• 한국신재생에너지학회:학술대회논문집
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• 2009.06a
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• pp.126-129
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• 2009

In this study, it was aimed to develop the re-use technology of ultra-fine silicon powders, by-products during the current production process of high purity poly-Si feedstock. For this goal, the compacts of the silicon powders were tried to fabricate by CIP (Cold Isostatic Pressing) method using silicon rubber mold without chemical binder materials. The density ratio of the silicon powder compacts reached 74%. In order to simulate the actual handling and charging conditions of feedstock material in casting process, a shaking test was carried out and mass loss measured. Finally, the silicon powder compacts were melted using a cold crucible induction melting method and the purity assessment was conducted by Hall effect measurement.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1996.10a
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• pp.131-138
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• 1996

A new yield criterion for metal powder compaction based on continuum mechanics has been proposed. It includes three parameters to characterize the geometrical hardening of powder compact and strain hardening of incompressible metal matrix. The elasto-plastic finite element method to describe compaction of metal powders has been formulated using the new yield criterion. The values of parameters in the yield criterion can be determined using cold isostatic pressing(CIP). The finite element method can simulate compaction behavior of various copper powders.

• Journal of the Korean Ceramic Society
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• v.29 no.5
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• pp.391-395
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• 1992

In order to improve the compactness and uniformity in ceramic green body, we have developed dynamic CIP(Cold Isostatic Pressing) as a new forming method in which the CIP and the vibratory pressing were combined. In dynamic CIP, bulk density on alumina compacts was linearly increased with higher │Pmax-Pbias│and maximum pressure of dynamic-CIP was decreased over one-third of that of conventional CIP to obtain the same bulk density.

• Korean Journal of Materials Research
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• v.12 no.8
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• pp.634-640
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• 2002

To improve the ductility of mTEX>$(Al +12.5%Cu)<_3$Zr intermetallics, which are the potential high temperature structural materials, the mechanical alloying behavior, the effect of pressure and temperature on the $Ll_2$, phase formation and the behavior of the cold isostatic press and sintering were investigated. However mechanically alloyed A1$_3$Zr alloy have been known to have high mechanical strength even at high temperature, its workability was poor. A method of solution is refined grain size and phase transformation from $DO_{23}$ to $Ll_2$.$ Ll_2$ structure TEX>$(Al+12.5%Cu)<_3$Zr with nanocrystalline microstructure intermetallic powders where were prepared by mechanical alloying of elemental powders. Grain sizes of the as milled powders were less than 10nm (from transmission electron microscopy, TEM). Thermal analyses showed that $Ll_2$ structure was stable up to$ 800^{\circ}C$ for 1hour $(Al+ 12.5%Cu)<_3$Zr. $(Al+12.5%Cu)<_3$Zr has been consolidated by cold isostatic pressing (CIP 138, 207, 276, 414MPa) at room temperature and subsequent heat treatment at high temperatures where $Ll_2$ structure was stable under vacuum atmosphere. The results showed that 94.2% density of Ll$_2$ compacts was obtained for the (Al +12.5%Cu)$_3$Zr by sintering at 80$0^{\circ}C$ for 1hour (under CIPed 207MPa). This compact of the grain size was 40nm.

• Proceedings of the Korean Vacuum Society Conference
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• 2014.02a
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• pp.471.2-471.2
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• 2014

We demonstrate here that an improvement in precursor film density (green density) leads to a great enhancement in the photovoltaic performance of CuInSe2 (CISe) thin film solar cells fabricated with Cu-In nanoparticle precursor films via chemical solution deposition. A cold-isostatic pressing (CIP) technique was applied to uniformly compress the precursor film over the entire surface (measuring 3~4 cm2) and was found to increase its relative density (particle packing density) by ca. 20%, which resulted in an appreciable improvement in the microstructural features of the sintered CISe film in terms of lower porosity, reduced grain boundaries, and a more uniform surface morphology. The low-bandgap (Eg=1.0 eV) CISe PV devices with the CIP-treated film exhibited greatly enhanced open-circuit voltage (VOC, from 0.265 V to 0.413 V) and fill factor (FF, from 0.34 to 0.55), as compared to the control devices. As a consequence, an almost 3-fold increase in the average power conversion efficiency, 3.0 to 8.2% (with the highest value of 9.02%), was realized without an anti-reflection coating. A diode analysis revealed that the enhanced VOC and FF were essentially attributed to the reduced reverse saturation current density (j0) and diode ideality factor (n). This is associated with the suppressed recombination, likely due to the reduction in recombination sites such as grain/air surfaces (pores), inter-granular interfaces, and defective CISe/CdS junctions in the CIP-treated device. From the temperature dependences of VOC, it was confirmed that the CIP-treated devices suffer less from interface recombination.

