• Title/Summary/Keyword: Circuit integration

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Erlang Capacity Calculation for the Mixed Traffic of 3G1x CDMA Wireless Networks Integration for Voice over Internet Protocol (음성 및 데이터를 포함하는 이동통신 혼합 트래픽의 Erlang 용량 산출방법)

  • Chung, H.K.
    • Electronics and Telecommunications Trends
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    • v.17 no.5 s.77
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    • pp.37-46
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    • 2002
  • 이동통신에서는 무선자원의 효율적인 사용을 위하여 variable rate vocoder 및 VoX 기법을 이용한 음성 전송이 일반적 추세이며, 버스티 특성을 갖는 패킷 트래픽의 경우 statistical multiplexing을 이용하여 무선 채널의 사용을 극대화 시킨다. 트래픽 밀도를 나타내는 Erlang 용량은 일정속도의 회선교환 트래픽에 대하여 동시에 점유할 수 있는 dedicated circuit의 수에 기초하는 개념이므로 statistical multiplexing으로 처리되는 데이터 패킷의 트래픽 밀도는 queuing model에 근거한 데이터 스루풋이 현실적이다. 그러나 이동통신 시스템에서 트래픽 특성을 달리하는 circuit 및 패킷 타입의 혼합 서비스가 동시에 제공될 경우 네트워크 planning을 위한 구성 시스템의 용량산정을 위해 트래픽 밀도의 통합적인 표현을 요구한다. 따라서 Erlang 용량과 데이터 스루풋의 상호 변환을 통하여 네트워크 구성요소의 용량 산정에 적당한 용량표현을 선택할 수 있다. 본 고에서는 트래픽 처리기로서의 통신시스템을 기술하기 위하여 일반적인 텔레트래픽 시스템 모델과 파라미터를 정의한다. 또한 음성 및 비음성 서비스의 혼합 트래픽 환경에서 트래픽 밀도계산을 위한 Erlang 용량과 데이터 스루풋의 상호 변환 관계를 소개한다. 마지막으로 3G1x 무선접속환경에서 음성 및 HSPD 서비스가 공존할 경우 기지국 CE dimensioning에 필요한 혼합 트래픽 Erlang 용량 산출 방법을 기술한다.

3-D Solder Paste Inspection Based on B-spline Surface Approximation (B-spline 표면 근사화 기반의 3차원 솔더 페이스트 검사)

  • Lee, Joon-Jae;Lee, Byoung-Gook;Yoo, Jae-Chil
    • Journal of the Korean Society for Industrial and Applied Mathematics
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    • v.10 no.1
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    • pp.31-45
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    • 2006
  • Recently advanced device and sophisticated manufacture process by high-density, high-integration require critical inspection criteria in SMT(surface mounting technologies). Especially for solder paste which come out over 60% of inferior goods of all product, 3-dimensional inspection replaces 2-D inspection as a effectiveness substitute of this trend. Therefore this paper proposes a fast 3-D inspection system and measurement algorithm automatically inspecting 3-D solder paste of PCB in SMT assembly line. The proposed method generates 3-D surface of data using B-spline algorithm and then extracts to inspect the pad.

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Understanding of Neural Mechanism of Mood Disorders : Focused on Neuroimaging Findings (기분장애 뇌신경기저에 대한 이해 : 뇌영상 연구를 중심으로)

  • Kim, Yoo-Ra;Lee, Kyoung-Uk
    • Korean Journal of Biological Psychiatry
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    • v.18 no.1
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    • pp.15-24
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    • 2011
  • Mood disorder is unlikely to be a disease of a single brain region or a neurotransmitter system. Rather, it is now generally viewed as a multidimensional disorder that affects many neural pathways. Growing neuroimaging evidence suggests the anterior cingulate-pallidostriatal-thalamic-amygdala circuit as a putative cortico-limbic mood regulating circuit that may be dysfunctional in mood disorders. Brain-imaging techniques have shown increased activation of mood-generating limbic areas and decreased activation of cortical areas in major depressive disorder(MDD). Furthermore, the combination of functional abnormalities in limbic subcortical neural regions implicated in emotion processing together with functional abnormalities of prefrontal cortical neural regions probably result in the emotional lability and impaired ability to regulate emotion in bipolar disorder. Here we review the biological correlates of MDD and bipolar disorder as evidenced by neuroimaging paradigms, and interpret these data from the perspective of endophenotype. Despite possible limitations, we believe that the integration of neuroimaging research findings will significantly advance our understanding of affective neuroscience and provide novel insights into mood disorders.

