• Proceedings of the KSME Conference
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• 2003.04a
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• pp.1315-1320
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• 2003

The thermal expansion coefficient, which causes the micro failure at the interfacial state of thin films is necessary to consider for proper designing MEMS. The effect of temperature on the coefficient of thermal expansion(CTE) of $SiO_2$ and $Si_3N_4$ film was investigated. Thermal strain induced by mismatch of CTE between substrate and thin film continuously measured with resolution-improved electronic speckle pattern interferometry(ESPI). The thermal stress induced by mismatch of CTE derivate through thermal strain. The thermal expansion coefficients of thin film were calculated with the general equation of CTE and thermal stress in thin films, and it confirmed that CTE of $SiO_2$changed from $0.25{\times}10^{-6}/^{\circ}C$ to $1.4{\times}10^{-6}/^{\circ}C$ with temperature increasing from 50 to $600^{\circ}C$

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.630-633
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• 2004

Generally, component and FR-4 board are connected by solder joint. Because material properties of components and FR-4 board are different, component and FR-4 board show different coefficients of thermal expansion (CTE) and thus strains in component and board are different when they are heated. That is, the differences in CTE of component and FR-4 board cause the dissimilarity in shear strain and BGA solder joint s failure. The first order Taylor series expansion of the limit state function incorporating with thermal fatigue models is used in order to estimate the failure probability of solder joints under heated condition. A model based on plastic-strain rate such as the Coffin-Manson Fatigue Model is utilized in this study. The effects of random variables such as frequency, maximum temperature, and temperature variations on the failure probability of the BGA solder joint are systematically investigated by using a failure probability model with the first order reliability method(FORM).

• Steel and Composite Structures
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• v.19 no.5
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• pp.1221-1236
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• 2015

Since the coefficients of thermal expansion (CTE) between concrete and GFRP, steel and GFRP are quite different, GFRP laminates with different laminas stacking-sequence present different thermal behavior and currently there is no specification on mechanical properties of GFRP laminates, it is necessary to investigate the thermal influence on composite girder with stay-in-place (SIP) bridge deck at different levels and on different scales. This paper experimentally and theoretically investigated the CTE of GFRP at lamina's and laminate's level on micro-mechanics scales. The theoretical CTE values of laminas and laminates agreed well with test results, indicating that designers could obtain thermal properties of GFRP laminates with different lamina stacking-sequence through micro-mechanics methods. On the basis of the CTE tests and theoretical analysis, the thermal behaviors of composite girder with hybrid GFRP-concrete deck were studied numerically and theoretically on macro-mechanics scales. The theoretical results of concrete and steel components of composite girder agreed well with FE results, but the theoretical results of GFRP profiles were slightly larger than FE and tended to be conservative at a safety level.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.65 no.9
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• pp.1504-1510
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• 2016

The aim of this study is to improve properties both glass transition temperature($T_g$) and coefficient of thermal expansion(CTE) using epoxy/micro-nano alumina composites with adding glycerol diglycidyl ether (GDE:1,2,3,5g). This paper deals with the effects of GDE addition for epoxy/micro alumina contents (40, 50, 60wt%)+surface modified nano alumina(1_phr) composites. 20 kinds specimen were prepared with containing micro, nano alumina and GDE as a micro composites(10, 20, 30, 40, 50, 60, 70wt%) or a nano/micro alumina composites(1phr/40, 50, 60wt%). Average particle size of nano and micro alumina used were 30nm and $1{\sim}2{\mu}m$, respectively. The micro alumina used were alpha phase with Heterogeneous and nano alumina were gamma phase particles of spherical shape. The glass transition temperature and coefficients of thermal expansion was evaluated by DSC and TMA. The glass transition temperature decreased and coefficients of thermal expansion become smaller with filled contents of epoxy/micro alumina composites. On the other hand, $T_g$ and CTE as GDE addition variation(1,2,3,5g) of epoxy/micro-nano alumina composites decreased and increased respectively.

