• 한국안광학회지
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• 제19권2호
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• pp.179-188
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• 2014

목적: 본 연구에서는 계면활성성분 및 함유량이 다른 콘택트렌즈 관리용액의 세척효율 및 가시광선투과율에 미치는 영향을 알아보고자 하였다. 방법: 다른 재질의 소프트렌즈(etafilcon A 및 hilafilcon B 재질)에 인공누액을 이용하여 각각 단백질을 침착시킨 후 계면활성성분 및 함유량이 다른 6종류의 다목적용액을 사용하여 세척한 후 그에 따른 세척효율 및 광투과율을 비교하였다. 결과: Etafilcon A 재질 렌즈의 경우 다목적용액으로 문지르기를 하여 세척하였을 때 세척효율은 다목적용액의 계면활성성분 농도와 표면장력에 따라 약 23~43%로 다양하게 나타났으며, 계면활성성분 이외에 과산화수소를 함유하는 다목적용액으로 세척 시 가장 높은 세척효율을 보였으나 렌즈에 잔존하는 단백질량이 많았다. 다목적용액으로 세척 후 가시광선투과율은 89.8%~90.8%으로 나타났다. Hilafilcon B 재질 렌즈에서는 인공누액에 7일간 배양하더라도 침착되는 단백질양이 매우 적어 etafilcon A 재질 렌즈의 5~10% 수준의 단백질량을 보였으며 가시광선투과율 감소도 크지 않았다. 다목적용액으로 문질러 세척하였을 경우 45.4~67.4%의 세척효율을 보였으나 etafilcon A 재질 렌즈와는 다른 세척효율 순서를 보였으며, 광투과율은 새 렌즈 수준으로 회복되었다. 결론: 이상의 결과로 소프트렌즈의 단백질 침전물의 올바른 관리를 위하여서는 다목적용액의 계면활성성분이나 원리에 대한 이해를 바탕으로 렌즈 재질과 침착된 단백질량에 따라 적절한 다목적용액을 선택하여야 하며, 제조사의 가이드라인과 상관없이 문지르기를 하여 관리하는 것이 보다 효율적임을 알 수 있었다.

• 한국염색가공학회:학술대회논문집
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• 한국염색가공학회 2008년도 제38차 학술발표대회
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• pp.181-183
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• 2008

Four different subtilisins of protease were investigated to see their effects on the cleaning activity. The cleaning solution was formulated with various non-ionic surfactants and other additives such as propylene glycol, triethanolamine, pH balancer etc. to evaluate their effect on enzyme activity as well. Evaluation of formulated cleaning solution was carried under K0120 using pre-soiled textiles from EMPA. The results showed that the cleaning activity on soil removal was not severly influenced by surfactant but the enzyme mostly. In addition, the activity of enzymes was not much affected by the type of surfactants as long as the surfactants were non-ionic. Liquinase among the four enzymes used in this study showed the best performance on soil removal, especially blood stain.

• 상하수도학회지
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• 제13권1호
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• pp.140-145
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• 1999

This study was carried out a investigate the effect of chemical cleaning of corrosion product in cooling system made of copper and copper alloy as basic material and used cooling water as pure water. We studied chemical cleaning condition that minimizes the influence on basic material by means of EDTA solution so as to eliminate the slurry in cooling system. As a result, we found that the main components of sludge in cooling system produced by corrosion of copper were $Cu_2O$, CuO, Cu, and Fe. The optimum condition of chemical cleaning was 400 ppm EDTA solution at $60^{\circ}C$.

• Bulletin of the Korean Chemical Society
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• 제18권7호
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• pp.737-740
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• 1997

The influence of cyclic treatments with H2O2/DIW (1 : 10) and HF/DIW (1 : 100) on the roughness of silicon surface in the wet chemical processing was investigated by atomic force microscopy (AFM). During the step of the SC-1 cleaning, there is a large increase in roughness on the silicon surface which will result in the poor gate oxide breakdown properties. The roughness of the silicon wafer after the SC-1 cleaning step was reduced by cyclic treatments of hydrogen peroxide solution and hydrofluoric acid solution instead of HF-only cleaning. AFM images after each step clearly illustrated that the average roughness of silicon surface after three times treatments with H2O2 and HF solutions was reduced by 10 times compared with that after the SC-1 cleaning step.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2008년도 추계학술대회A
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• pp.1880-1884
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• 2008