Thermo-piezoelectric $Si_3N_4$ cantilever array on n CMOS circuit for probe-based data storage using wafer-level transfer method (웨이퍼 본딩을 이용한 탐침형 정보 저장장치용 열-압전 켄틸레버 어레이)

  • Kim Young-Sik;Nam Hyo-Jin;Lee Caroline Sunyoung;Jin Won-Hyeog;Jang Seong.Soo;Cho Il-Joo;Bu Jong Uk
    • 정보저장시스템학회:학술대회논문집
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    • 2005.10a
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    • pp.22-25
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    • 2005
  • In this research, a wafar-level transfer method of cantilever array on a conventional CMOS circuit has been developed for high density probe-based data storage. The transferred cantilevers were silicon nitride ($Si_3N_4$) cantilevers integrated with poly silicon heaters and piezoelectric sensors, called thermo-piezoelectric $Si_3N_4$ cantilevers. In this process, we did not use a SOI wafer but a conventional p-type wafer for the fabrication of the thermo-piezoelectric $Si_3N_4$ cantilever arrays. Furthermore, we have developed a very simple transfer process, requiring only one step of cantilever transfer process for the integration of the CMOS wafer and cantilevers. Using this process, we have fabricated a single thermo-piezoelectric $Si_3N_4$ cantilever, and recorded 65nm data bits on a PMMA film and confirmed a charge signal at 5nm of cantilever deflection. And we have successfully applied this method to transfer 34 by 34 thermo-piezoelectric $Si_3N_4$ cantilever arrays on a CMOS wafer. We obtained reading signals from one of the cantilevers.

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Implementation of Excitatory CMOS Neuron Oscillator for Robot Motion Control Unit

  • Lu, Jing;Yang, Jing;Kim, Yong-Bin;Ayers, Joseph;Kim, Kyung Ki
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.14 no.4
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    • pp.383-390
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    • 2014
  • This paper presents an excitatory CMOS neuron oscillator circuit design, which can synchronize two neuron-bursting patterns. The excitatory CMOS neuron oscillator is composed of CMOS neurons and CMOS excitatory synapses. And the neurons and synapses are connected into a close loop. The CMOS neuron is based on the Hindmarsh-Rose (HR) neuron model and excitatory synapse is based on the chemical synapse model. In order to fabricate using a 0.18 um CMOS standard process technology with 1.8V compatible transistors, both time and amplitude scaling of HR neuron model is adopted. This full-chip integration minimizes the power consumption and circuit size, which is ideal for motion control unit of the proposed bio-mimetic micro-robot. The experimental results demonstrate that the proposed excitatory CMOS neuron oscillator performs the expected waveforms with scaled time and amplitude. The active silicon area of the fabricated chip is $1.1mm^2$ including I/O pads.

Improved Bridgeless Interleaved Boost PFC Rectifier with Optimized Magnetic Utilization and Reduced Sensing Noise

  • Cao, Guoen;Kim, Hee-Jun
    • Journal of Power Electronics
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    • v.14 no.5
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    • pp.815-826
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    • 2014
  • An improved bridgeless interleaved boost power factor correction (PFC) rectifier to improve power efficiency and component utilization is proposed in this study. With combined conventional bridgeless PFC circuit and interleaved technology, the proposed rectifier consists of two interleaved and magnetic inter-coupling boost bridgeless converter cells. Each cell operates alternatively in the critical conduction mode, which can achieve the soft-switching characteristics of the switches and increase power capacity. Auxiliary blocking diodes are employed to eliminate undesired circulating loops and reduce current-sensing noise, which are among the serious drawbacks of a dual-boost PFC rectifier. Magnetic component utilization is improved by symmetrically coupling two inductors on a unique core, which can achieve independence from each other based on the auxiliary diodes. Through the interleaved approach, each switch can operate in the whole line cycle. A simple control scheme is employed in the circuit by using a conventional interleaved controller. The operation principle and theoretical analysis of the converter are presented. A 600 W experimental prototype is built to verify the theoretical analysis and feasibility of the proposed rectifier. System efficiency reaches 97.3% with low total harmonic distortion at full load.

