• Journal of the Korean Applied Science and Technology
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• v.10 no.2
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• pp.35-40
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• 1993

Alkaline cleaning agent(ACA) was prepared by blending of POE(4)octadecylmine(S-204), $Na_2CO_3$, sodium orthosilicate(Na-OSi). Tetronix T-701(T-701), and MJU-100A. The physical properties of ACA tested with steel specimen showed the following results. The cleaning powers of ACA-6(S-204 80g/$Na_2CO_3$, 160g/Na-OSi, 80g/T-701, 60g/MJU-100A, 20g mixture) for press-rust preventing oil was 98% and 99% degreasing at 2wt%, $70^{\circ}C$ and $90^{\circ}C$, respectively : for quenching oil, the cleaning power of ACA-6 was 95% degreasing at 2wt% and $70^{\circ}C$. From these results, it was ascertained that ACA-6 exhibited a good cleaning power. Foam heights measured immediately after foaming by Ross & Miles method and Ross & Clark method at 3wt%. $60^{\circ}C$ were 17mm and 40mm, respectively. As the result, ACA-6 was proved a good low foaming cleaning agent.

• Journal of the Korean Applied Science and Technology
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• v.21 no.4
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• pp.306-312
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• 2004

An acid cleaning agent (AACA) for aluminum was prepared by blending of sorbitol, n-octanoic acid, MJU-100A, Tetronix T-701, PPA-23, C8-83 and phosphoric acid. With the prepared AACA, degreasing, foam height, etching and derusting tests were carried out. As a result, AACA-4 and AACA-7 showed better cleaning ability than commercial acid cleaning agents.

• Membrane and Water Treatment
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• v.5 no.3
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• pp.207-219
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• 2014

Fouling is one of the critical factors associated with the application of membrane technology in treating palm oil mill effluent (POME), due to the presence of high concentration of solid organic matter, oil, and grease. In order to overcome this, chemical cleaning is needed to enhance the effectiveness of membranes for filtration. The potential use of sodium hydroxide (NaOH), sodium chloride (NaCl), hydrochloric acid (HCl), ethylenediaminetetraacetic acid (EDTA), and ultrapure water (UPW) as cleaning agents have been investigated in this study. It was found that sodium hydroxide is the most powerful cleaning agent, the optimum conditions that apply are as follows: 3% for the concentration of NaOH, $45^{\circ}C$ for temperature solution, 5 bar operating pressure, and solution pH 11.64. Overall, flux recovery reached 99.5%. SEM images demonstrated that the membrane surface after cleaning demonstrated similar performance to fresh membranes. This is indicative of the fact that NaOH solution is capable of removing almost all of the foulants from PES membranes.

• Clean Technology
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• v.18 no.3
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• pp.287-294
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• 2012

In this study, performances of two cleaning methods were analyzed and a cleaning system was designed to develop a cleaning process of electronic components to remanufacture old laser copy machine. First, plasma cleaning as a dry cleaning method was executed to test cleaning ability. In cleaning of printed circuit board (PCB) by plasma, some damages were found near the metal parts, and considering the productivity, this method was not adequate for the cleaning of electronic components. With 4 different cleaning agents, ultrasonic cleaning tests were executed to select an optimal cleaning agent, aqueous agents showed superior cleaning performance compared to semi-aqueous and non-aqueous agents. Cleaning with aqueous cleaning agent A and 28 kHz ultrasonic frequency can be completed in 30 sec to 1 min. Finally, an ultrasonic cleaning system was constructed based on the pre-test results. Optimal cleaning conditions of 40 kHz and $50^{\circ}C$ were found in the field test. The productivity and economic efficiency in remanufacturing of laser copy machine are expected to increase by adapting developed ultrasonic cleaning system.

