• Transactions of the Korean Society of Mechanical Engineers A
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• v.25 no.2
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• pp.275-282
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• 2001

The reactor pressure vessel is usually cladded with stainless steel to prevent corrosion and radiation embrittlement. Number of subclad cracks may be found during an in-service-inspection due to the presence of cladding. It is specified, in ASME Sec. XI, that a subclad crack is characterized as a surface crack when the thickness of the clad is less than 40% of the crack depth. This condition is provided to keep the crack integrity evaluation conservative. In order to refine the fracture assessment procedures for such subclad cracks under a pressurized thermal shock condition, three dimensional finite element analyses are applied for various subclad cracks existing under cladding. A total of 36 crack geometries are analyzed, and the results are compared with those for surface cracks. The resulting stress intensity factors for subclad cracks are 6 to 44% less than those for surface cracks. It is proven that the flaw characterization condition as specified in ASME Sec. XI can be overly conservative for some subclad cracks.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.2
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• pp.34-39
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• 2010

In order to achieve and maintain dimensional accuracy in laser micro-machining, dominant parameters such as laser power and laser focus position need to be monitored and controlled real time. Also, in order to selectively machine multi-layered materials, the material being presently machined need to be recognized. This paper presents an auto-focusing (AF) module to keep laser focus on a large-area surface; a real-time laser power stabilizing module based on optical attenuation; and a laser-induced breakdown spectroscopy (LIBS) module. With these monitoring modules, position error in laser focus on a 4" silicon wafer was kept below $4{\mu}m$, initially $51{\mu}m$, and laser power stability of a UV laser source was improved from 1.6% to 0.3%. Also, the material transition from polyimide to copper in machining of FCCL (flexible copper clad laminate) was successfully observed.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2005.10a
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• pp.373-376
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• 2005

In recent years, there has been a growing need fur productivity improvement of ACS wire (Aluminum clad Steel wire) In optical communication market. So, it is necessary to improve the production speed and following quality of ACS wire to reduce the unit cost of the products. In this study, the pre-heating temperature and cladding speed is chosen as the factors can influence the mechanical and metallurgical properties during cladding, and the changing behavior of mechanical property and microstructure by controlling above two factors are investigated. And the bearing length and approach angle in cladding die are selected as the important elements for designing optimum die enabling high speed cladding. So we carried out FE(Finite Element) analysis using the above two elements as variables. This paper aims to understand the change of mechanical properties and microstructure according to the change of each factor during cladding and suggest the optimized cladding condition to get the best quality of OPGW. And also we would like to introduce the optimum die structure that enables high-speed cladding.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.59-63
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• 2013

A bendable electronic module has been developed for a mobile application by using a low-cost roll-to-roll manufacturing process. In flexible embedded electronic module, a thin silicon chip was embedded in a polymer-based encapsulating adhesive between flexible copper clad polyimide layers. To confirm reliability and durability of prototype bendable module, the following tests were conducted: Moisture sensitivity level, thermal shock test, high temperature & high humidity storage test, and pressure cooker tester. Those experiments to induce failure of the module due to temperature variations and moisture are the experiment to verify the reliability. Failure criterion was 20% increase in bump resistance from the initial value. The mechanism of the increase of the bump resistance was analyzed by using non-destructive X-ray analysis and scanning acoustic microscopy. During the pressure cooker test (PCT), delamination occurred at the various interfaces of the bendable embedded modules. To investigate the failure mechanism, moisture diffusion analysis was conducted to the pressure cooker's test. The hygroscopic characteristics of the encapsulating polymeric materials were experimentally determined. Analysis results have shown moisture saturation process of flexible module under high temperature/high humidity and high atmosphere conditions. Based on these results, stress factor and failure mechanism/mode of bendable embedded electronic module were obtained.

• Korean Journal of Materials Research
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• v.14 no.12
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• pp.851-856
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• 2004

The aim of this study is to investigate the optimum drawing parameter for BAS121 welded tubes. The BAS121 aluminium alloy tubes with 25 mm in external diameter and 1.3 mm in thickness for heat-exchangers were manufactured by high frequency induction welding with the V shaped convergence angle $6.5^{\circ}$ and power input 55 kW. With increasing the reduction of area ($13,\;21\%$) by drawing, tensile strength was increased and elongation was decreased. With increasing the reduction of area by drawing, hardness in weld metal increased rapidly, while that of base metal increased slowly. In the specimen with the outer diameter smaller than 22 mm, hardness of weld metal was higher than that of base metal. The optimum drawing parameter of area reduction in BAS121 alloys was estimated about $13\%$ because of the work hardening of welds.

