• 한국재료학회지
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• 제16권2호
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• pp.75-79
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• 2006

The effect of ozone and/or ultrasound treatments on the efficiency of slurry removal in post sliced cleaning (PSC) of silicon ingot was studied. Efficiency of slurry removal was evaluated as functions of time, temperature and surfactant with DOE (Design of Experiment) method. Residual slurries were observed on the wafer surface in case of cleaning by ozone or ultrasound separately. However, a clean wafer surface was appeared when cleaned with ozone and ultrasound simultaneously. It has found that cleaning time was the main effect among temperature, time and surfactant. Elevated temperature, addition of surfactant and high ozone concentration helped to accelerate efficient removal of slurry. The improvement of removal efficiency seems to be related to the formation of more active OH radicals. The highly cleaned surface was achieved at 10 wt% ozone, 1 min and 10 vol% surfactant with ultrasound. Application of ozone and ultrasound might be a useful method for PSC process in wafer cleaning.

• Environmental Engineering Research
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• 제21권1호
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• pp.45-51
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• 2016

Membrane bioreactor (MBR) and reverse osmosis (RO) membrane system was applied to the treatment and reclamation of textile wastewater in Thailand. An experiment was carried out to determine the fouling behavior and effect of anti-scalant and biocide addition to flux decline and its recovery through chemical cleaning. The RO unit was operated for one month after which the fouled membranes were cleaned by sequential chemical cleaning method. RO flux was found rapidly declined during initial period and only slightly decreased further in long-term operation. The main foulants were organic compounds and thus sequential cleaning using alkaline solution followed by acid solution was found to be the most effective method. The provision of anti-scalant and biocide in feed-water could not prevent deposition of foulant on the membrane surface but helped improving the membrane cleaning efficiencies.

• 청정기술
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• 제18권3호
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• pp.287-294
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• 2012

본 연구에서는 중고 레이저 복합기의 재제조 과정에서 복합기의 성능에 큰 영향을 미치는 인쇄회로기판(printed circuit board, PCB) 등 전자부품에 대하여 세정공정의 도입 적용 가능성을 분석하고 세정장치 및 최적의 운전조건을 설계하였다. 1단계로 물에 의한 부식의 염려가 없는 건식세정방식으로 플라즈마세정에 의한 세정성을 분석하였다. 플라즈마세정 의한 PCB세정에서는 세정이 어느 정도 이루어졌으나 플라즈마가 전도 될 수 있는 피세정물의 금속 부분 주위에서 피 세정물의 손상을 확인할 수 있었으며 레이저 복합기의 재제조용으로는 생산성 및 경제성이 부족하였다. 2단계에서는 경제성이 있는 초음파세정방식을 위하여 현재 현장에서 사용되고 있는 세정제를 포함하여 세정효율이 우수한 4종의 대체 세정제를 선정하여, 세정제의 물성을 측정하였고 세정성을 평가하였다. 준수계 세정제와 비수계 세정제보다 수계 세정제의 세정력이 우수 하였으며, 초음파 주파수가 작을수록 세정력이 우수하였다. 수계세정제 A를 사용하여 28 kHz의 초음파 세기에서 세정을 한다면 30초~1분 내에 빠른 세정이 가능할 것으로 판단되었다. 3단계에서는 선정된 세정제로 초음파 세정시스템을 구축하고, 실제 부품들을 초음파 세정하여 현장에서 사용이 적합한 최적의 세정조건을 구하였다. PCB 보드 및 대전기에 대하여 최적 세정 조건을 구한 결과, 40 kHz, $50^{\circ}C$에서 1분 30초 및 2분에 세정을 끝낼 수 있었다. 수작업에 의존하거나 외부처리를 하고 있는 중소 재제조 업체들은 본 세정시스템의 도입으로 전자부품 기능의 신뢰성이 확보되며 전체적인 재제조 공정의 생산성 및 경제성 향상에 큰 효과를 볼 수 있을 것으로 기대된다.

