• 전기학회논문지
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• 제57권12호
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• pp.2228-2233
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• 2008

This research paper aims to establish a test process of the AFE SiP chip. It measured the sensitivity, current consumption and power consumption both on the evaluation socket board and Catalyst load board. As a result, the sensitivity became deteriorated with an average of 0.2[dBm] at the channel 62 only, the current consumption increased to an average of 0.57[mA] and the power consumption increased to an average of 1.76[mW], But all characteristics incomes the tolerance of the measurement, it also keeps almost the same level. Therefore this design of the test process improved a valid design.

• 한국군사과학기술학회지
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• 제5권2호
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• pp.195-206
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• 2002

The conjugate heat transfer from the simulated module in a horizontal channel with the variation of inlet air temperature is experimentally investigated. The aim of this study is to estimate temperature difference between a module and inlet air. This study is performed with the variation of parameters that are inlet air temperature(Ti=25~$55^{\circ}C), thermal resistance( $R_c$=0.05, 4.11, 158 K/W), inlet air velocity(Vi=0.1~1.5m/s), and input power(Q=3, 7 W). The results show that the effect of inlet air temperature is little, at the case of using conductive board. And input power was most effective parameter on the temperature difference between module and Inlet air.

• 조명전기설비학회논문지
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• 제25권2호
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• pp.80-86
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• 2011

This paper presents an integrated variable amplitude high voltage pulse generation circuit with low power and small size for driving industrial piezoelectric printer heads. To solve the problems of large size and power overhead of conventional pulse generators that usually assembled with multiple high-cost discrete ICs on a PCB board, we have designed a new integrated circuit (IC) chip. Since all the functions are integrated on to a single-chip it can achieve low cost and control the high-voltage output pulse with variable amplitudes as well. It can also digitally control the rising and falling times of an output high voltage pulse by using programmable RC time control of the output buffer. The proposed circuit has been designed and simulatedd in a 180[nm] Bipolar-CMOS-DMOS (BCD) technology using HSPICE and Cadence Virtuoso Tools. The proposed single-chip pulse generation circuit is suitable for use in industrial printer heads requiring a variable high voltage driving capability.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1993년도 한국자동제어학술회의논문집(국내학술편); Seoul National University, Seoul; 20-22 Oct. 1993
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• pp.185-188
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• 1993

The goal of this paper is to develop an on-board controller for a model helicopter's hovering attitude control, using i8096 one-chip microcontroller. Required controller algorithm is programmed in ASM-96 assembly language and downloaded into an i8096 microcontroller. The performance of hovering flight using this system is verified by experiments with the model helicopter mounted on an instrumented flight stand where 3 potentiometers and an optical proximity sensor measure te attitude and main rotor speed of the helicopter.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 1991년도 한국자동제어학술회의논문집(국내학술편); KOEX, Seoul; 22-24 Oct. 1991
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• pp.24-29
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• 1991

RCCL(Robot Control C Library) is general purpose robot control language. It is programmed with C language and composed of C library. So it is well portable and supports sensor integration control and high level force control algorithms. We implemented RCCL on PUMA. We developed servo controller of DDC(Direct Digital Control). We used intel 8097BH one chip micro controller as CPU. One digital servo board controls three motors. Host computer is IBM PC 386DX-33 with RCCL.

• Journal of the Korean Wood Science and Technology
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• 제16권1호
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• pp.21-44
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• 1988