• Applied Chemistry for Engineering
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• v.25 no.5
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• pp.548-551
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• 2014

In order to reduce toxicity on the human body, four new cleaning agents (1-4) containing ester and ether functionalities have been invented. The synthesized cleaning agents's physical properties, biodegradabilities, and $LD_{50}$ values, which were conducted by Korea Testing Certification Institute by using standard method, showed excellent values. A specimen for cleaning ability was prepared by cutting in $60{\times}40mm$ size of stainless steel plate. The surface of the above specimens was treated with four different kinds of contaminants, such as cutting oil, anti-rust oil, drawing oil, and lubricating oil. Contaminated specimens were then immersed in compounds (1-4) for 1 to 5 minutes to dissolve oil in the cleaning agent. The data indicate that all compounds (1-4) exhibit good cleaning ability toward four contaminant oils. It is also confirmed that these compounds can be applicable to various industrial cleaning fields as nontoxic and biodegradable cleaning agents because of their excellent biodegradabilities and $LD_{50}$ values.

• Clean Technology
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• v.19 no.3
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• pp.219-225
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• 2013

Environment-friendly and surfactant-free aqueous cleaning agents have been developed in order to solve various problems generated by surfactants in the aqueous cleaning agents. Aqueous surfactant-free cleaning agents, S-1 and S-2 have been formulated with water-soluble solvents such as propylene glycol and propylene glycol ether on their main components and with some additives. These solvents were chosen because of their good solubility in water and excellent solubility of fluxes which are major contaminants of printed circuit board in the electronic industry. Physical properties of the formulated and the imported cleaning agents were measured to predict their cleaning performance, and their cleaning abilities of flux and solder contaminants were evaluated under the various ultrasonic frequencies by a gravimetric method. The measurement results show that the physical properties of cleaning agent V are generally similar with those of formulated cleaning agents S-1 and S-2. Both the cleaning agent V and the formulated cleaning agents S-1 and S-2 showed similar trends that their pH decrease in the beginning and then increases later on with the increase of their dilution in water. It is considered that the wetting indices of the cleaning agents calculated with experimental values do not not have any influence on their cleaning ability. In ultrasonic cleaning tests under three ultrasonic frequencies of 28, 45, and 100 kHz, their best performances of cleaning solder and flux were obtained at 45 kHz and 28 kHz, respectively, and the cleaning performance of the formulated cleaning agents S-1 and S-2 was better than that of the cleaning agent V. However, in the case of the recommended diluted concentration of 25 wt% cleaning solution, the cleaning performance of the cleaner V for solder and flux was better in the initial stage of cleaning compared to the formulated cleaners. And it may be concluded that the formulated cleaning agents S-1 and S-2 can be applied to cleaning of solder and flux in the industry, based on the experimental results in this study.

• Clean Technology
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• v.16 no.2
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• pp.103-116
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• 2010

It has been reported that the LCD panel market in the FPD industry is become growing and its panel size and production capacity are increasing, and its manufacturing technique is improved every year. FPD manufacturing process requires high cleanliness in its overall process. Especially, FPD cleaning process which accounts for 30~40% of total manufacturing process is very important in its technological and productivity aspects. It is difficult to remove residual liquid-crystal in the fine gap after liquid-crystal injection process in the cell. In this study, aqueous cleaning agents with excellent cleaning, rinsing, and penetrating abilities, but minimum ion content for LCD panel were formulated through mixing glycol ether-type and glycol dimethyl ether-type solvents and nonionic surfactants which are widely used as raw materials for alternative cleaning agents because of environmental regulation at home and abroad. And the formulated cleaning agents were applied to clean FPD liquid crystal after its injection in the cell. Physical properties, cleaning efficiencies, and rinsabilities of the formulated cleaning agents with different combination ratios of solvents, surfactants and additives were measured. As experimental results, the formulated cleaning agents showed higher wetting indices and cloud point than the traditional commercial cleaning agent. And it was found that cleaning efficiencies of the formulated cleaning agents were influenced by the structure of main solvents in them and the types of liquid crystal as soil for cleaning. The best cleaning agents among the formulated cleaning agents showed similar cleaning efficiencies and better rinsabilities compared to the conventional cleaning agent.