• Transactions of the Society of Information Storage Systems
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• v.1 no.2
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• pp.182-187
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• 2005

A large area micro mirror is an optical element that functions as changing an optical path by reflection in integrated optical system. We fabricated the large area silicon mirror by anisotropic etching using MEMS for implementation of integrated optical pickup. In this work, we report the optimum conditions to better fabricate and design, greatly improve mirror surface quality. To obtain mirror surface of $45^{\circ},\;9.74^{\circ}$ off-axis silicon wafer from (100) plane was used in etching condition of $80^{\circ}C$ with 40wt.% KOH solution. After wet etching, polishing process by MR fluid was applied to mirror surface for reduction of roughness. In the next step, after polymer coating on the polished Si wafer, the Si mirror was fabricated by UV curing using a trapezoid bar-type way structure. Finally, we obtained peak to valley roughness about 50 nm in large area of $mm^2$ and it is applicable to optical pickup using blu-ray wavelength as well as infrared wavelength.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2015.11a
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• pp.33-42
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• 2015

오늘날 연성회로기판(FCCL : Flexible Copper Clad Laminate)은 디스플레이, 스마트폰, 자동차, 항공, 의료 기기, 산업용 컨트롤 기기 등 거의 모든 고급 전자 제품들에 사용되고 있다. 특히 디스플레이 분야에서는 뛰어난 연성과 내구성을 바탕으로 경박단소화에 유리할 뿐만 아니라 구동부에 적용이 가능한 장점 등으로 그 적용처가 점점 늘어나고 있는 추세이다. 이 가운데서도 LCD와 OLED의 구동소자(Display Driver IC)를 장착하는 COF(Chip on Film)는 대표적인 연성회로기판(FCCL) 적용 부품으로서, 최근 인기를 끌고 있는 디스플레이의 제로-베젤(Zero-bezel)을 가능케 하는 핵심 부품이다. COF용 연성회로기판(FCCL) 소재로는 우수한 평탄도, 파인피치(Fine-pitch)구현성, 내굴곡성, 광투과성 등을 보유하고 있는 Sputtering Type FCCL이 사용되고 있다. 특히 최근 Display 분야의 화두가 되고 있는 POLED(Plastic-OLED) 패널을 장착한 Flexible Mobile 디스플레이의 경우, 기존의 COG(Chip on Glass) 접합방식이 아닌 COF 접합방식을 채택하고 있으며, 기존의 단면 COF보다 3배의 고해상도 구현이 가능한 양면 COF를 채택하기에 이르렀다. 기존의 COF 제작공정과 달리 Semi Additive 공정으로 제작되는 양면 COF 시장의 태동으로 양면 연성회로기판(FCCL)의 수요 증가가 예상되는 등 최근 디스플레이 기술 발전은 소재 분야에도 큰 변화를 잉태하고 있다. 이러한 최근 디스플레이 업계의 고해상도, 고속 신호 전송, 슬림화, Flexible 추세에 대응 가능한 최적의 특성을 보유하고 있는 Sputtering Type FCCL을 중심으로 디스플레이의 발전에 대응하는 소재의 기술 개발 동향을 살펴보고자 한다.

• Proceedings of the KIEE Conference
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• 1999.07e
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• pp.2274-2276
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• 1999

In this work, temperature rise and eddy current distribution on the enclosure and conductor of 3 pole gas insulated switchgear were investigated using analytical and experimental measures. The design of the diameters of the conductors and the enclosures of a meal clad gas insulated switchgear is primarily based on the insulation requirements. It is very difficult problem to predict the temperature rise of enclosed switchgear due to the complexity of the phenomena of heat transfer and existence of eddy current loss. To overcome this situations, we focused on the eddy current distribution on the enclosure of switchgear caused by high current 3 pole conductor as a fundamental basis. The experimental results about temperature distribution of 3 pole gas insulated switchgear were reported and measurements are compared with predictions of three-dimensional thermal model for eddy current analysis. As a result, three dimensional numerical analysis found to be in close relationship with experimental results and thermal model is efficient to predict the abnormal temperature rise in switchgear.

• Nuclear Engineering and Technology
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• v.31 no.1
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• pp.17-28
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• 1999

A thermal-hydraulic analysis is conducted on the loss-of-coolant-accident (LOCA) during shutdown operation of YGN Units 3/4. Based on the review of plant-specific characteristics of YGN Units 3/4 in design and operation, a set of analysis cases is determined, and predicted by the RELAP5/MOD3.2 code during LOCA in the hot-standby mode. The evaluated thermal-hydraulic phenomena are blowdown, break flow, inventory distribution, natural circulation, and core thermal response. The difference in thermal-hydraulic behavior of LOCA at shutolown condition from that of LOCA at full power is identified as depressurization rate, the delay in peak natural circulation timing and the loop seal clearing (LSC) timing. In addition, the effect of high pressure safety injection (HPSI) on plant response is also evaluated. The break spectrum analysis shows that the critical break size can be between 1% to 2% of cold leg area, and that the available operator action time for the Sl actuation and the margin in the peak clad temperature (PCT) could be reduced when considering uncertainties of the present RELAP5 calculation.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.41 no.10
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• pp.51-56
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• 2004

We propose and fabricate an 1${\times}$2 asymmetric optical switch by TOE using SOI wafer based on silicon which has very large TOE figure and it is a good material for optical devices. SOI wafer consists of 3 layers; upper Si layer for device(waveguide;core, n=3.5), buried oxide layer for insulator(clad, n=1.5) and Si substrate layer. We designed 1${\times}$2 asymmetric y-branched single mode optical waveguide switch by BPM simulation and metal heater by heat transfer simulation. Fabricated switch shows about 3.5 watts of power consumption and over 20dB of crosstalk between output channels.