• Transactions of the Korean Society of Mechanical Engineers A
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• v.20 no.2
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• pp.481-487
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• 1996

A snapping-beam microswitch has been designed, fabricated and tested. From a design analysis, necessary and sufficient conditions for a snap-through switching fouction have been derived for a clamped shallow beam. The necessary condition has resulted in a geometric relation, in which the ratio of beam thickness to initial beam deflection plays a key role in the snapping ability. The sufficient condition for the snapping action has been obtained as a function of the inertia force due to applied acceleration, and the electrostatic force, adjustable by an inter-electrode voltage. For experimental investigations, a set of microbeams of silicon dioxide/$P^+$silicon bimorphs have been fabricated. Geometric size and mechanical behavior of each material film have been measured from on-chip test structures. Estimated and measured characteristics of the fabricated devices are compared.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.1613-1616
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• 2007

A microgripper using thermal actuator and SU-8 polymer was designed and fabricated to manipulate cells and microparts. A chip size of a microgripper was 3 mm ${\times}$ 5 mm. The thermally actuated microgripper consisted of two couples of hot and cold arm actuators. The high thermal expansion coefficient, 52 $ppm/^{\circ}C$, of SU-8 compared to silicon and metals, allows the actuation of the microgripper. Thickness and width of SU-8 as an end-effector were 26 ${\mu}m$ and 80 ${\mu}m$, respectively. Initial gap between left jaw and right jaw was 120 ${\mu}m$. The ANSYS program as FEM tool was introduced to analyze the thermal distribution and displacement induced by thermal actuators. $XeF_2$ gas was used for isotropic silicon dry etching process to release SU-8 end-effector. Mechanical displacements of the fabricated microgripper were measured by optical microscopy in the range of input voltage from 0 V to 2.5 V. The maximum displacement between two jaws of a microgripper Type OG 1_1 was 22.4 ${\mu}m$ at 2.5 V.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.20 no.4
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• pp.382-385
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• 2011

There is an immense need to obtain nanometric surface finish on optical glass owing to the advantage of improved performance of the components. But owing to brittleness and hardness, optical glass is one of the materials that is difficult to ultra-precision turning. According to the hypothesis of ductile mode machining, regardless of their hardness and brittleness, will undergo a transition from brittle to ductile machining region below a critical undeformed chip thickness. Below this threshold, it is suggested that the energy required for plastic formation. Thus, plastic deformation is the predominant mechanism of material removal in machining these materials in this mode. An experimental study is conducted diamond cutting for machining BK7 glass. The investigation presents the feasibility of achieving nanometric surface and the understanding the mechanism of cutting glass, proving the cutting edge radius effect.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.60 no.9
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• pp.1733-1740
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• 2011

In this research, a MEMS vibratory gyroscope with dual-mass system in the sensing mode has been proposed to increase the stability of the device using wide bandwidth. A wide flat region between the two resonance peaks of the dual-mass system removes the need for a frequency matching typically required for single mass vibratory gyroscopes. Bandwidth, mass ratio, spring constant, and frequency response of the dual-mass system have been analyzed with MATLAB and ANSYS simulation. Designed first and second peaks of sensing mode are 5,917 and 8,210Hz, respectively. Driving mode resonance frequency of 7,180Hz was located in the flat region between the two resonance peaks of the sensing mode. The device is fabricated with anodically bonded silicon-on-glass substrate. The chip size is 6mm x 6mm and the thickness of the silicon device layer is $50{\mu}m$. Despite the driving mode resonance frequency decrease of 2.8kHz and frequency shift of 176Hz from the sensing mode due to fabrication imperfections, measured driving frequency was located within the bandwidth of sensing part, which validates the utilized dual-mass concept. Measured bandwidth was 768Hz. Sensitivity calculated with measured displacement of driving and sensing parts was 22.4aF/deg/sec. Measured slope of the sensing point was 0.008dB/Hz.

• Journal of Powder Materials
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• v.16 no.1
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• pp.37-42
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• 2009

In this study, the feasible test for the mechanical property characterization of $BaTiO_3$ ceramics and multi-layer ceramic capacitor(MLCC) was performed with nanoindentation technique. In case of $BaTiO_3$ ceramics, hardness and elastic modulus are dependent on the densification of specimen showing the highest hardness and elastic modulus values of 12.3 GPa and 155 GPa, respectively at $1260^{\circ}C$. In case of MLCC chip, hardness of dielectric layer was lower than that of margin region. The nanoindentation method could be useful tool for the measurement of mechanical property within $BaTiO_3$ dielectric layer of very thin thickness in high capacitance MLCC.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2018.05a
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• pp.57-58
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• 2018

In this paper, we studied a design method for a quasi-Yagi antenna operating over a broad bandwidth covering the UHF RFID(902-928 MHz) and GNSS(1,164-1.605 MHz). The proposed antenna is composed of three elements(dipole, reflector, and director) and fed by a coplanar waveguide. To reduce its size, a balun is integrated inside the antenna, and the ends of both the dipole and reflector are bent. Broadband impedance matching was obtained by placing the director near to the dipole and loading a chip capacitor inside the antenna. The antenna, designed through simulations, was fabricated on an FR4 substrate with 0.8 mm thickness. The experiment results for the antenna characteristics agree very well with the simulation.

