• Journal of Korean Society of Environmental Engineers
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• v.36 no.8
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• pp.534-541
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• 2014

This study investigated a method to determine an efficient operating condition for the $UV/H_2O_2$ process. The OH radical scavenging factor is the most important factor to predict the removal efficiency of the target compound and determine the operating condition of the $UV/H_2O_2$ process. To rapidly and simply measure the scavenging factor, Rhodamine B (RhB) was selected as a probe compound. Its reliability was verified by comparing it with a typical probe compound (para-chlorobenzoic acid, pCBA); the difference between RhB and pCBA was only 1.1%. In a prediction test for the removal of Ibuprofen, the RhB method also shows a high reliability with an error rate of about 5% between the experimental result and the model prediction using the measured scavenging factor. In the monitoring result, the scavenging factor in the influent water of the $UV/H_2O_2$ pilot plant was changed up to 200% for about 8 months, suggesting that the required UV dose could be increased about 1.7 times to achieve 90% caffeine removal. These results show the importance of the scavenging factor measurement in the $UV/H_2O_2$ process, and the operating condition could simply be determined from the scavenging factor, absorbance, and information pertaining to the target compound.

• KSCE Journal of Civil and Environmental Engineering Research
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• v.28 no.4D
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• pp.569-577
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• 2008

The purpose of this study is focused on the development of compound classification process by mixing multitemporal data and annexing a specific image enhancement technique with a specific image classification algorithm, to gain more accurate land information from satellite imagery. That is, this study suggests the classification process using canonical correlation classification technique after principal component analysis for the mixed multitemporal data. The result of this proposed classification process is compared with the canonical correlation classification result of one date images, multitemporal imagery and a mixed image after principal component analysis for one date images. The satellite images which are used are the Landsat 5 TM images acquired on July 26, 1994 and September 1, 1996. Ground truth data for accuracy assessment is obtained from topographic map and aerial photograph, and all of the study area is used for accuracy assessment. The proposed compound classification process showed superior efficiency to appling canonical correlation classification technique for only one date image in classification accuracy by 8.2%. Especially, it was valid in classifying mixed urban area correctly. Conclusively, to improve the classification accuracy when extracting land cover information using Landsat TM image, appling canonical correlation classification technique after principal component analysis for multitemporal imagery is very useful.

• Journal of the Korean Society for Heat Treatment
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• v.14 no.1
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• pp.8-16
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• 2001

The effects of gas composition, pressure, temperature and time on the case thickness, hardness and nitride formation in the surface of tool steels(STD11 and STD61) have been studied by micro-pulse plasma nitriding. External compound layer and internal diffusion layer and the diffusion layer were observed in the nitrided case of tool steels. The relative amounts and kind of phases formed in the nitrided case changed with the change of nitriding conditions. Generally, only nitride phases such as ${\gamma}(Fe_4N)$, ${\varepsilon}(Fe_{2-3}N)$, or $Cr_{1.75}V_{0.25}N_2$ phases were detected in the compound layer, while nitride and carbide phases such as ${\varepsilon}-nitride(Fe_{2-3}N)$, $(Cr,Fe)_{\gamma}C_3$ or $Fe_3C$ were detected in the diffusion layer by XRD analysis. The thickness of compound layer increased with the increase of nitrogen content in the gas composition. Maximum case depth was obtained at gas pressure of 200Pa.

• Communications for Statistical Applications and Methods
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• v.18 no.4
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• pp.433-443
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• 2011

We consider a compound Poisson risk model in which the premiums may depend on the state of the surplus process. By using the overflow probability of the workload process in the corresponding M/G/1 queueing model, we obtain the probability that the ruin occurs before the surplus reaches a given large value in the risk model. We also examplify the ruin probability in case of exponential claims.