팔만칩 및 톱밥을 보오드에 활용(活用)하기 위한 방안(方案)의 하나로, 이들의 취약한 처리(物理) 및 기계적(機械的) 성질(性質)을 개선(改善)시키기 위하여 비목질재료(非木質材料)인 폴리프로필렌망(網)을 결체(結締)하여 보오드를 제조(製造)하였다. 보오드의 제조조건(製造條件)은 비중(比重)을 0.40, 0.55, 0.70 및 0.85의 4수준으로 하고 수지첨가율(樹脂添加率)을 8%, 10%, 12% 및 14%의 4수준으로 하였으며, 망수(網數)는 1장에서 4장으로 하여 보오드를 각각 제조(製造)하였다. 이들 보오드의 물리(物理) 및 기계적(機械的) 성질(性質)은 두께팽창율(膨脹率), 휨파괴계수(破壞係數), 휨탄성계수(彈性係數), 인장강도(引張强度), 박리저항(剝離抵抗) 및 나사못보지력(保持力) 등을 측정조사(測定調査)하고 고찰(考察)하였는데 본연구(本硏究)에서 얻은 중요한 결론(結論)은 다음과 같다. 1) 지수첨가율(指數添加率)이 증가함에 따라 두께팽창율(膨脹率)은 감소(減少)하였고, press-lam 보오드는 일반성형(一般成形)보오드 보다 낮은 값을 보여 주었다. 2) 보오드의 휨파괴계수(破壞係數) 및 탄성계수(彈性系數)는 비중(比重)이 증가하였으며 press-lam 보오 드는 일반적형(一般的形)보오드보다 높은 값을 나타내었다. 망수(網數)가 증가함에 따라 휨파괴계수(破壞係數)는 증가하였고, 수지첨가율(樹脂添加率)이 증가함에 따라서도 같은 양상이 나타났으나 휨탄성계수(彈性係數)의 경우 망수(網數)에 따른 효과(效果)는 나타나지 아니하였다. 3) 비중(比重)이 증가함에 따라 보오드의 인장강도(引張强度)는 증가하였으며, 망구성(網構成)보오드는 대조보오드보다 높은 값을 나타내었다. 또 망수(網數)가 증가함에 따라서도 인장강도(引張强度)는 증가하였으며, press-lam 보오드는 일반적형(一般的形)보오드보다 높은 인장강도치(引張强度値)를 보여 주었다. 4) 보오드의 박리저항(剝離抵抗)은 비중(比重)이 증가함에 따라 증가하였으며 망(網)을 결체(結締)한 보오드는 대조보오드 보다 모두 낮은 값을 보여 주었다. 기수매구성(奇數枚構成)보오드는 우수매구성(偶數枚構成)보오드보다 낮은 박리저항치(剝離抵抗値)를 보였다. 5) 수지첨가율(樹脂添加率) 및 비중(比重)이 증가함에 따라 나사못 보지력(保持力)은 증가하였으나, 망구성(網構成)보오드와 대조보오드사이에서의 차이는 크지 아니하였다. presslam 보오드에서 팔만칩보오드의 경우 고비중(高比重)보오드가, 톱밥보오드의 경우 저비중(低比重)보오드가 각각 대조보오드보다 높은 값을 보여 주었다.

• 한국안전학회지
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• 제13권2호
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• pp.22-29
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• 1998

The natural convection cooling of simulated electronic chips located on a printed circuit board(PCB) has been studied by Computer Aided Engineering(CAE). In CAE, 3-dimensional finite element model of simulated electronic chip was made to accomplish heat transfer analysis at each design stage of a printed circuit boards for thermal optimization. The simulated electronic chips are installed protrudent from the plate about 3mm. The materials the plates are epoxy and aluminum. The results show that the chip with relatively high heat generation rates should not be close to each other. It is found, as well that cooling effect for the aluminum plate is superior to the epoxy plate and location of maximum temperature is significantly influenced by the structure variation of PCB. In developing PCB and electronic chips, it's recommended that CAE is very useful to estimate to the distribution of temperature.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 D
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• pp.2051-2052
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• 2006

본 연구는 HHP,PDA,PMP,CNS 등등에 사용되는 중소형 A-Si:H TFT LCD 에서의 Automatic Gamma Correction 적용으로 화질 최적화 구현에 좀 더 쉽고 빠르게 접근하게 되었다. Analog Gamma String 대신 1chip Drive IC에 집적된 Gamma resister Ladder를 A-Si:H TFT-LCD Panel 특성에 보다 정확하게 적용시키기 위해 새로운 알고리즘을 개발 했으며 이를 적용시킨 회로를 Test Board로 실제 구현해서 최종결과를 도출하였다. Kick-Rack 전압을 고려한 Asymmetry-Gamma Correction 구현까지 Automatic으로 1chip Drive IC의 Register를 산출 할 수 있도록 알고리즘을 구성했다.

• Journal of information and communication convergence engineering
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• 제8권5호
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• pp.534-538
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• 2010

Efficient control of a marine engine requires an engine control unit (ECU) system that handles fast and precise signal processes for in-coming and out-going signals from fast running engines. In order to handle these roles, the sequential control has been adapted in the ECU system in small and medium size ship engines, which has caused high production cost and complexity of the system. Hence, this paper is focused on developing an distributed ECU system for high speed and high precision control of a marine engine by efficiently combining a CPLD chip and a microprocessor. By sharing load at the MCU with the designed CPLD chip, we could achieve in driving a marine engine with high speed and precise control so that the ECU board has been simplified and its production cost has been reduced.

• 전자공학회논문지 IE
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• 제45권4호
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• pp.42-46
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• 2008

LED의 생산은 L/F기판 위에 Die본딩과 Wire본딩을 한다. 그리고 LED Chip을 보호하고 휘도를 개선시키기 위하여 epoxy를 dispensing한다. 이 논문에서 실린지 속에 담겨 있는 eopxy의 양을 자동 검출하여, 그 양에 따른 압력과 시간의 data를 자동 보정 제어하고, 일정량의 epoxy가 토출되는 X-Y-Z축의 반복정밀도 보정용 기구물의 설계를 통하여 토출량을 일정하게 제어하고 불량율을 감소시켜 생산성을 높인다.