• Title/Summary/Keyword: Concentration uniformity

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A Study on the Phosphorous Concentration and Rs Property of the Doped Polysilicon by LPCVD Method of Batch type (Batch 형태 LPCVD법에 의한 폴리실리콘의 인농도 및 Rs 특성에 관한 연구)

  • 정양희;김명규
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.11 no.3
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    • pp.195-202
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    • 1998
  • The LPCVD system of batch type for the massproduction of semiconductor fabrication has a problem of phosphorous concentration uniformity in the boat. In this paper we study an improvement of the uniformity for phosphorous concentration and sheet resistance. These property was improved by using the nitrogen process and modified long nozzle for gas injection tube in the doped polysilicon deposition system. The phosphorous concentration and its uniformity for polysilicon film are measured by XRF(X-ray Fluorescence) for the conventional process condition and nitrogen process. In conventional process condition, the phosphorous concentration, it uniformity and sheet resistance for polysilicon film are in the range of 3.8~5.4$\times$10\ulcorner atoms/㎤, 17.3% and 59~$\Omega$/ , respectively. For the case of nitrogen process the corresponding measurements exhibited between 4.3~5.3$\times$10\ulcorner atoms/㎤, 10.6% and 58~81$\Omega$/ . We find that in the nitrogen process the uniformity of phosphorous concentration improved compared with conventional process condition, however, the sheet resistance in the up zone of the boat increased about 12 $\Omega$/ . In modified long nozzle, the phosphorous concentration, its uniformity and sheet resistance for polysilicon films are in the range of 4.5~5.1$\times$10\ulcorner atoms/㎤, 5.3% and 60~65$\Omega$/ respectively. Annealing after $N_2$process gives the increment of grain size and the decrement of roughness. Modification of nozzle gives the increment of injection amount of PH$_3$. Both of these suggestion result in the stable phosphorous concentration and sheet resistance. The results obtained in this study are also applicable to process control of batch type system for memory device fabrication.

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A study on the uniformity of the electrodeposits in Pb-Sn-Cu ternary alloy plating (Pb-Sn-Cu삼원 합금 전착층의 균일성 연구)

  • NamGoong, E.;Gwon, Sik-Cheol
    • Journal of Surface Science and Engineering
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    • v.18 no.3
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    • pp.105-115
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    • 1985
  • Lead-tin-copper ternary alloy electrodeposition is conducted onto the inner bore surface of plain bearings as an overlay in order to investigate the effect of slot width, current density and fluoboric acid concentration on the uniformity of overlay. The thickness of overlay is analyzed by means of current distribution resulting from the overvoltage of plating bath and the apparent distance between cathode and anode. The result demonstrate that the uniformity of overlay is remarkably dependent of the slot size and current density, but has little bearing on the fluoboric acid concentration over 100g/L. This present study indicates that uniform overlay is obtainable within the tolerable thickness of ${\pm}2{\mu}m$ by using the slot width of 22mm. The surface morphology examination also shows the important role of concentration polarization of the micro-uniformity of overlay. The micro-uniformity has improved at the low concentration polarization which resulted from operating at the low current density and high fluoboric acid concentration. The surface morphology of deposits exhibits the vivid pyramid crystalline in the plating condition of low concentration polarizatio and all deposits have columnar structure parallel to the applied electric field regardless of the electroplating condition used.

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Synthesis and Characterization of Physical Properties of Titania Nanoparticle for Electronic Paper (전자종이용 티타니아 나노입자의 합성 및 물성 평가)

  • Hong, Sung-Jei;Han, Jeong-in
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.18 no.10
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    • pp.929-935
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    • 2005
  • In this paper, synthetic conditions of titania nanparticle was investigated to enhance its uniformity of the particle size as a child particle on organic mother particle of liquid powder type electronic paper. The physical properties are very important to improve the uniformity of electrical charging properties Concentration of titania raw material ($C_9H_{19}NO_4Ti$) in the ethanol solvent, pH, and concentration of the solution in the D.I. water were selected as parameters. As a result, ultrafine and well crystallized titania nanoparticle with good uniformity could be synthesized as the concentration of the $C_9H_{19}NO_4Ti$ in the ethanol solvent, pH of the solution, and the amount of the D.I. water were increased. Using the optimized conditions, the titania nanparoticle with uniformly ultrafime size of 10 nm could be synthesized.

