• Bulletin of the Korean Chemical Society
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• 제27권10호
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• pp.1587-1592
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• 2006

We report the preparation, structure and magnetic properties of a new pillared complex, copper(II) hydroxy-1,4-butanedisulfonate, $Cu_2(OH)_3(O_3SC_4H_8SO_3)_{1/2}$. The titled compound was obtained by anion exchange, using copper hydroxyl nitrate $(Cu_2(OH)_3NO_3)$ as the starting material. According to the XRD data, this compound exhibits a pillared layered structure with organic layers tilted between the copper hydroxide layers with a tilt angle of $21.8^{\circ}$. FTIR spectroscopy confirms total exchange of nitrate by the sulfonate and indicates that the sulfonate functions are linked to the copper(II) ions with each aliphatic chain bridging the adjacent hydroxide layers. According to the dc and ac magnetic measurements, the title compound is a metamagnet consisting of spin-canted antiferromagnetic layers, with a Neel temperature of 11.8 K.

• 한국조명전기설비학회지:조명전기설비
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• 제5권2호
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• pp.77-83
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• 1991

비스페놀 A형 에폭시 수지에 $SiO_2$를 충진한 에폭시 복합재료의 단시간 절연파괴 특성을 충진제 첨가 함량의 변화, 주위온도(상온~[$190^{\circ}C$])의 변화 및 인가 전원의 종류별로 연구, 검토하였다. 연구결과, 절연파괴강도는 충진제 함량의 증가에 대해 일반적으로 감소하는 경향을 보였으며, 입자간 중심거리 d가 충진제함량이 증가함에 따라 감소하여 평균입자간격이 [$7.5\mu\textrm{m}$]이하가 되면 절연파괴 강도가 거의 일정한 값이 됨을 확인하였다. 또한, 교류전압을 인가하는 경우는 고온영역 ([$130^{\circ}C$]) 이상에서 충진된 에폭시수지가 무충진 에폭시수지보다 절연파괴강도가 증가하였다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
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• pp.534-538
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• 2002

Dissimilar friction stir welding of aluminum (AI) alloy 1050 and magnesium (Mg) alloy AZ31 was successfully done in the limited welding parameters. The dissimilar weld showed good quality and facility compared to conventional fusion weld. Transverse cross section perpendicular to the welding direction had no defects. The weld was divided into base material of Al alloy, an irregular shaped stir zone and base material of Mg alloy. The irregular shaped stir zone was roughly located around the initial weld center. The weld interface near plate surface shifted from initial weld centerline to the advancing side. Hardness profile of the weld was heterogeneous, and the hardness value of the stir zone was raised to about 150 Hv to 250 Hv. The mixed phase was identified to intermetallic compound $Mg_{17}$Al$_{12}$ using x-ray diffraction method, energy dispersive x-ray spectroscopy (EDX) and electron probe micro analysis (EPMA). The formation of intermetallic compound $Mg_{17}$Al$_{12}$ during FSW causes the remarkable increase in hardness value in the stir zone.one.

• 한국초전도ㆍ저온공학회논문지
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• 제4권1호
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• pp.30-34
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• 2002

In this Paper, Insulation of current lead in the conduction-cooled DC reactor for the 1.2kV class 3 high-Tc superconducting fault current limiter(SFCL) is studied. Thermal link which conducts heat energy but insulates electrical energy is selected as a insulating device for the current lead in the conduction-cooled Superconducting DC reactor. It consists of oxide free copper(OFC) sheets, Polyimide films, glass fiberglass reinforced Plastics (GFRP) plates and interfacing material such an indium or thermal compound. Through the test of dielectric strength in L$N_2$, polyimide film thickness of 125 ${\mu}{\textrm}{m}$ is selected as a insulating material. Electrical insulation and heat conduction are contrary to each other. Because of low heat conductivity of insulator and contact area between electrical insulator and heat conductor, thermal resistance of conduction-cooled system is increased. For the reducing of thermal resistance and the reliable contact between Polyimide and OFC, thermal compound or indium can be used As thermal compound layer is weak layer in electrical field, indium is finally selected for the reducing of thermal resistance. Thermal link is successfully passed the test. The testing voltage was AC 2.5kVrms and the testing time was 1 hour.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
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• pp.204-207
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• 2003

The flip chip bonding utilizing self-aligning characteristic of solder becomes mandatory to meet to tolerances for the optical device. In this paper, a parametric study of aging condition and pad size of sample was conducted. A TiW/Cu UBM structure was adopted and sample was aging treated to analyze the effect of intermetallic compound with time variation. After aging treatment, the tendency to decrease in shear strength was measured and the structure of the fine joint area was observed by using SEM, TEM and EDS. In result, the shear strength was decreased of about 20% in the $100{\mu}m$ sample at $170^{\circ}C$ aging compared with the maximum shear strength of same pad size sample. In the case of the $120^{\circ}C$ aging treatment, 17% of decrease in shear strength was measured at the $100{\mu}m$ pad size sample. Also, intremetallic compound of $Cu_6Sn_5$ and $Cu_3Sn$ were observed through the TEM measurement by using an FIB technique that is very useful to prepare TEM thin foil specimens from the solder joint interface.