• 기본간호학회지
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• 제18권4호
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• pp.472-479
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• 2011

Purpose: The purpose of this study was to develop guidelines for cleaning of enteral nutrition bags by comparing the level of equipment contamination according to cleaning and disinfection methods. Method: This study was a true-experimental study, with 60 cases in total. Twenty cases each were randomly assigned to tepid water, detergent and brush, and disinfectant groups. The period of the experiment was March to April 2010, and enteral nutrition was given for 1 houre, 3 times a day at 7AM, noon, and 7PM for seven days. Enteral nutrition bags were cleaned after each feeding according to assigned cleaning and disinfection method followed by microbial cultures on 4th and 8th day before the 7AM feeding. Results: After 3 days of feeding and cleaning, the level of contamination of bags was not significantly different among the three groups. After seven days, the level of contamination was significantly lower when bags were cleaned with detergent and brush or with disinfectant compared to cleaning with tepid water. Conclusion: In cases where enteral nutrition bags are reused for example, in home care settings, studying findings indicate that cleaning bags using detergent and brush or disinfectant is an effective way to prevent contamination of bags.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2016년도 춘계 학술논문 발표대회
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• pp.255-256
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• 2016

In order to overcome the limitation of conventional cleaning method by workers, variety attempts to develop a window cleaning apparatus has been tried. However, the existing cleaning devices were lack of consideration for avoiding projection parts of the window such as frames or profiles. In this study, operating mechanism of cleaning tool for avoiding the projections parts using a two-axis robot is proposed. Proposed mechanism is that a wiper are reposed in a relatively stationary in the vicinity of the projection and avoided the projection in this state. It is expected that the mechanism is the base of driving cleaning tool part in the new window cleaning apparatus.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2013년도 추계 학술논문 발표대회
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• pp.224-225
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• 2013

Most of the building exterior wall cleaning robots use a water jet device for spraying water. However this method is sprayed excessive water usage than water quantity required for cleaning. And setting weight of the water pump cleaning device increase the weight of the building exterior wall cleaning robot. Therefor, this paper suggest that the mechanisms scatter minimal cleaning water using a spinning device of the building exterior wall cleaning robot.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2001년도 ICCAS
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• pp.129.3-129
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• 2001

In this paper, a novel navigation method is presented for the cleaning robot in the unknown workspace. In order to do this, we propose a new map representation method and a complete coverage navigation method. First, we discuss a triangular cell map representation which makes the cleaning robot navigate with shorter path and increased flexibility than a rectangular cell map representation. Then we proposed a complete coverage navigation and map construction method which the cleaning robot can navigate the complete workspace although it has perfectly no information about environment. Finally, we evaluate the performance of our proposed triangular cell map comparing to that of the rectangular cell map via the existing ...

• 한국응용과학기술학회지
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• 제16권3호
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• pp.237-240
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• 1999

This study showed that the optimized cleaning process using non-aqueous cleaning solvents is adaptable in the industrial field for existing 1.1.1-TCE cleaning solvents which is an ozone depleting sustance. Alternative cleaning solvent system substituted for existing cleaning solvent against non-aqueous pollutants(cutting & flux oil), was evaluated for the cleaning efficiency using gravimetric analysis method and surface change of sample by Image analyzer. The results showed that alternative solvents and process had excellent cleaning efficiency.

• 한국정밀공학회지
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• 제31권12호
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• pp.1107-1113
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• 2014

In this article, the megasonic cleaning system for cleaning micro/nano particles from flat panel display (FPD) surfaces was developed. A piezoelectric actuator and a waveguide were designed by finite element method (FEM) analysis. The calculated peak frequency value of the quartz waveguide was 1002 kHz, which agreed well with the measured value of 1003 kHz. The average acoustic pressure of the megasonic cleaning system was 43.1 kPa, which is three times greater than that of the conventional type of 13.9 kPa. Particle removal efficiency (PRE) tests were performed, and the cleaning efficiency of the developed system was proven to be 99%. The power consumption of the developed system was 64% lower than that of the commercial system. These results show that the developed megasonic cleaning system can be an effective solution in particle removing from FPD substrate with higher energy efficiency and lower chemical and ultra pure water (UPW) consumption.

• 한국레이저가공학회지
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• 제6권3호
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• pp.29-35
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• 2003

In semiconductor processing, there are two types of particle contaminated onto the wafer, i.e. dry and wet state particles. In order to evaluate the cleaning performance of laser shock wave cleaning method, the removal of 1 m sized alumina particle at different particle conditions from silicon wafer has been carried out by laser-induced shock waves. It was found that the removal efficiency by laser shock cleaning was strongly dependent on the particle condition, i.e. the removal efficiency of dry alumina particle from silicon wafer was around 97％ while the efficiencies of wet alumina particle in DI water and IPA are 35％ and 55％ respectively. From the analysis of adhesion forces between the particle and the silicon substrate, the adhesion force of the wet particle where capillary force is dominant is much larger than that of the dry particle where Van der Waals force is dominant. As a result, it is seen that the particle in wet condition is much more difficult to remove from silicon wafer than the particle in dry condition by using physical cleaning method such as laser shock cleaning.