• Progress in Superconductivity and Cryogenics
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• v.21 no.2
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• pp.40-44
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• 2019

In this study, the effects of the compaction method for (Mg+2B) powders on the apparent density and superconducting properties of $MgB_2$ bulk superconductor were investigated. The raw powders used in this study were nano-sized boron (B) and spherical magnesium (Mg). A batch of a powder mixture of (Mg+2B) was put in a steel mold and uniaxially pressed at 1 ton or 3 tons into pellets. Another batch of the powder mixture was uniaxially pressed at 1 ton and then pressed isostatically at $1800kg/cm^2$ in the water chamber. All pellets were heat-treated at $650^{\circ}C$ for 1 h in flowing argon gas for the formation of $MgB_2$. The apparent density of powder compacts pressed at 3 ton was higher than that at 1 ton. The cold isostatic pressing (CIP) in a water chamber allowed further increase of the apparent density of powder compacts, which influenced the pellet density of the final products ($MgB_2$). The compaction methods (uniaxial pressing and CIP) did not affect the formation of $MgB_2$ and superconducting critical temperature ($T_c$) of $MgB_2$, but affected the critical current density ($J_c$) of $MgB_2$ significantly. The sample with the high apparent density showed high $J_c$ at 5 K and 20 K at applied magnetic fields (0-5 T).

• Korean Journal of Materials Research
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• v.11 no.9
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• pp.745-750
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• 2001

Ni-33.3at%Si elemental powder mixtures were mechanically alloyed by a high-energy ball mill, followed by CIP (cold isostatic pressing) and HIP (hot isostatic pressing) for different processing conditions. Only elemental phases (Ni and Si) were observed for the 15 min mechanically alloyed (MA 15 min) powder. but $Ni_2$Si and elemental phases were observed to coexist for the 30 min mechanically alloyed (MA 30 min) powder. Elemental Ni and $Ni_2$Si phases were observed for the HIPed compact of MA 15 min powder at 100 and 150 MPa for 2 hr at $800^{\circ}C$. Only the $Ni_2$Si phase was, however, observed for the HIPed compacts of MA 30 min powder. For the HIPed compacts, the highest sintered density was obtained to be 99.5% of theoretical density by a HIP step at $1100^{\circ}C$ at 150MPa for 2hr. The hardness values of the HIPed $Ni_2$Si compacts at $1100^{\circ}C$ at 100/150 MPa for 2 hr were higher than HRC 66. The densification and mechanical property of HIPed $Ni_2$Si compacts were found to depend on more HIP temperature than HIP pressure.

• Journal of Powder Materials
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• v.8 no.4
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• pp.223-230
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• 2001

Ti-37.5at%Si elemental powder mixtures were mechanically alloyed by a high-energy ball mill, followed by CIP (cold isostatic pressing) and HIP (hot isostatic pressing) for different processing conditions. Only elemental phases (Ti and Si) were observed for the 5 min mechanically alloyed (MA 5 min) powder, but only $Ti_5Si_3$phase was observed for the 30 min mechanically alloyed (MA 30 min) powder. $Ti_5Si_3$phase was observed for the HIPed compact of MA 5 min and 30 min powders at 150 and 190 MPa for 3 hr at $1000^{\circ}C$. For the HIPed compacts, the highest sintered density was obtained to be 99.5% of theoretical density by a HIP step at $1350^{\circ}C$ at 190MPa for 3hr. The hardness values of the HIPed $Ti_5Si_3$compacts at $1350^{\circ}C$ at 150/190 MPa for 3hr were higher than HRC 76. The densification and mechanical property of HIPed $Ti_5Si_3$compacts was found to depend on more HIP temperature than HIP pressure.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.16 no.10
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• pp.938-945
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• 2003

We fabricated Ni-substrate for YBCO coated conductors and evaluated the effects of pressing and annealing temperature and time on texture. Ni substrate was fabricated by powder metallurgy technique and compacts were prepared by applying uniaxial or isostatic pressure. The texture of substrate made by applying cold isostatic pressure (CIP) was stronger than that by uniaxial pressure which we attribute to the fact that the CIP method provided higher density and more uniform density distribution. It was observed that the substrate annealed at 400 C showed both retained texture and recrystallized texture. On the other hand, the texture of substrate significantly improved at annealing temperature above 500 C, forming strong 4-fold symmetry, [111] II ND texture, and FWHM of 9∼10 . It is to be noted that the degree of texture was almost independent of annealing temperature (500∼1000 C) and annealing time(1∼54 min, at 1000 C). EBSD and AFM analysis indicated that 99% of grain boundaries was low angle grain boundary and RMS was approximately 3 nm, respectively. Development of strong cube texture and high fraction of low angle grain boundary of Ni-substrate made by powder metallurgy technique in our study is considered to be suitable for the application of YBCO coated conductors.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 2003.02a
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• pp.68-71
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• 2003

We fabricated Ni-substrate for YBCO coated conductors and evaluated the effects of pressing and annealing time on texture. Ni substrate was fabricated by powder metallurgy technique and compacts were prepared by applying uniaxial or isostatic pressure. The texture of substrate made by applying cold isostatic pressure (CIP) was stronger than that by uniaxial pressure. The texture of substrate made by CIP had a strong 4-fold symmetry and [111] ∥ ND texture after annealing temperature of 100$0^{\circ}C$. It is to be noted that the degree of texture was almost independent of annealing time and the full-width at half-maximum (FWHM) of in-plane and out-of-plane was measured to be in the range of 9.55$^{\circ}$-10.53$^{\circ}$ and 8.57$^{\circ}$-9.85$^{\circ}$, respectively. Development of strong cube texture of Ni-substrate made by powder metallurgy technique in our study is considered to be suitable for the application of YBCO coated conductors.