• Bulletin of the Korean Chemical Society
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• v.27 no.10
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• pp.1587-1592
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• 2006

We report the preparation, structure and magnetic properties of a new pillared complex, copper(II) hydroxy-1,4-butanedisulfonate, $Cu_2(OH)_3(O_3SC_4H_8SO_3)_{1/2}$. The titled compound was obtained by anion exchange, using copper hydroxyl nitrate $(Cu_2(OH)_3NO_3)$ as the starting material. According to the XRD data, this compound exhibits a pillared layered structure with organic layers tilted between the copper hydroxide layers with a tilt angle of $21.8^{\circ}$. FTIR spectroscopy confirms total exchange of nitrate by the sulfonate and indicates that the sulfonate functions are linked to the copper(II) ions with each aliphatic chain bridging the adjacent hydroxide layers. According to the dc and ac magnetic measurements, the title compound is a metamagnet consisting of spin-canted antiferromagnetic layers, with a Neel temperature of 11.8 K.

• The Proceedings of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.5 no.2
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• pp.77-83
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• 1991

In this study the investigation were carried out on short-term breakdown characteristics of the compound material dependent on change of filler quantity, ambient temperature(room temperature~[$190[^{\circ}C$]) and kinds of voltage sources for the compound materials of Bisphenol- A epoxy resins filled with $SiO_2$ particles. As the results, obtained the dielectric breakdown strength generally decrease as increasing the quantity of filler and the distance, spacing of each's particles, decrease as increasing the quantity of filler, when the distance is less than [$7.5\mu\textrm{m}$], dielectric breakdown strength is nearly constant. In the case on AC voltage dielectric strength of filled epoxy resins is stronger than nonfilled epoxy resins on temperature region more than $130[^{\circ}C$].

• Proceedings of the KWS Conference
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• 2002.10a
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• pp.534-538
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• 2002

Dissimilar friction stir welding of aluminum (AI) alloy 1050 and magnesium (Mg) alloy AZ31 was successfully done in the limited welding parameters. The dissimilar weld showed good quality and facility compared to conventional fusion weld. Transverse cross section perpendicular to the welding direction had no defects. The weld was divided into base material of Al alloy, an irregular shaped stir zone and base material of Mg alloy. The irregular shaped stir zone was roughly located around the initial weld center. The weld interface near plate surface shifted from initial weld centerline to the advancing side. Hardness profile of the weld was heterogeneous, and the hardness value of the stir zone was raised to about 150 Hv to 250 Hv. The mixed phase was identified to intermetallic compound $Mg_{17}$Al$_{12}$ using x-ray diffraction method, energy dispersive x-ray spectroscopy (EDX) and electron probe micro analysis (EPMA). The formation of intermetallic compound $Mg_{17}$Al$_{12}$ during FSW causes the remarkable increase in hardness value in the stir zone.one.

• Progress in Superconductivity and Cryogenics
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• v.4 no.1
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• pp.30-34
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• 2002

In this Paper, Insulation of current lead in the conduction-cooled DC reactor for the 1.2kV class 3 high-Tc superconducting fault current limiter(SFCL) is studied. Thermal link which conducts heat energy but insulates electrical energy is selected as a insulating device for the current lead in the conduction-cooled Superconducting DC reactor. It consists of oxide free copper(OFC) sheets, Polyimide films, glass fiberglass reinforced Plastics (GFRP) plates and interfacing material such an indium or thermal compound. Through the test of dielectric strength in L$N_2$, polyimide film thickness of 125 ${\mu}{\textrm}{m}$ is selected as a insulating material. Electrical insulation and heat conduction are contrary to each other. Because of low heat conductivity of insulator and contact area between electrical insulator and heat conductor, thermal resistance of conduction-cooled system is increased. For the reducing of thermal resistance and the reliable contact between Polyimide and OFC, thermal compound or indium can be used As thermal compound layer is weak layer in electrical field, indium is finally selected for the reducing of thermal resistance. Thermal link is successfully passed the test. The testing voltage was AC 2.5kVrms and the testing time was 1 hour.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.204-207
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• 2003

