• 전자공학회논문지A
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• 제30A권11호
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• pp.99-104
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• 1993

We analyzed the D.I. water used in wet cleaning process of semiconductor device manufacturing both at the D.I. water plant and at the wafer cleaning bath to detect the impurity source of D.I. water contamination. This shows that the quantity of impurity is related to the resistivity of D.I. water, and we found that the cleanliness of the wafer surface processed in D.I. water bath was affected by the degree of the ionic impurity contamination. So we evaluated the cleaning effect as different method for Fe ion, having the best adsoptivity on wafer surface. Moreover the temperature effect of the D.I. water is investigated in case of anion in order to remove the chemical residue after wet process. In addition to the control of D.I. water resistivity, chemical analysis of impurity control in D.I. water should be included and a suitable cleaning an drinsing method needs to be investigated for a high yielding semiconductor device.

• 한국전기전자재료학회논문지
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• 제24권1호
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• pp.17-21
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• 2011

Copper (Cu) had been attractive material due to its superior properties comparing to other metals such as aluminum or tungsten and considered as the best metal which can replace them as an interconnect metal in integrated circuits. CMP (Chemical Mechanical Polishing) technology enabled the production of excellent local and global planarization of microelectronic materials, which allow high resolution of photolithography process. Cu CMP is a complex removal process performed by chemical reaction and mechanical abrasion, which can make defects of its own such as a scratch, particle and dishing. The abrasive particles remain on the Cu surface, and become contaminations to make device yield and performance deteriorate. To remove the particle, buffing cleaning method used in post-CMP cleaning and buffing is the one of the most effective physical cleaning process. AE(Acoustic Emission) sensor was used to detect dynamic friction during the buffing process. When polishing is started, the sensor starts to be loaded and produces an electrical charge that is directly proportional to the applied force. Cleaning efficiency of Cu surface were measured by FE-SEM and AFM during the buffing process. The experimental result showed that particles removed with buffing process, it is possible to detect the particle removal efficiency through obtained signal by the AE sensor.

• 에너지공학
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• 제12권3호
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• pp.197-206
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• 2003

본 연구에서는 다공성 세라믹 필터를 사용하는 집진장치에서 역세정 과정의 유동특성을 규명하고, 역세정 시스템 설계에 적용하기 위한 전산해석을 수행하였다. 주요 연구내용으로는 역세정 과정에서 중요한 변수인 노즐 직경, 노즐 팁의 위치, 다공성 세라믹 캔들필터의 투과율, 디퓨저 형상, 역세정 압력 등이 집진장치 내부에서의 속도분포, 압력분포 등 역세정 유동특성에 미치는 영향을 상세히 계산하여 역세정 시스템의 사양 설계에 활용할 수 있도록 하였다. 전산해석에는 상용의 FLUENT code를 사용하여 에너지 보존식을 포함한 압축성 축대칭 Navier-Stokes 방정식을 유한체적법 (Finite volume method)으로 해석하였다.

• 한국염색가공학회지
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• 제3권2호
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• pp.10-15
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• 1991

This study was to examine the anti-bacteria effect and the changes of chemical properties of chrome-tanned garment leathers on the preservative treatment. Various test methods, such as investigation of preservative treatment process, resistance test and chemical analysis by cleaning, antbbacterial test by shake flask method are carried out in this study. The results can be obtained as follows: 1. Bacterial reduction percentage of chrome-tanned garment leathers on the preservative treatment was 28.6%. 2. In the antbbacterial effect by dry cleaning, preservative treated leathers has no resistance. 3. Fats content has been removed by dry cleaning using perchloroethylene, so garment leathers properties were altered. 4. PH value was changed by dry cleaning. But once after fats removing, it was changed the little by dry cleaning numbers.

• Journal of Biosystems Engineering
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• 제33권4호
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• pp.230-238
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• 2008

Mechanization such as machine harvesting, precleaning, drying and cleaning for rapeseed harvested with high moisture content should be accomplished for biodiesel production. In addition, machine drying and cleaning is inevitable in the mechanization of work, just because rice should be transplanted right after harvesting rapeseed in Korea. Particularly, early harvested rapeseed with the combine have high moisture content and undesirable materials such as stalks and stones which make drying-process difficult and lower the efficiency of drying. Therefore, this study was conducted to develop precleaner and cleaner which could remove foreign substances from harvested rapeseeds. The precleaner consists of throw-in hopper, conveyor, feeding hopper, two precleaning sieves and discharging sections. Precleaning capacity was 1,505 kg/hr in shaking frequency of 370 cpm (cycles per minute) and tilt angles of between $5^{\circ}$ and $7^{\circ}$. The efficiency of precleaning was between 90.9% and 91.5%. The cleaner consists of feeding, shaking, blowing, cleaning and discharging sections. Cleaning performance was 435.4kg/hr in the number of rocking motions of 475 cpm and tilt angle of $10^{\circ}$. The ratios of cleaning, foreign substances and loss were 96.5%, 3.5% and 0.2%, respectively.

