• 반도체디스플레이기술학회지
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• 제10권4호
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• pp.21-23
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• 2011

Uniformity of plasma etching processes critically depends on the wafer temperature and its distribution. The wafer temperature is affected by plasma, chucking force, He back side pressure and the surface temperature of ESC(electrostatic chuck). In this work, 3D mathematical modeling is used to investigate the influence of the geometry of coolant path and the temperature distribution of the ESC surface. The model that has the coolant path with less change of the cross-sectional area and the curvature shows low standard deviation of the ESC surface temperature distribution than the model with the coolant path of the larger surface area and more geometric change.

• 반도체디스플레이기술학회지
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• 제11권2호
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• pp.71-74
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• 2012

Uniformity of the wafer temperature is one of the important factors in etching process. Plasma, chucking force, backside helium pressure and the surface temperature of ESC(electrostatic chuck) affect the wafer temperature. ESC consists of several layers of structure. Each layer has own thermal resistance and the Si-adhesive layer has highest thermal resistance among them. In this work, the temperature distribution of ESC was analyzed by 3-D FEM with various defects and the thickness deviation of the Si-adhesive layer. The result with Si-adhesive layer with the low center thickness deviation shows modified temperature distribution of ESC surface.

• Advances in robotics research
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• 제1권1호
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• pp.1-19
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• 2014

Microgripper is an essential device in the micro-operation system. It can convert other types of energy into mechanical energy and produce clamp movement with required chucking force, which enables it a broad application prospect in the domain of tiny components' processing and assembly, biomedicine and optics, etc. The performance of a microgripper is dependent on its power supply, type of drive, mechanism structure, sensing components, and controller. This paper presents a state-of-the-art survey of recent development on flexure-based microgrippers. According to the drive type, the existing microgrippers can be mainly classified as electrostatic microgripper, electrothermal microgripper, electromagnetic microgripper, piezoelectric microgripper, and shape memory alloy microgripper. Additionally, some different mechanisms, sensors, and control methods that are used in microgripper system are reviewed. The key issue of how to choose those components in microgripper system design is also addressed.