Numerical Study on Optimization of the SCR Process Design in Horizontal HRSG for NOx Reduction (수평형 폐열회수보일러 배기탈질 SCR시스템의 최적설계를 위한 수치해석적 연구)

  • Kim, Kyeongsook;Lee, Kyeongok
    • Journal of Environmental Science International
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    • v.22 no.11
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    • pp.1481-1498
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    • 2013
  • The SCR (selective catalytic reduction) system is highly-effective technique for NOx reduction from exhaust gases. In this study, the effects of the direction and size of nozzle and the ammonia injection concentration on the performance of SCR system are analyzed by using the computational fluid dynamics method. When the nozzle is arranged in zigzaged direction which is normal to exhausted gas flow, it is shown that the uniformity of gas flow and the NH3/NO molar ratio is improved remarkably. With the change of the ammonia injection concentration from 0.2 vol%(wet) to 1.0 vol%(wet), the uniformity of gas flow shows a good results. As the size of nozzle diameter changes from 6 mm to 12 mm, the uniformity of gas flow is maintained well. It is shown that the uniformity of the $NH_3/NO$ molar ratio becomes better with decreasing the ammonia injection concentration and the size of nozzle diameter.

COMPUTATIONAL ANALYSIS FOR IMPROVING UNIFORMITY OF $SNO_2$ THIN FILM DEPOSITION IN AN APCVD SYSTEM ($SnO_2$ 박막증착을 위한 APCVD Reactor 내 유량 균일도 향상에 대한 수치 해석적 연구)

  • Park, J.W.;Yoon, I.R.;Chung, H.S.;Shin, S.W.;Park, S.H.;Kim, H.J.
    • 한국전산유체공학회:학술대회논문집
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    • 2010.05a
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    • pp.567-570
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    • 2010
  • With continuously increasing flat panel display size, uniformity of thin film deposition has been drawing more attentions and associated fabrication methodologies are being actively investigated. Since the convective flow field of mixture gas plays a significant role for deposition characteristics of thin film in an APCVD system, it is greatly important to maintain uniform distribution and consistent concentration of mixture gas species. In this paper, computational study has been performed for the improvement of flow uniformity of mixture gas in an APCVD reactor during thin film deposition process. A diffuser slit has bee designed to spread the locally concentrated gas flow exiting from the flow distributor. A uniform flow distributor has been developed which has less dependency on operating conditions for global flow uniformity

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Comparison of Injection Uniformity as the Dividing Plate Installation in Fuel Manifold (연료 매니폴드내의 분리판 장착에 따른 분사균일성 비교)

  • Yoo Doc-Koon;Cho Won-Kook;Seol Woo-Seok
    • Proceedings of the Korean Society of Propulsion Engineers Conference
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    • 2006.05a
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    • pp.130-134
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    • 2006
  • The injection uniformity of the fuel manifold in a liquid rocket engine has been analyzed with dividing plates to improve the cooling performance at the face plate. Three dimensional computational fluid dynamics analysis has been performed to compare the injection uniformity for 5 candidate designs and has been verified to compare with the measured data for the optimal manifold design. For the case I and II, the coolant mass flux increases as the whole working fluid is enforced to flow under the dividing plate. The injection uniformity decreases due to the variation of mass flux at the end of dividing plate and the concentration of mass flow rate at the center of manifold. However case III and IV have uniform injection performance due to reduced mass flux concentration as the coolant can flow along both upper passage and lower passage of the dividing plate. Among the candidate designs, case IV is thought to be the optimal dividing plate with regard to cooling performance and injection uniformity.