Cleaning is required following CMP (chemical mechanical planarization) to remove particles. The minimization of particle residue is required with each successive technology generation, and the cleaning of wafers becomes more complicated. In copper damascene process for interconnection structure, it utilizes 2-steop CMP consists of Cu CMP and barrier CMP. Such a 2-steps CMP process leaves a lot of abrasive particles on the wafer surface, cleaning is required to remove abrasive particles. In this study, the buffing is performed various conditions as a cleaning process. The buffing process combined mechanical cleaning by friction between a wafer and a buffing pad and chemical cleaning by buffing solution consists of tetramethyl ammonium hydroxide (TMAH)/benzotriazole(BTA).

• 한국응용과학기술학회지
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• 제32권3호
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• pp.372-376
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• 2015

The experiment was performed using the cleaning precipitator To investigate the absorption efficiency of the $SO_X/NO_X$ of the aqueous ammonia solution. Concentration of the cleaning liquid is 0.1, 0.5, and 1.0% with increasing absorption efficiency has improved. However, the reaction shown only a difference in time. Absorption efficiency has improved in accordance with the gas residence time. When the direction of the same gas and the cleaning liquid is determined that there is the effect of increasing the residence time. The relative impact of $SO_X$ and $NO_X$ is this likely to react slower than $SO_X/NO_X$. The yield is determined to require adjustment of the cleaning dust collector according to the concentration of the next gas.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2011년도 춘계학술발표대회
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• pp.34.2-34.2
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• 2011

The demand for Ru has been increasing in the electronic, chemical and semiconductor industry. Chemical mechanical planarization (CMP) is one of the fabrication processes for electrode formation and barrier layer removal. The abrasive particles can be easily contaminated on the top surface during the CMP process. This can induce adverse effects on subsequent patterning and film deposition processes. In this study, a post Ru CMP cleaning solution was formulated by using sodium periodate as an etchant and citric acid to modify the zeta potential of alumina particles and Ru surfaces. Ru film (150 nm thickness) was deposited on tetraethylorthosilicate (TEOS) films by the atomic layer deposition method. Ru wafers were cut into $2.0{\times}2.0$ cm pieces for the surface analysis and used for estimating PRE. A laser zeta potential analyzer (LEZA-600, Otsuka Electronics Co., Japan) was used to obtain the zeta potentials of alumina particles and the Ru surface. A contact angle analyzer (Phoenix 300, SEO, Korea) was used to measure the contact angle of the Ru surface. The adhesion force between an alumina particle and Ru wafer surface was measured by an atomic force microscope (AFM, XE-100, Park Systems, Korea). In a solution with citric acid, the zeta potential of the alumina surface was changed to a negative value due to the adsorption of negative citrate ions. However, the hydrous Ru oxide, which has positive surface charge, could be formed on Ru surface in citric acid solution at pH 6 and 8. At pH 6 and 8, relatively low particle removal efficiency was observed in citric acid solution due to the attractive force between the Ru surface and particles. At pH 10, the lowest adhesion force and highest cleaning efficiency were measured due to the repulsive force between the contaminated alumina particle and the Ru surface. The highest PRE was achieved in citric acid solution with NaIO4 below 0.01 M at pH 10.

• 한국안광학회지
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• 제16권4호
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• pp.391-401
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• 2011

