• Proceedings of the Korean Society of Machine Tool Engineers Conference
• /
• 2002.10a
• /
• pp.440-445
• /
• 2002

The characteristic equation for regenerative chatter loop including a delay element replaced by a rational function is presented by a linear differential-difference equation, accounting for the dynamics of the AMB controllers, the uncut chip thickness equation and the cutting process as well as the rigid spindle dynamics itself. The chatter stability analysis of a rigid milling spindle suspended by 5-axes active magnetic bearings(AMBs) is also performed to investigate the influences of the damping and stiffness coefficients of AMBs on the chatter free cutting conditions, as they are allowed to vary within the stable region formed by the AMB control gains. Several cutting tests varying the derivative gains of the AMB were performed to investigate the regenerative chatter vibrations, and it was concluded that the theoretical analysis results are in good consistency with the test results.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.18 no.5
• /
• pp.443-448
• /
• 2009

The roughness models have developed to describe the grinding behaviour and predict the final quality of workpiece. The model forms of the plunge grinding process are generally established with initial and steady state model form in accordance with the accumulated metal removal. The steady state roughness model form are based on the grinding condition and specific parameters are used to show the influence of it according to the grinding process such as the equivalent chip thickness and accumulated metal removal. However, the models have been developed in past are not considered the effect of changing the grinding conditions in the same batch. In this paper, the roughness model form to consider the effect of changing grinding condition is proposed and the performance of proposed model is evaluated based on the experimental results.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.21 no.1
• /
• pp.85-89
• /
• 2012

Conventional grinding of BK7 glass will normally result in brittle fracture at the surface, generating severe sub-surface damage and poor surface finish. The precision grinding of BK7 glass in parallel grinding modes has been investigated. Grinding process, maximum chip thickness, ductile/brittle regime, surface roughness and sub-surface damage have been addressed. Special attention has been given to the condition for generating a ductile mode response on the ground surface. Experiments reveal that the level of surface roughness and depth of sub-surface damage vary differently for different condition. This study gives an indication of the strategy to follow to achieve high quality ground surfaces on brittle materials.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.20 no.3
• /
• pp.225-231
• /
• 2011

In this paper, a new end-milling force modelling technique was suggested by considering runout, and its result was compared with real measured force. The specific cutting force is the multiplication of cutting force coefficient and uncut chip thickness. This parameter was used for experimental modelling and prediction of theoretical force. These coefficients, which can be obtained by fitting measured average forces in several conditions, were used for the formulation of theoretical force. The mechanism of end-milling force with runout was developed in this research and its result was verified by comparing the fluctuating theoretical force and its measured one. The fluctuation of force was incurred by a geometric shape of workpiece and its runout in holding. The result of suggested force considering runout shows a good consistency with measured one. So this modelling method can be used effectively for a prediction of end-milling force with runout effect.

• Journal of the Semiconductor & Display Technology
• /
• v.12 no.2
• /
• pp.51-56
• /
• 2013

Even if transmissions through normal channel between ubiquitous devices and terminal readers are encrypted, any extra sources of information retrieved from encrypting module can be exploited to figure out the key parameters, so called side channel attack. Since side channel attacks are based on statistical methods, making side channel signal weak or complex is the proper solution to prevent the attack. Among many countermeasures, shielding the electromagnetic signal and adding noise to the EM signal were examined by applying different thicknesses of thin films of ferroelectric (BTO) and conductors (copper and gold). As a test vehicle, chip antenna was utilized to see the change in radiation characteristics: return loss and gain. As a result, the ferroelectric BTO showed no recognizable effect on both shielding and adding noise. Cu thin film showed increasing shielding effect with thickness. Nanometer Au exhibited possibility in adding noise by widening of bandwidth and red shifting of resonating frequencies.

