• Proceedings of the IEEK Conference
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• 2002.07c
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• pp.1940-1943
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• 2002

In this paper, we presented the design and implementation of 155Mbps satellite Modem adaptively compensated against the rain attenuation. In order to compensate the rain attenuation over high-speed satellite ink, the adaptive coding schemes with variable coding rates and the pragmatic TCM that can be decoded both the QPSK and TC-8PSK using same Viterbi decoder was studied and analyzed. The pragmatic TCM with rate 213, selected to the optimal parameters for implementation, was modeled by VHDL in this paper. The key design issues are how to achieve a high data rate and how to integrated into a single ASIC chip various functions such as the different data rates, Scrambler/descrambler, Interleaver, Encoder/decoder, and BPSK/QPSK/8PSK modulator/demodulator. The implemented 155M0ps adaptive MODEM has the simplified interface circuits among the many functional blocks, and parallel processing architecture to achieve the high data rate. This 155Mbps adaptive MODEM was designed and implemented by single ASIC chip with the 0.25 $\mu\textrm{m}$ CMOS standard cell technology.

• ETRI Journal
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• v.46 no.3
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• pp.550-563
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• 2024

A novel inductance simulation circuit employing only two dual-output voltage-differencing buffered amplifiers (DO-VDBAs) and a single capacitance (grounded) is proposed in this paper. The reported configuration is a purely resistor-less realization that provides electronically controllable realized inductance through biasing quantities of DO-VDBAs and does not rely on any constraints related to matched values of parameters. This structure exhibits excellent behavior under the influence of tracking errors in DO-VDBAs and does not exhibit instability at high frequencies. The simple and compact metal-oxide semiconductor (MOS) implementation of the DO-VDBAs (eight MOS per DO-VDBA) and adoption of grounded capacitance make the proposed circuit suitable for on-chip realization from the perspective of chip area consumption. The function of the pure grounded inductance is validated through high pass/bandpass filtering applications. To test the proposed design, simulations were performed in the PSPICE environment. Experimental validation was also conducted using the integrated circuit CA3080 and operational amplifier LF-356.

• Proceedings of the IEEK Conference
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• 2005.11a
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• pp.707-710
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• 2005

In this paper, we propose a new communication network for on-chip communication. The network is based on a direct sequence code division multiple access (DS-CDMA) technique. The new communication network is suitable for a parallel processing system and also drastically reduces the I/O pin count. Our network architecture is mainly divided into a CDMA-based network interface (CNI), a communication channel, a synchronizer. The network includes a reverse communication channel for reducing latency. The network decouples computation task from communication task by the CNI. An extreme truncation is considered to simplify the communication link. For the scalability of the network, we use a PN-code reuse method and a hierarchical structure. The network elements have a modular architecture. The communication network is done using fully synthesizable Verilog HDL to enhance the portability between process technologies.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.19 no.5
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• pp.1157-1162
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• 2015

This paper is the design and implementation to the 4x4 MIMO algorithm based on OFDM, and presented how to verify the implemented result. Algorithm applied the MRVD and QRM-MLD. Matlab and Simulink are used to design channel presumption & MIMO algorithm by Floating-point and Fixed-point model. After then implement VHDL using Modelsim. Performance of algorithm is checked by comparing Simulink model, Modelsim simulation, ISE ChipScope with the result measured by oscilloscope. This method is useful to verify an algorithm with uncompleted system. Conformance between the result of ChipScope and the result of oscilloscope is confirmed, it could be applied on the Backhaul system.