• 한국산학기술학회:학술대회논문집
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• 한국산학기술학회 2001년도 춘계학술대회 발표논문집
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• pp.124-128
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• 2001

A present semiconductor cleaning technology is based upon RCA cleaning technology which consumes vast amounts of chemicals and ultra pure water(UPW) and is the high temperature Process. Therefore, this technology gives rise to the many environmental issues, and some alternatives such as functional water cleaning are being studied. The electrolyzed water was generated by an electrolysis system which consists of anode, cathode, and middle chambers. Oxidative water and reductive water were obtained in anode and cathode chambers, respectively. In case of NH$_4$Cl electrolyte, the oxidation-reduction potential and pH for anode water(AW) and cathode water(CW) were measured to be +1050mV and 4.8, and -750mV and 10.0, respectively. AW and CW were deteriorated after electrolyzed, but maintained their characteristics for more than 40 minutes sufficiently enough for cleaning. Their deterioration was correlated with CO$_2$ concentration changes dissolved from air. It was known that AW was effective for Cu removal, while CW was more effective for Fe removal. The particle distributions after various particle removal processes maintained the same pattern. In this work, RCA consumed about 9$\ell$chemicals, while EW did only 400$m\ell$ HCI electrolyte or 600$m\ell$ NH$_4$Cl electrolyte. It was hence concluded that EW cleaning technology would be very effective for eliminating environment, safety, and health(ESH) issues in the next generation semiconductor manufacturing.

• 한국해양생명과학회지
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• 제9권1호
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• pp.1-8
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• 2024

Over the past decade, there has been global expansion in the advancement of underwater cleaning technology for ship hulls. This methodology ensures both diver safety and operational efficiency. However, recent attention has been drawn to the harmful effects of ship hull-cleaning wastewater on marine animals. It is anticipated that this wastewater may have various impacts on a wide range of organisms, potentially leading to populationand ecosystem-relevant alterations. This concern is especially significant when the wastewater affects functionally important species, such as aquaculture animals and habitat-forming species living in coastal regions, where underwater cleaning platforms are commonly established. Despite this, information on the ecotoxicological effects of this wastewater remains limited. In this mini review, we discuss the adverse effects of wastewater from in-water cleaning processes, as well as the current challenges and limitations in regulating and mitigating its potential toxicity. Overall, recent findings underscore the detrimental effects posed by sublethal levels of wastewater to the health status of aquatic animals under both acute and chronic exposure.

• 한국재료학회지
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• 제18권6호
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• pp.307-312
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• 2008

In this study, a new cleaning process with a low cost of ownership (CoO) was developed with ozonated DI water ($DIO_3$). An ozone concentration of 40 ppm at room temperature was used to remove organic wax film and particles. Wax residues thicker than $200\;{\AA}$ remained after only a commercial dewaxer treatment. A $DIO_3$ treatment in place of a dewaxer showed a low removal rate on a thick wax layer of $8000\;{\AA}$ due to the diffusion-limited reaction of ozone. A dewaxer was combined with a $DIO_3$ rinse to reduce the wax removal time and remove wax residue completely. Replacing DI rinse with the $DIO_3$ rinse resulted in a surface with a contact angle of less than $5^{\circ}$, which indicates no further cleaning steps would be required. The particle removal efficiency (PRE) was further improved by combining a SC-1 cleaning step with the $DIO_3$ rinsing process. A reduction in the process time was obtained by introducing $DIO_3$ cleaning with a dewaxing process.

• 한국환경보건학회지
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• 제49권2호
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• pp.78-88
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• 2023

Background: Exposure to volatile organic compounds (VOCs) can have acute and chronic health effects on human beings in general and in working environments. In particular, VOCs are often emitted in large quantities in industrial settings. In such circumstances, there is a need to improve the indoor air quality at workplaces. Objectives: The purposes of this study were to verify the effectiveness of air cleaning devices in workplaces and provide alternative solutions for improving working environments. Methods: Personal exposure and area level of VOCs for workers were evaluated in a car-part adhesive process before and after installing an air cleaning device with a TiO₂-coated filter. Passive samplers and direct reading instruments were used to collect and analyze the VOCs, and the removal efficiency and improvement of air quality were evaluated. We also calculated the exposure index (EI) to assess the risk level in the workplace. Results: The removal efficiency for VOCs through the installation of the air cleaning device was approximately 26.9~69.0% as determined by the concentration levels before and after installation. The measured substances did not exceed the exposure limits for the work environment and the EI was less than 1. However, carcinogenic substances such as benzene, formaldehyde, carbon tetrachloride, and trichloroethylene were detected. Conclusions: The application of an air cleaning device can be a solution for controlling the indoor air quality in a workplace, particularly in cases where ventilation systems cannot be installed due to process limitations.

• 청정기술
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• 제7권3호
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• pp.203-214
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• 2001

플라즈마를 발생시키는 반응기체의 종류에 따라 실리콘 산화막 세정에 어떠한 영향을 미치는지에 대해 연구하였다. 압력 (100 mTorr), 전력 (300 W, 500 W), 전극간 거리 (5, 8, 11.5 cm), 세정시간 (90초, 180초), 가스유량 (50sccm) 등의 변수들을 고정시키고 $CHF_3$, $CF_4$, 아르곤, 산소 등의 세정가스를 변화시키며 세정성능을 비교하였다. 세정결과 아르곤 플라즈마는 단지 물리적인 스퍼터링 효과만으로 세정속도가 느렸다. 산소 플라즈마는 5cm 전극거리, 300W, 180초 세정시 좋은 세정효과를 내었으나, 표면거칠기가 증가하였다. $CF_4$ 플라즈마의 경우 가장 좋은 세정효과를 얻었다. $CHF_3$ 플라즈마는 CFx/F의 비율을 낮출 수 있는 첨가기체가 필요함을 알 수 있었다. $CHF_3$에 아르곤을 첨가하였을 경우에는 원활한 세정효과를 얻을 수 없었으나, 산소를 첨가하였을 경우 좋은 세정효과를 얻을 수 있었다.