Proceedings of the KSME Conference (대한기계학회:학술대회논문집)
- 2004.04a
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- Pages.365-370
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- 2004
Reliability Estimation of Solder Joint by Using Failure Probability Model
파손확률 모델을 이용한 솔더 조인트의 건전성 평가
- Published : 2004.04.28
Abstract
Generally, component and FR-4 board are connected by solder joint. Because material properties of components and FR-4 board are different, component and FR-4 board show different coefficients of thermal expansion (CTE) and thus strains in component and board are different when they are heated. That is, the differences in CTE of component and FR-4 board cause the dissimilarity in shear strain and solder joint' failure. The first order Taylor series expansion of the limit state function incorporating with Tresca failure criterion is used in order to estimate the failure probability of solder joints under heated condition. Using shear stresses and shear strains appeared on the solder joint, we estimate the failure probability of solder joints with the Tresca failure criterion. The effects of random variables such as CTE, distance of the solder joint from the neutral point(DNP), temperature variation and height of solder on the failure probability of the solder joint are systematically studied by using the failure probability model with first order reliability method(FORM).
Keywords
- Failure Probability;
- Coefficient of Thermal Expansion;
- Solder Joint;
- Reliability;
- Tresca Failure Criterion
- 파손확률;
- 열팽창 계수;
- 땝납 접합부;
- 신뢰성;
- Tresca 파손평가기준;