Effects of PCB Patterns on EMI Measurement in TEM Cell and Proposal of PCB Design Guidelines (TEM 셀에서 PCB 패턴이 EMI 측정에 미치는 영향 및 PCB 설계 가이드라인 제시)

  • Choi, Minkyoung;Shin, Youngsan;Lee, Seongsoo
    • Journal of IKEEE
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    • v.21 no.3
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    • pp.272-275
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    • 2017
  • Recently, semiconductor integration density enormously increases and its interconnection width is significantly narrowed, which leads to EMI (electromagnetic interference) problems on chip level. Chip manufacturer exploits TEM cell (transverse electromagnetic cell) to measure EMI on chip level, which requires PCB (printed circuit board) for measurement purpose. However, it is often neglected to consider that PCB patterns and other factors can affect on EMI measurement. In this paper, several test patterns are designed for different PCB design variables, and effects of PCB patterns on EMI measurement in TEM cell are analyzed. Based on these analyses, PCB design guidelines are also proposed to minimize the effects on EMI measurements.

A Development of Visualization Software for Protective Engineering in Low-Voltage Power Systems (저압계통 보호 엔지니어링을 위한 시각화 소프트웨어 개발)

  • Yun, Sang-Yun;Lee, Nam-Ho;Lee, Wook-Hwa;Lee, Jin;Kim, Jae-Chul
    • The Transactions of the Korean Institute of Electrical Engineers A
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    • v.55 no.7
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    • pp.297-305
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    • 2006
  • This paper summarizes a development of visualization software for protective engineering in low-voltage power systems. The study is concentrated on the following aspects. First, a software engineering method is applied for designing the object-oriented program. The design and implementation of a Graphic User Interface(GUI) and its integration to a power system framework are developed using object-oriented programming(OOP) in Visual C++. Second, we develop the short circuit analysis module that oriented a low-voltage power system. It is possible to calculate a peak, symmetrical RMS, DC component and asymmetrical fault currents for each time. And it is the first software that can calculate the fault current for single branch of three-phase system. The calculation accuracy is compared with commercial software, and the libraries of low-voltage components are served for convenience use. Third, protective engineering functions are equipped. It is possible to automatically select the circuit breaker which based on the user input characteristics and the fault current calculation and examine the protective coordination. Through the case study, we verified that the developed software can be effectively used to examine the protective engineering in low-voltage power systems.

A Three-layered Optical Waveguide of Second-order Orbital Angular Momentum Mode Guiding for Photonic Integrated Circuit (3층 구조를 가지는 광 집적회로용 2차 궤도 각운동량 광 도파로)

  • Lee, In-Joon;Kim, Sang-In
    • The Journal of the Korea institute of electronic communication sciences
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    • v.14 no.4
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    • pp.645-650
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    • 2019
  • In this paper, a specifically designed waveguide structure that can carry first, and second-order orbital angular momentum(: OAM) mode is proposed. The proposed optical waveguide consists of three Si stripes embedded in $SiO_2$, which is suitable for implementing on-chip integration and fabrication by standard thin film deposition and etching processes. The second-order OAM mode was generated by combining two eigenmodes, which are calculated by finite difference method(: FDM). The topological charge number of the first, and second-order OAM mode was calculated as l=0.9642 and 1.8766 respectively, which is close to the theoretical value.

Review of Testing Configurations for Simultaneous Measurement of Friction and Triboelectrification

  • P. R. Deshmukh;Dae-Hyun Cho
    • Tribology and Lubricants
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    • v.40 no.4
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    • pp.118-132
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    • 2024
  • The triboelectric nanogenerator (TENG) has emerged as a groundbreaking technology for harvesting clean and sustainable energy cost effectively. For reliable TENG design, minimizing wear damage at the friction layers is crucial. This review provides a comprehensive overview of tribometer-integrated TENG testing configurations used in the simultaneous investigation of both tribological and electrical performance. It considers configurations such as plate-on-plate, ball-on-disc, and ball-on-flat tribometers designed for linear reciprocating or rotating sliding friction tests. These tribometers are either specifically designed or adapted for TENG testing. Triboelectric material holders facilitate friction tests by establishing electrical connections from the triboelectric materials or electrodes, thereby enabling accurate measurement of electrical signals. Electrometers and oscilloscopes record electrical outputs such as short-circuit current and open-circuit voltage. This integration enables the simultaneous measurement of both friction and electrical outputs, providing a thorough understanding of TENG performance. The review also summarizes how factors such as normal force, sliding frequency, and rotating speed affect friction coefficients and TENG performance. It also examines the relationship between the coefficient of friction and tribocharges under various loads and frequencies. The review emphasizes the importance of these testing configurations for evaluating both friction and electrical performance, which are crucial for optimizing TENG efficiency. Finally, the review explores future prospects for developing innovative tribometer designs suited for both tribology and TENG testing.