• 약학회지
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• 제23권3_4호
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• pp.133-140
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• 1979

The adsorption of erythrosine in the aliphatic alcohols by antibiotics such as ampicillin anhydrous, ampicillin trihydrate, amoxicillin trihydrate, cephalexin monohydrate was studied. The adsorption isotherms were all described with Freudlich equation. From the various experimerts, it was found that the adsorption of erythrosine by antibiotics in the aliphatic alcohols was affected by the solubility of adsorbents. The adsoption in the mixture of aliphatic alcohols and water is related with the dielectric constant of mixed solvents. According to increase in the pH values of aqueous solution, the adsorption of erythrosine for antibiotics is decreased, but increased in the mixture of aliphatic alcohols and water. The adsorption of erythrosine in the suspension of antibiotics showed a correlation with the temperature. Colloidal silica which is used as stabilizer had a favorable effect on the adsorption of erythrosine in the suspension of antibiotics.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1880-1884
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• 2008

Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-steop CMP consists of Cu CMP and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the buffing is performed various conditions as a cleaning process. The buffing process combined mechanical cleaning by friction between a wafer and a buffing pad and chemical cleaning by buffing solution consists of tetramethyl ammonium hydroxide (TMAH)/benzotriazole(BTA).

• 소성∙가공
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• 제8권3호
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• pp.289-289
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• 1999

This paper describes the investment casting of TiAl alloys. The effects of mold material and mold preheating temperature for the investment casting of TiAl on metal-mold interfacial reaction were investigated by means of optical micrography, hardness profiles and an electron probe microanalyzer. The mold materials examined were colloidal silica bonded ZrO₂, ZrSiO₄, A1₂O₃and CaO stabilized ZrO₂. When compared with conventional titanium a1loy, the high aluminum concentration of TiAl alloys helps to lower their reactivity in the molten state. The A1₂O₃mold is a promising mold material for the investment casting of TiAl in terms of the thermal stability, formability and cost. Special attention need to be paid to thermal stability and mold preheating when developing the investment calling of TiAl alloys.

• 한국펄프종이공학회:학술대회논문집
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• 한국펄프종이공학회 1999년도 Proceedings of Pre-symposium of the 10th ISWPC
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• pp.125-129
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• 1999

This paper dealt with effect of dual component and micropartical retention system on papermaking. First-pass retention under dynamic drainage condition was studied in neutral and alkaline papermaking system. Cationic starches, amphoteric starches and amphoteric polyacrylamide were added prior to high shear force, then anionic. The system is found to be very useful to inprove filler retention. For mitigating unfavorable effect of interfering sub-stances, anionic trash catcher(ATC) such as p-DADMAC was tested in this study.

• 한국재료학회지
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• 제6권12호
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• pp.1179-1185
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• 1996

고온용 세라믹 쉘 몰드를 용융 알루미나와 콜로이달 실리카를 사용하여 제조한 후, 세라믹 쉘 몰드의 강도에 영향을 주는 요인을 분석하였다. 세라믹 쉘 몰드의 강도는 바인더의 실리카 입자의 크기가 작을수록 크며 또한 실리카 농도에 비례하여 증가함을 보이며 저온에서의 강도 발현은 콜로이달 실리카의 필름 형성에 의한 입자들의 결합임을 알 수 있었다. 세라믹 쉘 몰드의 소성 강도는 부착 스타코의 크기가 작을수록 크며 소성 온도에 비례하여 증가함을 보였다. 고온에서의 강도 발현은 알루미나 입자와 콜로이달 실리카 바인더의 결합뿐만 아니라 알루미나 입자사이의 결합도 영향을 줌을 알 수 있었다. 쉘 몰드의 결정상은 130$0^{\circ}C$이하에서 소성한 경우 $\alpha$-알루미나만 존재함을 보여 실리카는 비정질로 계속 남아 있음을 알 수 있고 140$0^{\circ}C$ 이상에서 소성한 경우 뮬라이트가 생성됨을 보였다.

• Journal of Pharmaceutical Investigation
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• 제14권4호
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• pp.170-177
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• 1984

For the purpose of improving the fluidity of enteric-coated powders, various mineral silicates were added during spray drying process. Aqueous slurries of cimetidine, mineral silicates containing CMEC (carboxy methyl ethyl cellulose) were spray dried using a centrifugal wheel atomizer. The finely agglomerated powders obtained by this process were flowing as opposed to the original powders. The effect of four mineral silicates (colloidal silica, talc, bentonite, and kaolin) on the micromeritic properties and dissolution profiles of spray dried agglomerates were examined.

• 대한화학회지
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• 제32권2호
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• pp.149-155
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• 1988

ZSM-5, ZSM-8, ZSM-11 및 실리카라이트를 포함하는 펜타실 제올라이트들을 여러가지 유기양이온과 실리카졸을 사용하여 합성하고 반응온도, 교반, 숙성시간 등 합성조건을 변화시키므로서 균일한 크기와 모양을 갖는 결정을 얻었다. TEA-OH(수산화 사에틸암모늄), TPA-OH, TBA-OH 및 Choline이 유기양이온으로 사용되었으며 콜로이달 실리카(Snowtex)를 실리카원으로 사용했다. 합성 실험은 $2{\ell}$ 압력 반응기 (parr제품)와 자체 제작된 자석식 반응기를 사용하였으며, 반응물 조성(실리카/알루미나 비), 반응온도 등이 펜타실 제올라이트 합성의 중요한 인자임을 알았다.

• 한국지반공학회:학술대회논문집
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• 한국지반공학회 2009년도 세계 도시지반공학 심포지엄
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• pp.529-534
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• 2009

This study had propose that a characteristic of recently developed Silicasol to make a close in this study, grouting material usually used portland cement and a characteristic is compared between Silicasol and sodium silicate in this study, examined strength and environmentally friendly for compare characteristics of sodium silicate and Silicasol through unconfined compressive strength, SEM analysis, Permeability test, Chemical Resistance test, leaching test etc. In the test, I gained that unconfined compressive strength of Silicasol three times promoted than sodium silicate Within 72 hours and I gined through analysis of SEM that Silicasol is more compactivetive than sodium silicate. In the result of test, it was found to be a environmentally friendly material as the toatal amount of eluviated elementary had small quantity.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 하계학술대회 논문집 Vol.9
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• pp.537-537
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• 2008

Copper (Cu) has been widely used for interconnection structure in intergrated circuits because of its properties such as a low resistance and high resistance to electromigration compared with aluminuim. Damascene processing for the interconnection structure utilizes 2-steps chemical mechanical polishing(CMP). After polishing, the removal of abrasive particles on the surfaces becomes as important as the polishing process. In the paper, buffing process for the removal of colloidal silica from polished Cu wafer was proposed and demonstrated.

• Transactions on Electrical and Electronic Materials
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• 제5권6호
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• pp.233-236
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• 2004

Copper metallization has been used in high-speed logic ULSI devices instead of the conventional aluminum alloy metallization. One of the key issues in copper CMP is the development of slurries that can provide high removal rates. In this study, the effects of slurry chemicals and pH for slurry dispersion stability on Cu CMP process characteristics have been performed. The experiments of copper slurries containing each different alumina and colloidal silica particles were evaluated for their selectivity of copper to TaN and $SiO_{2}$ films. Furthermore, the stability of copper slurries and pH are important parameters in many industries due to problems that can arise as a result of particle settling. So, it was also observed about several variables with various pH.