• The Transactions of the Korean Institute of Electrical Engineers C
• /
• v.53 no.4
• /
• pp.231-236
• /
• 2004

A normally open thermopneumaticc-actuated microvalve has been fabricated and their properties are investigated. The advantages of the proposed microvalve are of the low cost fabrication process and the transparent optical property using polydimethylsiloxane (PDMS) and indium tin oxide (ITO) glass. The fabricated microvalves with in-channel configuration are easily integrated with other microfluidic devices on the same substrate. The fabrication process of thermopneumatic-actuated microvalvesusing PDMS is very simple and its performance is very suitable for a disposable lab-on-a-chip. The PDMS membrane deflection increases and the flow rates of the microchannel with microvalvels decrease as the applied power to the ITO heater increases. The powers at flow-off are dependent on the membrane thickness and the applied inlet pressure but are independent of the channel width of microvalves. The flow rate is well controlled by the switching function of ITO heater and the closing/opening times are around 20 sec and 25 sec, respectively.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
• /
• v.23 no.1
• /
• pp.38-41
• /
• 2010

Compared to conventional molding technology, the color uniformity of light direction emitted from LED is improved with PCB type lead frame technology in which metal thin film is used and transfer molding technology which makes the density of phosphor uniform by manufacturing high density LED lamp. The light efficiency and the color uniformity of the LED are improved by molding the phosphor layer outside of chip and controlling the thickness of the phosphor layer. CIE x,y difference of LED in major axis is also improved uniformly from 0 to 90 degrees.

• Journal of the Semiconductor & Display Technology
• /
• v.17 no.1
• /
• pp.62-65
• /
• 2018

In the era of the 4th Industrial Revolution, IoT products of various and specialized fields are being developed and produced. Especially, the generation of the artificial intelligence, robotic technology Multilayer substrates and packaging technologies in the notebook, mobile device, display and semiconductor component industries are demanding the need for flexible materials along with miniaturization and thinning. To do this, this work use FCCL (Flexible Copper Clad Laminate), which is a flexible printed circuit board (PCB), to implement FPCB (Flexible PCB), COF (Chip on Film) Use is known to be essential. In this paper, I propose a transfer device which prevents the occurrence of scratches by analyzing the mechanism of wrinkle and scratch mechanism during the transfer process of thin film material in which the thickness increases while continuously moving in air or solution.

• Journal of the Korean Society for Precision Engineering
• /
• v.13 no.10
• /
• pp.62-70
• /
• 1996

We experimented on cutting characteristics-cutting force, behavior of cutting temperature, surface roughness. chip thickness under low temperature, which generated by liquid nitrogen(77K). The work-pieces were freezed to-195 .deg. C and liquid nitrogen was also sprinkled on cutting area in order to decrease an experimental error of machining in low temperature. The workpiece was became to -195 .deg. C in5 minutes. In cooled condition surface roughness of workpiece was better than normal condition. In addition, we investigated the possibility that surface roughness of workpiece and cutting force can be predicted analyzing cutting conditions by the trained neural network.

• Journal of the Microelectronics and Packaging Society
• /
• v.21 no.3
• /
• pp.43-50
• /
• 2014

By the trends of electronic package to be smaller, thinner and more integrative, the reliability of interconnection between Si chip and printed circuit board is required. This paper reports on a study of high speed shear energy of Sn-4.0wt%Ag-0.5wt%Cu (SAC405) solder joints with different the thicknesses of electroless Ni-P deposit. A high speed shear testing of solder joints was conducted to find a relationship between the thickness of Ni-P deposit and the brittle fracture in electroless Ni-P deposit/SAC405 solder. A focused ion beam (FIB) was used to polish the cross sections to reveal details of the microstructure of the fractured pad surface with and without $HNO_3$ vapor treatment. The high speed shear energy of SAC405 solder joint with $1{\mu}m$ Ni-P deposit was found to be lower without $HNO_3$ vapor, compared to those of over $3{\mu}m$ Ni-P deposit. This could be due to the edge of solder resist in $1{\mu}m$ Ni-P deposit, which provides a fracture location for the weakened shear energy of solder joints and brittle fracture in high speed shear test. With $HNO_3$ vapor, the brittle fracture mode in high speed shear test decreased with increasing the thickness of Ni-P deposit. Then the roughness (Ra) of Ni-P deposits decreased with increasing its thickness. Thus, this gives the evidence that the decrease in roughness of Ni-P deposit for Eelectroless Ni/ Electroless Pd/ Immersion Au (ENEPIG) surface play a critical role for improving the robustness of SAC405 solder joint.