• Journal of Korean Society of Water and Wastewater
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• v.30 no.3
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• pp.343-350
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• 2016

Membrane distillation (MD) is a novel separation process that have drawn attention as an affordable alternative to conventional desalination processes. However, membrane fouling and pore wetting are issues to be addressed prior to widespread application of MD. In this study, the influence of ultrasonic irradiation on fouling and wetting of MD membranes was investigated for better understanding of the MD process. Experiments were carried out using a direct contact membrane distillation apparatus Colloidal silica was used as a model foulants in a synthetic seawater (35,000 mg/L NaCl solution). A vibrator was directed attached to membrane module to generate ultrasonic waves from 25 kHz (the highest energy) to 75 kHz (the lowest energy). Flux and TDS for the distillate water were continuously monitored. Results suggested that ultrasonic irradiation is effective to retard flux decline due to fouling only in the early stage of the MD operation. Moreover, wetting occurred by a long-term application of ultrasonic rradiation at 75 kHz. These results suggest that the conditions for ultrasonic irradiation should be carefully optimized to maximize fouling control and minimize pore wetting.

• Journal of the Korean Society for Precision Engineering
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• v.32 no.1
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• pp.69-74
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• 2015

Cadmium telluride (CdTe) is being developed for thin film of the X-Ray detector recently. But a rough surface of the CdTe should be improved for resolution and signal speed. This paper shows the study on the improvement of surface roughness and removal rate by applying Chemical Mechanical Polishing. The conventional potassium hydroxide (KOH) based colloidal silica slurry could not realize a mirror surface without physical defects, resulting in low material removal rate and many scratches on surface. In order to enhance chemical reaction such as form oxidized layer on the surface of cadmium telluride, we used hydrogen peroxide ($H_2O_2$) as an oxidizer. Consequently, in case of 3 wt% concentration of hydrogen peroxide, the highest MRR (938 nm/min) and the lowest surface roughness ($R_{p-v}=10.69nm$, $R_a=0.8nm$) could be obtained. EDS was also used to confirm the generated oxide of cadmium telluride surface.

• Proceedings of the Membrane Society of Korea Conference
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• 1996.06a
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• pp.149-153
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• 1996

반도체 소자 제조 공정이 고 집적화 됨에 따라 습식 세정방법에 의한 세정공정의 중요성이 더욱 증가 되어지고 있으며, 특히 그 중에서 전체 세정공정의 약 절반을 차지하고 있는 Deionised water에 의한 rinsing 공정의 경우 ultrapure water의 quality가 최근 지속적으로 향상이 되어짐에 따라 많은 발전을 자져 왔다. 일반적으로 Deionised water에 함유하고 있는 TOC(total oxidisable components), bacteria, metallic impurity, desolved oxygen cencentration, colloidal material impurity (예를 들면 Silica, oraganic substrate)등은 ultra pure water의 quality를 결정하는데 매우 중요한 factor로 작용하고 있으며, 이러한 불순물들이 반도체 제조공정중 wafer surface에 흡착되어 졌을때 여러형태의 defect들을 유발한다고 알려져 있다. 그러나 pseudommonas, flavobacterlum, alcaligene등의 기 얄려진 bacteria들의 경우 Deionised water를 supply해주는 배관의 Inner surface에 잘 흡착 되지만 고온의 water 혹은 과산화수소수($H_{2}O_{2}$) 를 이용하여 주기적으로 처리 해줌으로 인하여 이에 대한 문제점을 어느정도 최소화 시킬수 있다. 위의 두가지 방법중 전자의 경우 chemical을 사용하지 않고, 유지 및 관리가 간편하며, 용존산소량을 줄일수 있다는 점에서 장점이 있으나, 전 ultra pure water의 system이 열적으로 안정해야 하고 경제적인 문제가 수반하는 단점을 가지고 있다. 후자의 경우, 미량의 과산화수소수 (1~10,000 ppm)를 이용해 처리 해주는 방법의 경우 경제적으로 큰 장점이 있고, 처리가 단순하다는 장점이 있으나 과산화수소수 자체에 포함하고 있는 높은 impurit level, 그리고 처리후 장시간의 flushing time을 가져야 한다는 단점등이 존재 하고 있다.

• Journal of Korean Society of Water and Wastewater
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• v.33 no.6
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• pp.413-420
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• 2019

Pretreatment system of desalination process using seawater reverse osmosis(SWRO) membrane is the most critical step in order to prevent membrane fouling. One of the methods is coagulation-UF membrane process. Coagulation-UF membrane systems have been shown to be very efficient in removing turbidity and non-soluble and colloidal organics contained in the source water for SWRO pretreatment. Ferric salt coagulants are commonly applied in coagulation-UF process for pretreatment of SWRO process. But aluminum salts have not been applied in coagulation-UF pretreatment of SWRO process due to the SWRO membrane fouling by residual aluminum. This study was carried out to see the effect of residual matal salt on SWRO membrane followed by coagulation-UF pretreatment process. Experimental results showed that increased residual aluminum salts by coagulation-UF pretreatment process by using alum lead to the decreased SWRO membrane salt rejection and flux. As the salt rejection and flux of SWRO membrane decreased, the concentration of silica and residual aluminum decreased. However, when adjusting coagulation pH for coagulation-UF pretreatment process, the residual aluminum salt concentration was decreased and SWRO membrane flux was increased.

