• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.241-245
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• 2003

In this paper, a microassembly system based on hybrid manipulation schemes is proposed and applied to the assembly of a photonic component. In order to achieve both high precision and dexterity in microassembly, we propose a hybrid microassembly system with sensory feedbacks of vision and force. This system consists of the distributed 6-DOF micromanipulation units, the stereo microscope, and haptic interface for the force feedback-based microassembly. A hybrid assembly method, which combines the vision-based microassembly and the scaled teleoperated microassembly with force feedback, is proposed. The feasibility of the proposed method is investigated via experimental studies for assembling micro opto-electrical components. Experimental results show that the hybrid microassembly system is feasible for applications to the assembly of photonic components in the commercial market with better flexibility and efficiency.

• Transactions on Electrical and Electronic Materials
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• v.15 no.5
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• pp.257-261
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• 2014

Multilayered CdTe/PSS films were prepared by the electrostatic self-assembly method in an aqueous medium. Positively-charged cadmium telluride (CdTe) nanoparticles and anionic polyelectrolyte, poly (sodium 4-styrene sulfonate) (PSS) were assembled alternately in order to build up a multilayered film structure. A linear proportion of absorbance to the number of bilayers suggests that an equal amount of CdTe was adsorbed after each dipping cycle, which resulted in the buildup of a homogenous film. The binding energies of elements (Cd and Te) in multilayered CdTe/PSS film shifted from those of the CdTe nanoparticles in the pure state. This result indicates that the interfacial electron densities were redistributed by the strong electrostatic interaction between the oppositely-charged CdTe and PSS. Electrochemical properties of the multilayered CdTe/PSS films were studied in detail by cyclic voltammetry (CV).

• Journal of the Microelectronics and Packaging Society
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• v.8 no.2
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• pp.37-42
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• 2001

The BGA package has been the area array package of choice for several years. Recently, the transition has been to finer pitch configurations called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch. requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and place equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.04a
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• pp.27-34
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• 2001

The BGA Package has been the area array package of choice for several rears. Recently, the transition has been to finer pitch configuration called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch, requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and piece equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

• Journal of Microbiology and Biotechnology
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• v.21 no.2
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• pp.124-128
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• 2011

Ferredoxin is a typical iron-sulfur protein that is ubiquitous in biological redox systems. This study investigates the in vitro assembly of a [$Fe_2S_2$] cluster in the ferredoxin from Acidithiobacillus ferrooxidans in the presence of three scaffold proteins: IscA, IscS, and IscU. The spectra and MALDI-TOF MS results for the reconstituted ferredoxin confirm that the iron-sulfur cluster was correctly assembled in the protein. The inactivation of cysteine desulfurase by L-allylglycine completely blocked any [$Fe_2S_2$] cluster assembly in the ferredoxin in E. coli, confirming that cysteine desulfurase is an essential component for iron-sulfur cluster assembly. The present results also provide strong evidence that [$Fe_2S_2$] cluster assembly in ferredoxin follows the AUS pathway.

• Journal of Korean Society for Quality Management
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• v.45 no.4
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• pp.829-846
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• 2017

Purpose: This paper compares the effectiveness of typical selective assembly criteria and suggests the most promising one. Based on the result of a computer simulation, the key issues of selective assembly are examined and the best criterion is recommended from the effectiveness perspective. Methods: Using JAVA program, production of ten thousand units for each pair of components are simulated for selective assembly of the two types. And the number of mismatching and the fraction nonconforming for each criterion are determined. Results: The best match criterion appeared to be most promising from the perspectives of both mismatching and nonconforming problems. Its effectiveness appears to be also good even when the precision of one component is different from that of the other. Conclusion: For designing an optimal method for selective assembly, the best match criterion is recommendable as the base criterion.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.32 no.4
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• pp.249-254
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• 2008

Hydrodynamic performance test of a turbopump for a liquid rocket engine is carried out. The turbopump is composed of an oxidizer pump, a fuel pump and a turbine, and the two pumps are driven by the turbine. In the test, water is used for the pumps as working media and air is used for the turbine. Performance parameters of pumps and a turbine are drawn, and a power balance between the pumps and the turbine are calculated. The calculation shows a good power balance, which implies that the pump component tests, the turbine component test and the assembly test are reliably performed. At the starting period of the test, pressure rise-flow rate curve of a pump gradually approaches the ideal curve which could be obtained by very slow starting.

• Journal of the Korea Safety Management & Science
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• v.5 no.4
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• pp.187-194
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• 2003

The purpose of a man-machine chart is improved utilization of a man or a machine. Improved utilization can mean less idle time, rebalanced idle time, or less idle time of an excessive component. In this study we improved the productivity of the assembly line in the electronics company using man-machine chart. The results are applicable for improving the effectiveness of line balancing problems in the electronics industry.

• Journal of the Korean Society of Propulsion Engineers
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• v.20 no.6
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• pp.91-100
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• 2016

Efficiency characteristics of centrifugal turbopumps for a liquid rocket engine were investigated. Predicting the performance of pumps for a turbopump assembly test, the variation on pump efficiency by working fluids was analyzed from pump component tests. Water and liquid nitrogen (LN2) were used for the component test, kerosene (Jet A-1) and liquid oxygen (LOX) were adapted for the turbopump assembly (TPU) test as working fluids. Overall performance of the pumps was investigated covering design/off-design operating points and the pump efficiency on the environment of real media (LOX/kerosene) could be modified from the pump component tests.

• Proceedings of the IEEK Conference
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• 2003.07d
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• pp.1605-1608
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• 2003

Today, E-Business develop because, Internet diffuse rapidly. Variety function and excellence performance needs for changeable user's requirement. So, EJB comes Component's addition and modify. For Component adds Function, Existing System modifies all of the source code. In EJB Component System, but, modifies simple source code. But, Today's System don't have cleary way that assembly component and design system. This Paper used design pattern for maintain of the component. this paper describes EJB Design Pattern using Abstract Factory Pattern. And EJB Component that used Pattern, decribes advantage and disavantage.