• Journal of Welding and Joining
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• v.26 no.2
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• pp.50-54
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• 2008

The wearplate with Cr-C has been used in condition of severe abrasion. Recently, the demand of wearplate made by hardfacing with Cr-C has increased in the world, but it is lack of supply and expensive due to low productivity. CMAW (Compound Metal Arc Welding) is very useful process of several welding methods to make wearplate. In this paper, twin torch CMAW to use twin torch at the same time was developed to improve productivity and to ensure quality of wear plate. When the distance between two touches was smaller than 30mm, arc blow was occurred. However when the distance was larger than 35mm, there was no arc blow any more. If the oscillation path of each torch was overlapped together, the melt through at the overlapped zone was occurred due to concentrated heat input in substrate. On the other hand, the turning point of each torch was open more than 5mm, separated bead was generated. Therefore twin torch CMAW which has adequate conditions was able to make wearplate having flatter surface at the bead connection than single torch.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.86.1-86.1
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• 2015

As the feature size of Si-based semiconductor shrinks to nanometer scale, we are facing to the problems such as short channel effect and leakage current. One of the solutions to cope with those issues is to bring III-V compound semiconductors to the semiconductor structures, because III-V compound semiconductors have much higher carrier mobility than Si. However, introduction of III-V semiconductors to the current Si-based manufacturing process requires great challenge in the development of process integration, since they exhibit totally different physical and chemical properties from Si. For example, epitaxial growth, surface preparation and wet etching of III-V semiconductors have to be optimized for production. In addition, oxidation mechanisms of III-V semiconductors should be elucidated and re-growth of native oxide should be controlled. In this study, surface preparation methods of various III-V compound semiconductors such as GaAs, InAs, and GaSb are introduced in terms of i) how their surfaces are modified after different chemical treatments, ii) how they will be re-oxidized after chemical treatments, and iii) is there any effect of surface orientation on the surface preparation and re-growth of oxide. Surface termination and behaviors on those semiconductors were observed by MIR-FTIR, XPS, ellipsometer, and contact angle measurements. In addition, photoresist stripping process on III-V semiconductor is also studied, because there is a chance that a conventional photoresist stripping process can attack III-V semiconductor surfaces. Based on the Hansen theory various organic solvents such as 1-methyl-2-pyrrolydone, dimethyl sulfoxide, benzyl alcohol, and propylene carbonate, were selected to remove photoresists with and without ion implantation. Although SPM and DIO3 caused etching and/or surface roughening of III-V semiconductor surface, organic solvents could remove I-line photoresist without attack of III-V semiconductor surface. The behavior of photoresist removal depends on the solvent temperature and ion implantation dose.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.83-87
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• 2022

Recently, as the thickness of the semiconductor package becomes thinner, warpage has become a major issue. Since the warpage is caused by differences in material properties between package components, it is essential to precisely evaluate the material properties of the EMC(Epoxy molding compound), one of the main components, to predict the warpage accurately. Especially, the cure shrinkage of the EMC is generated during the curing process, and among them, the effective cure shrinkage that occurs after the gelation point is a key factor in warpage. In this study, the gelation point of the EMC was defined from the dissipation factor measured using the dielectric sensor during the curing process similar with actual semiconductor package. In addition, DSC (Differential scanning calorimetry) test and rheometer test were conducted to analyze the dielectrometry measurement. As a result, the dielectrometry was verified to be an effective method for monitoring the curing status of the EMC. Simultaneously, the strain transition of the EMC during the curing process was measured using the FBG (Fiber Bragg grating) sensor. From these results, the effective cure shrinkage of the EMC during the curing process was measured.

• Journal of the Korean Statistical Society
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• v.25 no.4
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• pp.545-556
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• 1996

In this paper, we introduce a new concept of partial ordering which permits us to compare pairs of the dependence structures of a new hitting times for POD multivariate vector process of interest as to their degree of POD-ness. We show that POD ordering is closed under convolution, limit in distribution, compound distribution, mixture of a certain type and convex combination. Finally, we present several examples of POD ordering processes.

• Proceedings of the KWS Conference
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• 2007.11a
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• pp.91-93
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• 2007

• Microbiology and Biotechnology Letters
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• v.21 no.6
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• pp.594-599
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• 1993

In the course of screening for microbial metabolites employing human cancer cell line, we identified a mycelial extract of Streptomyces sp. 1365, which are effective on growth inhibition and morphological change of MCF-7, human breasr cancer cell line. By repeased column chromatography and recrystallization process, yellow needle crystals were obtained as an active compound and identified as resistomycin by spectral analysis.