• Journal of Korea Foundry Society
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• v.28 no.6
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• pp.282-287
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• 2008

The effect of CaO mold on the formation of reaction layer was investigated. CaO mold was prepared by mixing of Colloidal silica($NALCO^{(R)}$ 1130) and an $ZrO_2$, CaO at room temperature. The dried at $20{\pm}3^{\circ}C$, 75% humidity for 12hrs. Sample was prepared from the Cp-Ti(grade-2) and melted by high frequence induction melting system in the vacuum condition. The react ion layer of Ti was confirmed by optical microscopy, microhardness(Hv) and X-ray diffraction. Thickness of reaction layer using the CaO stabilized ZrO2 was thinner than the CaO added ZrO2. And thickness of reaction layer were decreased with decreasing pH of slurry. CaO addition in the slurry could not controlled reaction between molten Ti and investment mold. On the other hand, the CaO chemical bonded ZrO2 by stabilization treatment could controlled reaction between molten Ti and investment mold.

• Journal of the Korean Ceramic Society
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• v.49 no.6
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• pp.542-548
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• 2012

The viscosity of a ceramic slurry depends on the slurry concentration, particle shape and size, hydrodynamic interactions, temperature, shear rate, pre-treatment condition and the method of measurement with the selected equipment. Representative ceramic slurries with low to high viscosity levels are selected from colloidal silica, barium titanate slurry and glass frit paste. Rotational rheometers and vibrational viscometers are used to compare the measured viscosity for various ceramic slurries. The rotational rheometer measured the viscosity according to the change of the shear rate or the rotational speed. On the other hand, the vibrational viscometer measured one point of the viscosity in a fixed vibrational mode. The rotational rheometer allows the measurement of the viscosity of a ceramic paste with a viscosity higher than 100,000 cP, while the vibrational viscometer provides an easy and quick method to measure the viscosity without deformation of the ceramic slurry due to the measurement method. It is necessary to select suitable equipment with which to measure the viscosity depending on the purpose of the measurement.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.05b
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• pp.150-153
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• 2004

CS HSA, 1034A와 TMOS, MTMS 실란 간의 졸겔 반응조건이 코팅도막의 특성에 미치는 영향을 조사하기 위하여 CS 종류, CS 대비 TMOS/MTMS의 함량비, 반응시간 등을 달리하여 졸을 합성하고, 합성된 졸을 slide glass에 코팅한 후 $300^{\circ}C$에서 경화시킨 도막의 특성들을 조사하였다. CS 대비 MTMS의 함량 증가와 더불어 접촉각이 증가할 것으로 예상되지만 CS의 종류, 실란함량, 반응시간 등에 따라 증가하는 모양은 상당히 차이가 있었고 HSA CS계 보다는 1034A CS계로 제작된 도막에서 MTMS 함량과 접촉각과의 상관성이 다소 우수하였다. 표면거칠기는 HSA CS계인 경우에 반응시간과 MTMS 함량에 따라 민감하게 변했지만 1034A CS계에서는 HSA계의 졸에 비해 표면 거칠기가 향상되어 반응시간과 MTMS 함량의 조건에 영향을 받지 않고 표면조도와 균질성이 우수하였다.

• Proceedings of the KIEE Conference
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• 2005.07c
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• pp.1930-1932
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• 2005

Colloidal Silica(CS)/methyltrimethoxy silane(MTMS) and CS/MTMS/epoxy silane(Es) sol solutions were prepared in variation with synthesizing parameters such as kinds of CS, kinds of silane and reaction time. In order to understand its physical and chemical properties, sol-gel coating films on glass were fabricated. In the case of CS/MTMS sol, the coating films had high contact angle and more enhanced flat surface than those in the case of CS/MTMS/ES sol. Also, the coating films obtained from single CS had a better flat surface than those obtained from mixed CS. In the case of thermal stability, thermal dissociation of CS/MTMS and CS/MTMS/ES sol-gel coating films did not occur up to $550^{\circ}C$ and $440^{\circ}C$ respectively. The thickness of coating films obtained from CS/MTMS sol increased than those of CS/MTMS/ES sol. In addition, the coating films obtained from single CS were more thicker than those obtained from mixed CS.

• Journal of the Korea institute for structural maintenance and inspection
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• v.14 no.1
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• pp.71-77
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• 2010

The concrete structure's durability and integrity is reduced owing to various deterioration phenomena. Therefore, it is important to prevent the deterioration phenomena. This study inquired into the various experimental results of specimens with different dilution concentration and impregnation time by the each solution to present the economic and efficient using method of the inorganic surface penetration agents. As a results, the reasonable dilution concentration and impregnation time of colloidal silica solutions are 15% and 5 minute and for the sodium alumina silicate solutions are 17% and 10 second.

• Tribology and Lubricants
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• v.34 no.6
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• pp.226-234
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• 2018

Copper chemical mechanical planarization (CMP) has become a key process in integrated circuit (IC) technology. The results of copper CMP depend not only on the mechanical abrasion, but also on the slurry chemistry. The slurry used for Cu CMP is known to have greater chemical reactivity than mechanical material removal. The Cu CMP slurry is composed of abrasive particles, an oxidizing agent, a complexing agent, and a corrosion inhibitor. Citric acid can be used as the complexing agent in Cu CMP slurries, and is widely used for post-CMP cleaning. Although many studies have investigated the effect of citric acid on Cu CMP, no studies have yet been conducted on the interfacial friction characteristics and step height reduction in CMP patterns. In this study, the effect of citric acid on the friction characteristics and step height reduction in a copper wafer with varying pattern densities during CMP are investigated. The prepared slurry consists of citric acid ($C_6H_8O_7$), hydrogen peroxide ($H_2O_2$), and colloidal silica. The friction force is found to depend on the concentration of citric acid in the copper CMP slurry. The step heights of the patterns decrease rapidly with decreasing citric acid concentration in the copper CMP slurry. The step height of the copper pattern decreases more slowly in high-density regions than in low-density regions.