• Journal of the Institute of Convergence Signal Processing
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• v.1 no.1
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• pp.89-96
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• 2000

In this paper, we propose a vision algorithm for the inspection of very small RF-chip inductor which is used in mobile-communication terminal. The proposed method divides coil part from the inductor body by local adaptive thresholding and integral projection method. After dividing work, the coil components are extracted by thinning and labelling techniques. The test items are the number of turns, the intervals in coil, and the measure of uniformity between the extracted lines. If the values of these are more than the specific value a tested product is decided bad one. In the simulation, the proposed method has a good performance.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.131-135
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• 2002

In this project, we have developed various techniques for subminiaturization, surface implementation, high frequency design, small-sizes SMD, performance test and applications of ultra small chip antenna, which is a core component for the personal communication systems. We also obtained base techniques for the next-generation ultra small chip antenna design and fabrication techniques for an internationally competitive subminiature ultra small chip antenna. Center frequency is 2442.5MHz(Type), return loss is -10dB max, VSWR is 2max, xy max gain is -2dB min, size is 0.05ccmax.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.13 no.12
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• pp.2647-2654
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• 2009

In this paper, we propose H.264 Encoder integrating Intra Prediction, Deblocking Filter, Context-Based Adaptive Variable Length Coding, and Motion Estimation encoder module. This designed module can be operated in 440 cycle for one-macroblock. To verify the Encoder architecture, we developed the reference C from JM 9.4 and verified the our developed hardware using test vector generated by reference C. The designed circuit can be operated in 166MHz clock system, and has 1800K gate counts using Charterd 0.18 um process including SRAM memory. Manufactured chip has the size of $6{\times}6mm$ and 208 pins package.

• ETRI Journal
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• v.46 no.2
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• pp.323-332
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• 2024

Receiver and transmitter monolithic microwave integrated circuit (MMIC) multifunction chips (MFCs) for active phased-array antennas for Ka-band satellite communication (SATCOM) terminals have been designed and fabricated using a 0.15-㎛ GaAs pseudomorphic high-electron mobility transistor (pHEMT) process. The MFCs consist of four-channel radio frequency (RF) paths and a 4:1 combiner. Each channel provides several functions such as signal amplification, 6-bit phase shifting, and 5-bit attenuation with a 44-bit serial-to-parallel converter (SPC). RF pads are implemented on the bottom side of the chip to remove the parasitic inductance induced by wire bonding. The area of the fabricated chips is 5.2 mm × 4.2 mm. The receiver chip exhibits a gain of 18 dB and a noise figure of 2.0 dB over a frequency range from 17 GHz to 21 GHz with a low direct current (DC) power of 0.36 W. The transmitter chip provides a gain of 20 dB and a 1-dB gain compression point (P1dB) of 18.4 dBm over a frequency range from 28 GHz to 31 GHz with a low DC power of 0.85 W. The P1dB can be increased to 20.6 dBm at a higher bias of +4.5 V.

• Korean Journal of Optics and Photonics
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• v.24 no.6
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• pp.342-346
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• 2013

We present the thermal analysis result of die bonding for a high power LED package using a metal hybrid silicone adhesive structure. The simulation structure consists of an LED chip, silicone die adhesive, package substrate, silicone-phosphor encapsulation, Al PCB and a heat-sink. As a result, we demonstrate that the heat generated from the chip is easily dissipated through the metal structure. The thermal resistance of the metal hybrid structure was 1.662 K/W. And the thermal resistance of the total package was 5.91 K/W. This result is comparable to the thermal resistance of a eutectic bonded LED package.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.30 no.4
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• pp.314-319
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• 2019

In this study, we propose a W-band frequency modulated continuous wave(FMCW) radar altimeter that can measure the altitude based on the frequency differences of transmitted and received signals. This W-band FMCW system is powered by an altitude control algorithm, which we propose to help prevent collisions of drones with obstacles in real deployment by measuring the relative altitude. It is shown that this algorithm enables the drone to be positioned within a 3 % error of altitude from the desired input height. The chip used in the W-band transmitter and receiver was fabricated using a 65-nm CMOS process, and a horn antenna was directly fed by incorporating an embedded waveguide feeder into the chip. The clutter spectra observed in terrains including soil, grass, and calm lake water were measured and compared, confirming the reflectivity characteristics of various surfaces of different water contents.