• Title/Summary/Keyword: Communication Grid

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A Study on the Editorial Design of Magazine, Its New Concept & Advancement (디자인 전문지 <에미그레(Emigre)> 편집디자인의 혁신과 진보)

  • 이옥수
    • Archives of design research
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    • v.13 no.4
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    • pp.163-174
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    • 2000
  • issued in the U.S is a magazine specialized in graphic design, which has a totally different style from commercial magazines such as show case. The main motive why Rudy VanderLans, the publisher, first issued this magazine in the early 1980s is his assertion that there is no design paradigm of universial concept in the aspect of viaual communication design. Also, it started from his recognition that a medium for letting a new generation's show their liberal thinking and experimental expressions. This study looks at theologies and assertions on new graphic concept, which is called the New Wave of graphic design by classifying the plans of into form and contents, and analyzes its specialty in design. Also, this study examines the overall trends of non-Grid editorial design since the modern style. By doing so, I could have a general look at the progressive traits and their futuristic directions that become to have a shorter life cycle with the advent of the 21st century's information era, high-tech media and the change of production environment by digital technology.

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QoS Routing Protocol Based on Virtual Grids and MultiPaths for Mobile Sinks in Wireless Sensor Networks (무선 센서 네트워크에서 이동 싱크를 위한 가상 그리드와 다중 경로 기반의 QoS 라우팅 프로토콜)

  • Yim, Jinhyuk;Lee, Euisin
    • KIPS Transactions on Computer and Communication Systems
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    • v.5 no.11
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    • pp.385-392
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    • 2016
  • Recently, Expectation Area-based Real-time Routing (EAR2) protocol has been proposed to support real-time routing in wireless sensor networks. EAR2 considers the expectation area of a mobile sink and uses flooding within the expectation area. However, flooding leads to excessive energy consumption and causes long delay against real-time routing. Moreover, since EAR2 uses single path to the expectation area, it is difficult to support reliable routing in sensor networks with high link failures. Thus, to overcome these limitation of EAR2, this paper proposes a reliable and real-time routing protocol based on virtual grids and multipath for mobile sinks. To support real-time routing, the proposed protocol considers expectation grids belonged to the expectation area. Instead of flooding within the expectation area, the proposed protocol uses multicasting to the expectation grids and single hop forwarding in an expectation grid because the multicasting can save much energy and the single hop forwarding can provide short delay. Also, the proposed protocol uses multipath to the expectation grids to deal with link failures for supporting reliable routing. Simulation results show that the proposed protocol is superior to the existing protocols.

A Study on the Defense Geospatial Intelligence Governance - Focusing on the Intelligence Community and LandWarNet (국방지리공간정보 거버넌스에 대한 연구 - 미(美) 정보공동체와 육군 랜드워넷을 중심으로)

  • Kim, Dong Hwan
    • Spatial Information Research
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    • v.22 no.1
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    • pp.19-26
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    • 2014
  • Recently, ICT environments have been increasingly developed and the pattern of the war also has been changed to NCW. The development of communication and network technology, for example, C4I and TDL(Tactical Data Link), has been prosperous and rapid. But the geospatial intelligence field which is the basis of the network frames relatively has not been developed. The purpose of this paper is to foster the geospatial governance in terms of the defense perspective. In order to do that, this paper deals with the U.S. Intelligence Community(IC) and the U.S. Army Global Information Grid(GIG), LandWarNet and those could be good examples of roles and statuses of geospatial intelligence. IC has been produced essential intelligence which is required for policymakers and military leaders. IC has several stove-piped intelligence process systems which have been separately developed and competed. And so as to complete GIG, the U.S. Army adopted LandWarNet. The U.S. Corps of Engineers organized the Army Geospatial Center(AGC) on 1 October 2009 to support LandWarNet. In order to develop NCW, we should recognize geospatial intelligence as the basis of network framework and make a central leading organization of defense geospatial intelligence. The mission of Korea Defense Geospatial-Intelligence Agency should be changed from producing GEOINT to a strategic GEOINT agency. The Army should organize a laboratory of geospatial intelligence field. The mission of producing GEOINT should be transferred to a geospatial intelligence battalion which is newly organized.

A 0.18-μm CMOS Baseband Circuits for the IEEE 802.15.4g MR-OFDM SUN Standard (IEEE 802.15.4g MR-OFDM SUN 표준을 지원하는 0.18-μm CMOS 기저대역 회로 설계에 관한 연구)

  • Bae, Jun-Woo;Kim, Chang-Wan
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.17 no.3
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    • pp.685-690
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    • 2013
  • This paper has proposed a multi-channel and wide gain-range baseband circuit blocks for the IEEE 802.15.4g MR-OFDM SUN systems. The proposed baseband circuit blocks consist of two negative-feedback VGAs, an active-RC 5th-order chebyshev low-pass-filter, and a DC-offset cancellation circuit. The proposed baseband circuit blocks provide 1 dB cut-off frequencies of 100 kHz, 200 kHz, 400 kHz, and 600 kHz respectively, and achieve a wide gain-range of +7 dB~+84 dB with 1 dB step. In addition, a DC-offset cancellation circuit has been adopted to mitigate DC-offset problems in direct-conversion receiver. Simulation results show a maximum input differential voltage of $1.5V_{pp}$ and noise figure of 42 dB and 37.6 dB at 5 kHz and 500 kHz, respectively. The proposed I-and Q-path baseband circuits have been implemented in $0.18-{\mu}m$ CMOS technology and consume 17 mW from a 1.8 V supply voltage.

