in the electric conductivity at the particle-fluid interface and then integrate the Maxwell stress tensor to compute the DEP force on the particle. Results show that, under an electric field parallel to the wall, one particle is always repelled to move far away from the wall and the motion depends strongly on the particle-wall spacing and the particle conductivity. The motion strength vanishes when the particle is as conductive as the fluid and increases as the conductivity deviates further from that of the fluid.