The flip chip bonding utilizing self-aligning characteristic of solder becomes mandatory to meet to tolerances for the optical device. In this paper, a parametric study of aging condition and pad size of sample was conducted. A TiW/Cu UBM structure was adopted and sample was aging treated to analyze the effect of intermetallic compound with time variation. After aging treatment, the tendency to decrease in shear strength was measured and the structure of the fine joint area was observed by using SEM, TEM and EDS. In result, the shear strength was decreased of about 20% in the $100{\mu}m$ sample at $170^{\circ}C$ aging compared with the maximum shear strength of same pad size sample. In the case of the $120^{\circ}C$ aging treatment, 17% of decrease in shear strength was measured at the $100{\mu}m$ pad size sample. Also, intremetallic compound of $Cu_6Sn_5$ and $Cu_3Sn$ were observed through the TEM measurement by using an FIB technique that is very useful to prepare TEM thin foil specimens from the solder joint interface.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.11 no.5
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• pp.353-357
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• 1998

Cracking problem of Epoxy Molding Compound(EMC) is critical for the reliability of the plastic package during temperature cycling and IR-reflow condition. Fracture toughness of EMC, which is defined as the resistance of EMC to the crack propagation, is a useful factor in ht estimation of EMC against package crack. Thus, development of EMC having high fracture toughness at a given loading condition would be important for confirming the integrity of package. In this study, toughness of several EMC was measured by varying the test conditions such as temperature, loading speeds, and weight percent of filler in order to quantify the variation of toughness of EMC under various applicable conditions. It was found from the experiments that toughness of all EMC has following trends, i.e., it rapidly decreases over the glass transition temperature, remains almost same or little decreases below $0^{\circ}C$. It decreases with the growth of cross head speed in EMC and the weight percent of filler as the degree of brittleness of EMC increases with the amount of filler content.

• Bulletin of the Korean Chemical Society
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• v.19 no.10
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• pp.1113-1116
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• 1998

A new graphite intercalation compound (GIC), n-octylammonium tetrachlorofeffate(Ⅲ)-graphite, has been derived from well-known ferric chloride graphite intercalation compound. X-ray diffration study shows that the basal spacing of this new GIC is 20.8 Å. In order to investigate the local geometry around the iron atom in the graphite layers, X-ray absorption spectroscopy experiments were performed. The first discharge capacity of its exfoliated form is found to be 862 mAh/g, which is more than double the value of pristine graphite (384 mAh/g). Such a drastic increase implies that the exfoliated graphite is a promising electrode material.

• Proceedings of the SAREK Conference
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• 2005.11a
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• pp.392-397
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• 2005

This study is investigated the supercooling improvement and the phase change temperature of the TMA clathrate compound including TMA(Tri-Methyl-Amine, ($(CH_3)_3N$) of 25 wt% with additive as a low temperature storage material at $6^{\circ}C$ and $-7^{\circ}C$ of heat source. The additive is ethanol of 0.1, 0.3 wt% and 0.5 wt%. The results showed that as the concentration of ethanol is increased, the phase change temperature, the degree of supercooling and the retention time of liquid phase are decreased. Especially, TMA 25 wt% clathrate compound with ethanol of 0.5wt% has the average of phase change temperature of $3.8^{\circ}C$, degree of supercooling of $0.9^{\circ}C$, $0.8^{\circ}C$ and retention time of liquid phase for 6, 5 minutes at $-6^{\circ}C$, $-7^{\circ}C$ of heat source. From the results of this study, TMA 25wt% clathrate compound with ethanol 0.5wt% showed supercooling repression effect.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.05a
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• pp.15-17
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• 2001

A new possibility of our atmospheric cold plasma torch has been examined on the surface treatment of an air-exposed vulcanized rubber compound. The plasma treatment effect was evaluated by the bondability with another rubber compound using a polyurethane adhesive.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.183-183
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• 2009

본 연구에선 ITO에 사용되는 Indium의 양을 줄이기 위해 ITO와 유사한 성질을 보이는 조성인 Indium - Zinc - Tin Turnary compound를 연구하였다. 각 조성은 Indium - Zinc - Tin Turnary compound를 기본으로 하여 Zinc site에 이종원소인 Al2O3와 Ga2O3를 doping함에 따라 변화되는 전기적 특성을 살며보았다. 분석에 사용한 Ceramic pellet은 일반적인 Ceramic process를 거쳐 제작되었다. 각 조성의 전기적 특성은 TCR meter와 Hall effect analyser를 이용하여 측정하였고, X-ray diffraction measurements(XRD), Scanning Electron microscope(SEM)를 이용하여 결정학적 특성을 분석하였다.