• Journal of the Microelectronics and Packaging Society
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• v.20 no.2
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• pp.33-38
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• 2013

In this study, both a finite element analysis and an experimental analysis are executed to investigate the mechanical characteristics of dielectric material effects on warpage. Also, viscoelastic material properties are measured by DMA and are considered in warpage simulation. A finite element analysis is done by using both thermal elastic analysis and a thermo-viscoelastic analysis to predict the nonlinear effects. For experimental study, specimens warpage of non-symmetric structure with body size of $22.5{\times}22.5$ mm, $37.5{\times}37.5$ mm and $42.5{\times}42.5$ mm are measured under the reflow temperature condition. From the analysis results, experimental warpage is not similar to FEA results using thermal elastic analysis but similar to FEA results using thermo-viscoelastic analysis. Also, its effect on substrate warpage is increased as core thickness is decreased and body size is getting larger. These FEA and the experimental results show that the nonlinear characteristics of dielectric material play an important role on substrate warpage. Therefore, it is strongly recommended that non-linear behavior characteristics of a dielectric material should be considered to control warpage of FCBGA substrate under conditions of geometry, structure and manufacturing process and so on.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.22 no.3
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• pp.248-251
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• 2009

We have investigated the effect of the quality of 1.3 um distributed feed back laser diode (DFB-LD) on the design of anti-reflection (AR) coatings. Optimal condition of AR coating to prevent internal feedback from both facets and reduce the reflection-induced intensity noise of laser diode was simulated with Macleod Simulator. Coating materials used in this work were ${Ti_3}{O_5}$ and $SiO_2$, of which design thickness were 105 nm and 165 nm, respectively. AR coating films were deposited by Ion-Assisted Deposition system. The electrical and optical properties of 1.3 um laser diode were characterized by Bar tester and Chip tester. Threshold current and slop-efficiency of DFB-LD were 27.56 mA 0.302 W/A. Far field pattern and wavelength of DFB-LD were $22.3^{\circ}(Horizontal){\times}24.4^{\circ}$ (Vertical), 1313.8 nm, respectively.

• Asian-Australasian Journal of Animal Sciences
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• v.24 no.4
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• pp.457-462
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• 2011

The purpose of this study was to detect QTL for carcass quality on bovine chromosome (BTA) 6 using a high density SNP map in a Hanwoo population. The data set comprised 45 sires and their 427 Hanwoo steers that were born between spring of 2005 and fall of 2007. The steers that were used for progeny testing in the Hanwoo Improvement Center in Seosan, Korea, were genotyped with the 2,535SNPs on BTA6 that were embedded in the Illumina bovine SNP 50K chip. Four different linkage disequilibrium (LD) mapping models were applied to detect significant SNPs for carcass quality traits; the fixed model with a single marker, the random model with a single marker, the random model with haplotype effects using two adjacent markers, and the random model at hidden state. A total of twelve QTL were detected, for which four, one, three and four SNPs were detected on BTA6 under the respective models (p<0.001). Among the detected QTL, four, two, five and one QTL were associated with carcass weight, backfat thickness, longissimus dorsi muscle area, and marbling score, respectively (p<0.001). Our results suggest that the use of multiple LD mapping approaches may be beneficial in increasing power to detect QTL given a limited sample size and magnitude of QTL effect.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05c
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• pp.223-227
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• 2002

As the channel length of device shrinks below $0.13{\mu}m$, CMP(chemical mechanical polishing) process got into key process for global planarization in the chip manufacturing process. The removal rate and non-uniformity of the CMP characteristics occupy an important position to CMP process control. Especially, the post-CMP thickness variation depends on the device yield as well as the stability of subsequent process. In this paper, every wafer polished two times for the improvement of oxide CMP process characteristics. Then, we discussed the removal rate and non-uniformity characteristics of post-CMP process. As a result of CMP experiment, we have obtained within-wafer non-uniformity (WIWNU) below 4 [%], and wafer-to-wafer non-uniformity (WTWNU) within 3.5 [%]. It is very good result, because the reliable non-uniformity of CMP process is within 5 [%].