• Composites Research
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• v.12 no.6
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• pp.1-7
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• 1999

The change of the coefficients of thermal expansion(CTE) of Carbon/Epoxy was investigated for the temperature variation and a prediction model for the change of CTE was proposed. Elastic properties and CTEs in the principal material directions were measured in the range of room temperature to cure temperature and characterized as functions of temperature. By applying the characterized properties to the classical lamination theory, a computational method to predict the change of CTEs of a general laminate for temperature variation was proposed. the coefficients of thermal expansion of laminates with various stacking sequences were measured and compared with those predicted. Good agreements between the predicted results and the experimental data show that the c hanges of CTEs of a general laminate for temperature variation can be predicted well by using the proposed method.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.38 no.10
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• pp.1049-1056
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• 2014

Microelectronics components contain various materials with different coefficients of thermal expansion (CTE). Although a large amount of published data on the CTE of standard materials is available, it occasionally becomes necessary to measure this property for a specific actual material over a particular temperature range. A change in the temperature of a material causes a corresponding change in the output of the strain gage installed on the specimen because of not only the mechanical load but also the temperature change. In this paper, a detailed technique for CTE measurement based on these thermal characteristics of strain gages is proposed and its reliability is evaluated. A steel specimen, aluminum specimen, and copper specimen, whose CTE values are well known, were used in this evaluation. The proposed technique was successfully applied to the measurement of the CTE of a coreless package substrate composing of electronics packages.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.18 no.4
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• pp.41-47
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• 2019

The advent of highly integrated, high-power electronics requires low a coefficient of thermal expansion performance to prevent delamination between the heat dissipation material and substrate. This paper reports a preliminary study on the manufacturing technology of gas reaction control composite material, focusing on the prediction of the thermal expansion coefficients of Al-AlN composite materials. We obtained numerical equivalent property values by using finite element analysis and compared the values with theoretical formulas. Al-AlN should become the optimal composite material when the proportion of the reinforcing phase is approximately 0.45.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.25 no.10
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• pp.798-804
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• 2012

This paper focuses on thermal properties of a newly prepared composite material by nano-silica and micro-silica mixture. Nano-silica and micro-silica mixture composites were made by dispersing surface treated nano-silica(average radius: 10 nm) and micro-size silica in epoxy resin. To investigate the effects of nano-silica and micro-size silica mixture(ENMC), the glass transition temperature (Tg), coefficients of thermal expansion(CTE) and elastic modulus of DMA properties by DSC, TMA and DMA devices were measured for the ENMC according to increase nano-silica addition contents and EMC. All properties of the neat epoxy were improved by the addition of micro-silica, which was improved much further by the addition of surface treated nano-silica to the EMC system.

• Proceedings of the KSME Conference
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• 2004.04a
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• pp.365-370
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• 2004

Generally, component and FR-4 board are connected by solder joint. Because material properties of components and FR-4 board are different, component and FR-4 board show different coefficients of thermal expansion (CTE) and thus strains in component and board are different when they are heated. That is, the differences in CTE of component and FR-4 board cause the dissimilarity in shear strain and solder joint' failure. The first order Taylor series expansion of the limit state function incorporating with Tresca failure criterion is used in order to estimate the failure probability of solder joints under heated condition. Using shear stresses and shear strains appeared on the solder joint, we estimate the failure probability of solder joints with the Tresca failure criterion. The effects of random variables such as CTE, distance of the solder joint from the neutral point(DNP), temperature variation and height of solder on the failure probability of the solder joint are systematically studied by using the failure probability model with first order reliability method(FORM).

• Journal of the Computational Structural Engineering Institute of Korea
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• v.27 no.5
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• pp.393-401
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• 2014

In this paper, we propose an evaluation scheme of the coefficients of thermal expansion (CTE) of constituents in composite materials using an inverse analysis. The size of constituents typically is about a few micrometers, which makes the identification of material properties difficult as well as the measurement results inaccurate. The proposed inverse analysis scheme, which is combined with the Mori-Tanaka method for predicting an equivalent CTE of composite materials, provides the CTE of the constituents in a straightforward manner by minimizing the cost function defined in lamina scale with the steepest descent method. To demonstrate the effectiveness and accuracy of the proposed scheme, the CTEs of several fibers (glass fiber, P75, P100, and M55J) embedded in matrix are evaluated and compared with experimental results. Furthermore, we discuss the effects of uncertainty of laminar and matrix properties on the prediction of fiber properties.