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Numerical Analysis of Flow Uniformity in Selective Catalytic Reduction (SCR) Process Using Computational Fluid Dynamics (CFD)

  • Shon, Byung-Hyun
    • International Journal of Advanced Culture Technology
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    • v.10 no.3
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    • pp.295-306
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    • 2022
  • The NOx removal performance of the SCR process depends on various factors such as catalytic factors (catalyst composition, shape, space velocity, etc.), temperature and flow rate distribution of the exhaust gas. Among them, the uniformity of the flow flowing into the catalyst bed plays the most important role. In this study, the flow characteristics in the SCR reactor in the design stage were simulated using a three-dimensional numerical analysis technique to confirm the uniformity of the airflow. Due to the limitation of the installation space, the shape of the inlet duct was compared with the two types of inlet duct shape because there were many curved sections of the inlet duct and the duct size margin was not large. The effect of inlet duct shape, guide vane or mixer installation, and venturi shape change on SCR reactor internal flow, airflow uniformity, and space utilization rate of ammonia concentration were studied. It was found that the uniformity of the airflow reaching the catalyst layer was greatly improved when an inlet duct with a shape that could suppress drift was applied and guide vanes were installed in the curved part of the inlet duct to properly distribute the process gas. In addition, the space utilization rate was greatly improved when the duct at the rear of the nozzle was applied as a venturi type rather than a mixer for uniform distribution of ammonia gas.

Fabrication of Electrospun Titania Nanofiber (전기방사법을 이용한 산화티탄 나노섬유의 제조)

  • Park, Sooil;Lee, Deuk-Yong;Lee, Myung-Hyun;Lee, Se-Jong;Kim, Bae-Yeon
    • Journal of the Korean Ceramic Society
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    • v.42 no.8 s.279
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    • pp.548-553
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    • 2005
  • $TiO_2$ nanofibers were fabricated by annealing electrospun $TiO_2$/PVP nanofibers for 3 h at $500^{\circ}C$ in air. Size and uniformity of electrospun $TiO_2$ nanofiber diameters were evaluated via XRD and SEM by varying electric field, PVP concentration, Ti tetraisopropoxide concentration and precursor flow rate. Experimental results revealed that the effect of PVP concentration on size and uniformity of electrospun $TiO_2$ nanofiber diameters was most profound, however, the other effects were relatively small. Uniform fibers with no beads were observed for the electrospun anatase titania nanofibers with a diameter of 170 nm.

Optimization of inlet concentration condition for uniform film growth in a cylindrical CVD chamber (원통형 화학증착로에서 균일한 박막형성을 위한 입구 농도분포의 최적화)

  • Jo, Won-Guk;Choe, Do-Hyeong;Kim, Mun-Eon
    • Transactions of the Korean Society of Mechanical Engineers B
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    • v.22 no.2
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    • pp.173-183
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    • 1998
  • An optimization procedure to find the inlet concentration profile that yields the most uniform deposition rate in a cylindrical CVD chamber has been developed. Assuming that the chemical reaction time is negligibly small, a SIMPLE based finite-volume method is adopted to solve the fully elliptic equations for momentum, temperature, and concentration. The inlet concentration profile is expressed by a linear combination of Chebyshev polynomials and the coefficients of which are determined by the local random search technique. It is shown that the present method is very effective in improving the uniformity of the deposition rate, especially when Re is high and/or the wafer is placed close to the inlet. The optimal profiles have been obtained for various Re, Gr, and geometry combinations.

Effects of Different Pretreatment Methods and Amounts of Reductant on Preparation of Silver-coated Copper Flakes Using Electroless Plating (무전해 도금에 의한 은코팅 구리 플레이크의 제조에서 전처리 공정 및 환원제 양의 영향)

  • Oh, Sang Joo;Kim, Ji Hwan;Lee, Jong-Hyun
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.2
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    • pp.97-104
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    • 2016
  • In the preparation of Ag-coated Cu flakes using L-ascorbic acid as a reductant for the electroless Ag plating, the effects of pretreatment methods and the reductant concentration on the uniformity of Ag coating layer and the anti-oxidation property of Ag-coated Cu flakes during the heating in air were evaluated. It was found that the removal degree of surface oxide layer during the pretreatment has great influence on the uniformity of Ag coating layer and the formation degree of hole defects in the flakes has slight effect on the anti-oxidation property of Ag-coated Cu flakes. It was also verified that the reductant concentration has great influence on the coverage uniformity and thickness of Ag coating, thus it was could be considered a main process parameter. When the reductant concentration was 0.04 M, high-quality Ag-coated Cu flakes was obtained. When the concentration increased to 0.06 M, however, the anti-oxidation property of Ag-coated Cu flakes became remarkably worse owing to remnant of Cu surface non-coated with Ag by the formation of pure Ag fine particles.