목적: 국내 안경원의 시험착용렌즈와 관리용품의 관리 실태를 조사하고 분석함으로써 관리 소홀로 인하여 유발될 수 있는 사고의 위험성을 낮추고자 하였다. 방법: 콘택트렌즈 착용자들을 대상으로 시험착용렌즈의 착용 시 느끼는 점을 설문 조사하였으며, 콘택트렌즈를 취급하는 안경원의 안경사를 대상으로 시험착용 콘택트렌즈인 미용렌즈와 RGP 렌즈 그리고 렌즈 관리용품의 관리 실태를 설문 조사하였다. 결과: 시험착용 미용렌즈와 RGP 렌즈의 경우는 98% 이상의 안경사들이 렌즈 착용 전후 세척을 실시하고 있기 때문에 소비자들은 렌즈의 위생 상태를 신뢰하고 있는 것으로 나타났다. 시험착용 미용렌즈의 착용 전 세척은 생리식염수 38.5%, 전용 다목적 용액 40.5%, 생리식염수와 다목적 용액의 병행 사용 21%로 이루어지고 있었으며, 착용 후 세척은 생리식염수 13%, 다목적 용액 75%, 생리식염수와 다목적 용액의 병행이 12%로 이루어지고 있었다. 반면 시험착용 RGP 렌즈의 경우는 착용 전 세척에는 생리식염수가 28.5%, 전용 다목적 용액이 38.5%, 식염수와 다목적 용액 병행이 33%로 나타났으며, 착용 후 보관전 세척은 식염수가 2.5%, 다목적 용액이 70%, 다목적 용액 세척 후 식염수 세척은 27.5%를 차지하여 비교적 세척이 잘 이루어지고 있었다. 안경원에서 시험착용 미용렌즈의 세척은 주로 열흘에서 1개월을 주기로 이루어지는 것으로 나타냈고, 보관용기의 세척은 1 개월을 주기로 이루어졌다. 시험착용 RGP 렌즈의 세척주기는 주로 1개월 또는 2~3개월이었다. 시험착용렌즈 보관용기의 경우는 계면활성제를 이용하여 세척한 후 찬물로 헹구는 경우가 75% 이상으로 나타났다. 관리용품인 생리식염수의 보관기간은 주로 일주일로 나타났고, 다목적 용액의 보관기간은 주로 1개월이나 2~3개월로 나타나 안경원에서 렌즈 관리용액의 보관기간은 비교적 잘 지켜지고 있는 것으로 조사되었다. 결론: 안경원에서의 시험착용렌즈 및 관련 관리용품의 관리는 전반적으로 양호하게 이루지고 있었으나 생리식염수를 이용한 세척을 지양하고, 2주 이내의 세척주기와 뜨거운 물로의 렌즈 보관용기 헹굼이 추가적으로 강화된다면 국민의 눈 건강 증진과 더불어 안경사에 대한 더 높은 신뢰성 구축이 가능할 것이다.

• 공업화학
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• 제33권2호
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• pp.229-233
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• 2022

In this study, a gas-liquid hybrid atmospheric pressure plasma reactor of the dielectric barrier discharge method was fabricated and characterized. The solubility of copper oxide in the organic acid solution was increased when argon having a larger atomic weight than helium was used during plasma discharge. There was no significant effect of mixing organic acid solutions under plasma discharge treatment on the variation of copper oxide's solubility. As the applied voltage for plasma discharge and the concentration of the organic acid solution increased, the dissolution and removal power of the copper oxide layer increased. Solubility of copper oxide was more affected by the concentration in organic acid solution rather than the variation of plasma applied voltage. The usefulness of hybrid plasma reactor for the surface cleaning process was confirmed.

• Membrane and Water Treatment
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• 제12권1호
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• pp.1-9
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• 2021

This study optimized the chemical cleaning process of discarded RO membranes for reuse in less demanding separation processes. The effect of physicochemical parameters, including the temperature, cleaning time, pH of the cleaning solution, and addition of additives, on the cleaning process was investigated. The membrane performance was evaluated by testing the flux recovery rate and salt rejection before and after the cleaning process. High temperatures (45-50 ℃) resulted in a better flux recovery rate of 71% with more than 80% salt rejection. Equal time for acid and base cleaning 3-3 h presented a 72.43% flux recovery rate with salt rejection above 85%. During acid and base cleaning, the best results were achieved at pH values of 3.0 and 12.0, respectively. Moreover, 0.05% concentration of ethylenediaminetetraacetic acid presented 72.3% flux recovery, while 69.2% flux was achieved using sodium dodecyl sulfate with a concentration of 0.5%; both showed >80% salt rejection, indicating no damage to the active layer of the membrane. Conversely, 0.5% concentration of sodium percarbonate showed 83.1% flux recovery and 0.005% concentration of sodium hypochlorite presented 85.2% flux recovery, while a high concentration of these chemicals resulted in oxidation of the membrane that caused a reduction in salt rejection.