• 한국전기전자재료학회논문지
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• 제11권5호
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• pp.353-357
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• 1998

Cracking problem of Epoxy Molding Compound(EMC) is critical for the reliability of the plastic package during temperature cycling and IR-reflow condition. Fracture toughness of EMC, which is defined as the resistance of EMC to the crack propagation, is a useful factor in ht estimation of EMC against package crack. Thus, development of EMC having high fracture toughness at a given loading condition would be important for confirming the integrity of package. In this study, toughness of several EMC was measured by varying the test conditions such as temperature, loading speeds, and weight percent of filler in order to quantify the variation of toughness of EMC under various applicable conditions. It was found from the experiments that toughness of all EMC has following trends, i.e., it rapidly decreases over the glass transition temperature, remains almost same or little decreases below $0^{\circ}C$. It decreases with the growth of cross head speed in EMC and the weight percent of filler as the degree of brittleness of EMC increases with the amount of filler content.

• Bulletin of the Korean Chemical Society
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• 제19권10호
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• pp.1113-1116
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• 1998

A new graphite intercalation compound (GIC), n-octylammonium tetrachlorofeffate(Ⅲ)-graphite, has been derived from well-known ferric chloride graphite intercalation compound. X-ray diffration study shows that the basal spacing of this new GIC is 20.8 Å. In order to investigate the local geometry around the iron atom in the graphite layers, X-ray absorption spectroscopy experiments were performed. The first discharge capacity of its exfoliated form is found to be 862 mAh/g, which is more than double the value of pristine graphite (384 mAh/g). Such a drastic increase implies that the exfoliated graphite is a promising electrode material.

• 대한설비공학회:학술대회논문집
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• 대한설비공학회 2005년도 동계학술발표대회 논문집
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• pp.392-397
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• 2005

This study is investigated the supercooling improvement and the phase change temperature of the TMA clathrate compound including TMA(Tri-Methyl-Amine, ($(CH_3)_3N$) of 25 wt% with additive as a low temperature storage material at $6^{\circ}C$ and $-7^{\circ}C$ of heat source. The additive is ethanol of 0.1, 0.3 wt% and 0.5 wt%. The results showed that as the concentration of ethanol is increased, the phase change temperature, the degree of supercooling and the retention time of liquid phase are decreased. Especially, TMA 25 wt% clathrate compound with ethanol of 0.5wt% has the average of phase change temperature of $3.8^{\circ}C$, degree of supercooling of $0.9^{\circ}C$, $0.8^{\circ}C$ and retention time of liquid phase for 6, 5 minutes at $-6^{\circ}C$, $-7^{\circ}C$ of heat source. From the results of this study, TMA 25wt% clathrate compound with ethanol 0.5wt% showed supercooling repression effect.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 춘계학술대회 논문집 센서 박막재료
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• pp.15-17
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• 2001

A new possibility of our atmospheric cold plasma torch has been examined on the surface treatment of an air-exposed vulcanized rubber compound. The plasma treatment effect was evaluated by the bondability with another rubber compound using a polyurethane adhesive.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.183-183
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• 2009

본 연구에선 ITO에 사용되는 Indium의 양을 줄이기 위해 ITO와 유사한 성질을 보이는 조성인 Indium - Zinc - Tin Turnary compound를 연구하였다. 각 조성은 Indium - Zinc - Tin Turnary compound를 기본으로 하여 Zinc site에 이종원소인 Al2O3와 Ga2O3를 doping함에 따라 변화되는 전기적 특성을 살며보았다. 분석에 사용한 Ceramic pellet은 일반적인 Ceramic process를 거쳐 제작되었다. 각 조성의 전기적 특성은 TCR meter와 Hall effect analyser를 이용하여 측정하였고, X-ray diffraction measurements(XRD), Scanning Electron microscope(SEM)를 이용하여 결정학적 특성을 분석하였다.