Copper Interconnection and Flip Chip Packaging Laboratory Activity for Microelectronics Manufacturing Engineers

  • Moon, Dae-Ho;Ha, Tae-Min;Kim, Boom-Soo;Han, Seung-Soo;Hong, Sang-Jeen
    • Proceedings of the Korean Vacuum Society Conference
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    • 2012.02a
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    • pp.431-432
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    • 2012
  • In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

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A Robust Method for Automatic Generation of Moire Reference Phase from Noisy Image (노이즈 영상으로부터 모아레 기준 위상의 강인 자동 생성 방법)

  • Kim, Kuk-Won;Kim, Min-Young
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.10 no.5
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    • pp.909-916
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    • 2009
  • This paper presents the automatic vision algorithm to generate and calibrate reference phase plane to improve the accuracy of 3D measuring machine of using phase shifting projection moire method, which is not traditional N-bucket method, but is based on direct image processing method to the pattern projection image. Generally, to acquire accurate reference phase plane, the calibration specimen with well treated surface is needed, and detailed calibration method should be performed. For the cost reduction of specimen manufacturing and the calibration time reduction, on the specimen, not specially designed, with general accuracy level, an efficient calibration procedure for the reference phase generation is proposed. The proposed vision algorithm is developed to extract the line center points of the projected line pattern from acquired images, derive the line feature information consisting of its slope and intercept by using sampled feature points, and finally generate the related reference phase between line pairs. Experimental results show that the proposed method make reference phase plane with a good accuracy under noisy environment and the proposed algorithm can reduce the total cost to make high accurate calibration specimen, also increase the accuracy of reference phase plane, and reduce the complex calibration procedure to move grid via N-bucket algorithm precisely.

Remote Access and Data Acquisition System for High Voltage Electron Microscopy (초고전압 투과전자현미경의 원격제어 및 데이터 획득 시스템)

  • Ahn, Young-Heon;Kang, Ji-Seoun;Jung, Hyun-Joon;Kim, Hyeong-Seog;Jung, Hyung-Soo;Han, Hyuck;Jeong, Jong-Man;Gu, Jung-Eok;Lee, Sang-Dong;Lee, Jy-Soo;Cho, Kum-Won;Kim, Youn-Joong;Yeom, Heon-Young
    • Applied Microscopy
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    • v.36 no.1
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    • pp.7-16
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    • 2006
  • A new remote access system for a 1.3 MV high voltage electron microscope has been developed. Almost all essential functions for HVEM operation, huck as stage control, specimen tilting, TV camera selection and image recording, are successfully embedded into this prototype of the remote system. Particularly, this system permits perfect and precise operation of the goniometer and also controls the high resolution digital camera via simple Web browsers. Transmission of control signals and communication with the microscope is accomplished via the global ring network for advanced applications development (GLORIAD). This fact makes it possible to realize virtual laboratory to carry out practical national and international HVEM collaboration by using the present system

Lightweight Validation Mechanism for IoT Sensing Data Based on Obfuscation and Variance Analysis (난독화와 변화량 분석을 통한 IoT 센싱 데이터의 경량 유효성 검증 기법)

  • Yun, Junhyeok;Kim, Mihui
    • KIPS Transactions on Computer and Communication Systems
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    • v.8 no.9
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    • pp.217-224
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    • 2019
  • Recently, sensor networks are built and used on many kinds of fields such as home, traffic, medical treatment and power grid. Sensing data manipulation on these fields could be a serious threat on property and safety. Thus, a proper way to block sensing data manipulation is necessary. In this paper, we propose IoT(Internet of Things) sensing data validation mechanism based on data obfuscation and variance analysis to remove manipulated sensing data effectively. IoT sensor device modulates sensing data with obfuscation function and sends it to a user. The user demodulates received data to use it. Fake data which are not modulated with proper obfuscation function show different variance aspect with valid data. Our proposed mechanism thus can detect fake data by analyzing data variance. Finally, we measured data validation time for performance analysis. As a result, block rate for false data was improved by up to 1.45 times compared with the existing technique and false alarm rate was 0.1~2.0%. In addition, the validation time on the low-power, low-performance IoT sensor device was measured. Compared to the RSA encryption method, which increased to 2.5969 seconds according to the increase of the data amount, the proposed method showed high validation efficiency as 0.0003 seconds.

Hybrid Machine Learning Model for Predicting the Direction of KOSPI Securities (코스피 방향 예측을 위한 하이브리드 머신러닝 모델)

  • Hwang, Heesoo
    • Journal of the Korea Convergence Society
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    • v.12 no.6
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    • pp.9-16
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    • 2021
  • In the past, there have been various studies on predicting the stock market by machine learning techniques using stock price data and financial big data. As stock index ETFs that can be traded through HTS and MTS are created, research on predicting stock indices has recently attracted attention. In this paper, machine learning models for KOSPI's up and down predictions are implemented separately. These models are optimized through a grid search of their control parameters. In addition, a hybrid machine learning model that combines individual models is proposed to improve the precision and increase the ETF trading return. The performance of the predictiion models is evaluated by the accuracy and the precision that determines the ETF trading return. The accuracy and precision of the hybrid up prediction model are 72.1 % and 63.8 %, and those of the down prediction model are 79.8% and 64.3%. The precision of the hybrid down prediction model is improved by at least 14.3 % and at most 20.5 %. The hybrid up and down prediction models show an ETF trading return of 10.49%, and 25.91%, respectively. Trading inverse×2 and leverage ETF can increase the return by 1.5 to 2 times. Further research on a down prediction machine learning model is expected to increase the rate of return.