• Clean Technology
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• v.19 no.2
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• pp.184-188
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• 2013

To increase flash point which is related to flammability, seven unprecedented new cleaning agents containing fluoride atoms have been invented. These newly synthesized cleaning agents's physical properties which were conducted by Korea Institute of Petroleum Management by using a standard method showed excellent values. Particularly, flash point of newly synthetic cleaning agents is more higher than that of fluoride free compound. A specimen for cleaning ability was prepared by cutting in $60mm{\times}40mm$ size of stainless steel plate. The surface of the above specimens was applied with four kinds of contaminants, such as paraffin based drawing oil, flux abietic acid, water-insoluble cutting oil, and lubricating oil. Contaminated specimens were immersed in new compounds (1-7) for 1 to 5 minutes to dissolve oil in the cleaning agent. Although the data indicate that all compounds (1-7) exhibit lower cleaning ability toward cutting oil, it is observed that in the case of the present study more than 80% of pollutants on the surface were almost removed within 5 minutes.

• Journal of the Korean Applied Science and Technology
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• v.22 no.1
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• pp.15-20
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• 2005

$Na_2CO_3$. Sodium orthosilicate (Na-OSi), Tetronix T-701 (T-701), Na-dioctyl sulfosuccinate (303C), Newpol PE-68 (PE-68), MJU-100A, and tetrasodium pyrophosphate were blended to prepare high performance alkaline cleaning agents (ACASs). The results of cleaning test with steel specimen showed that ACAS-6 ($Na_2CO_3$ 50g/Na-OSi 35g/T-701 20g/303C 18g/PE-68 17g/MJU-100A 10g/TSPP 20g/ water 180g mixture) had a good cleaning power. The cleaning power for press-rust preventing oil was 98% and 99% degreasing at 4wt%, $70^{\circ}C$ and $90^{\circ}C$, respectively ; for quenching oil, the cleaning power of ACAS-6 was 91% degreasing at 4wt% and $70^{\circ}C$. The foam heights measured immediately after foaming by Ross & Miles method and Ross & Clark method at 6wt%, $60^{\circ}C$ were 18mm and 65mm, respectively. It was concluded that ACAS-6 had a good low foaming cleaning agent.

• Korean Journal of Materials Research
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• v.22 no.9
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• pp.459-464
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• 2012

We investigated cleaning effects using $NH_4OH$ solution on the surface of Cu film. A 20 nm Cu film was deposited on Ti / p-Si (100) by sputter deposition and was exposed to air for growth of the native Cu oxide. In order to remove the Cu native oxide, an $NH_4OH$ cleaning process with and without TS-40A pre-treatment was carried out. After the $NH_4OH$ cleaning without TS-40A pretreatment, the sheet resistance Rs of the Cu film and the surface morphology changed slightly(${\Delta}Rs:{\sim}10m{\Omega}/sq.$). On the other hand, after $NH_4OH$ cleaning with TS-40A pretreatment, the Rs of the Cu film changed abruptly (${\Delta}Rs:till{\sim}700m{\Omega}/sq.$); in addition, cracks showed on the surface of the Cu film. According to XPS results, Si ingredient was detected on the surface of all Cu films pretreated with TS-40A. This Si ingredient(a kind of silicate) may result from the TS-40A solution, because sodium metasilicate is included in TS-40A as an alkaline degreasing agent. Finally, we found that the $NH_4OH$ cleaning process without pretreatment using an alkaline cleanser containing a silicate ingredient is more useful at removing Cu oxides on Cu film. In addition, we found that in the $NH_4OH$ cleaning process, an alkaline cleanser like Metex TS-40A, containing sodium metasilicate, can cause cracks on the surface of Cu film.