• Title/Summary/Keyword: Chip on glass

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Micro-PIV Analysis of Electro-osmotic Flow inside Microchannels (마이크로 채널 내부 전기삼투 유동에 대한 PIV유동 해석)

  • Kim Yang-Min;Lee Sang-Joon
    • Journal of the Korean Society of Visualization
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    • v.1 no.2
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    • pp.47-51
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    • 2003
  • Microfluidic chips such as lab-on-a-chip (LOC) include micro-channels for sample delivery, mixing, reaction, and separation. Pressure driven flow or electro-osmotic flow (EOF) has been usually employed to deliver bio-samples. Having some advantages of easy control, the flow characteristics of EOF in microchannels should be fully understood to effectively control the electro-osmotic pump for bio-sam-pie delivery. In this study, a micro PIV system with an epifluorescence inverted microscope and a cooled CCD was used to measure velocity fields of EOF in a glass microchannel and a PDMS microchannel. The EOF velocity fields were changed with respect to electric charge of seeding particles and microchannel materials used. The EOF has nearly uniform velocity distribution inside the microchannel when pressure gradient effect is negligible. The mean streamwise velocity is nearly proportional to the applied electric field. Glass microchannels give better repeatability in PIV results, compared with PDMS microchannels which are easy to fabricate and more suitable for PIV experiments.

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Development of Red CaAlSiN3:Eu2+ Phosphor in Glass Ceramic Composite for Automobile LED with High Temperature Stability (고온 안정성이 우수한 자동차 LED용 Red CaAlSiN3:Eu2+ 형광체/Glass 세라믹 복합체 개발)

  • Yoon, Chang-Bun
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.31 no.5
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    • pp.324-329
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    • 2018
  • Red phosphor in glasses (PiGs) for automotive light-emitting diode (LED) applications were fabricated with 620-nm $CaAlSiN_3:Eu^{2+}$ phosphor and Pb-free silicate glass. PiGs were synthesized and mounted on high-power blue LED to make a monochromatic red LED. PiGs were simple mixtures of red phosphor and transparent glass powder. After being fabricated with uniaxial press and CIP at 300 MPa for 20 min, the green bodies were thermally treated at $550^{\circ}C$ for 30 min to produce high dense PiGs. As the phosphor content increased, the density of the sintered body decreased and PiGs containing 30% phosphor had a full sintered density. Changes in photoluminescence spectra and color coordination were studied by varying the thickness of plates that were mounted after optical polishing. As a result of the optical spectrum and color coordinates, PiG plate with $210{\mu}m$ thickness showed a color purity of 99.7%. In order to evaluate the thermal stability, the thermal quenching characteristics were measured at temperatures of $30{\sim}150^{\circ}C$. The results showed that the red PIG plates were 30% more thermally stable compared to the AlGaInP red chip.

Microfluidic Immuno-Sensor Chip using Electrical Detection System (전기 검출 시스템을 이용한 Microfluidic Immuno-Sensor Chip)

  • Maeng, Joon-Ho;Lee, Byung-Chul;Cho, Chul-Ho;Ko, Yong-Jun;Ahn, Yoo-Min;Cho, Nahm-Gyoo;Lee, Seoung-Hwan;Hwang, Seung-Yong
    • KSBB Journal
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    • v.21 no.5
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    • pp.325-330
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    • 2006
  • This study presents the characterization of an integrated portable microfluidic electrical detection system for fast and low volume immunoassay using polystyrene microbead, which are used as immobilization surfaces. In our chip, a filtration method using the microbead was adopted for sample immobilization and immunogold silver staining(IGSS) was used to increase the electrical signal. The chip is composed of an inexpensive and biocompatible Polydimethylsiloxane(PDMS) layer and Pyrex glass substrate. Platinum microelectrodes for electric signal detection were fabricated on the substrate and microchannel and pillar-type microfilters were formed in the PDMS layer. With a fabricated chip, we reacted antigen and antibody according to the procedures. Then, silver enhancer was injected to increase the size of nanogold particles tagged with the second antibody. As a result, microbeads were connected to each other and formed an electrical bridge between microelectrodes. Resistance measured through the electrodes showed a difference of two orders of magnitude between specific and nonspecific immuno-reactions. The detection limit was 10 ng/ml. The developed immunoassay chip reduced the total analysis time from 3 hours to 50 min. Fast and low-volume biochemical analysis has been successfully achieved with the developed microfilter and immuno-sensor chip, which is integrated to the microfluidic system.

Study on Microbiochip for Buccal Cell Lysis and DNA Purification (상피세포 시료 전처리용 마이크로바이오칩에 관한 연구)

  • Ha, Seung-Mo;Cho, Woong;Ahn, Yoo-Min;Hwang, Seung-Yong
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.34 no.12
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    • pp.1785-1791
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    • 2010
  • This paper describes a separable microfluidic device fabricated with PDMS (polydimethylsiloxane) and glass. The device is used for sample preparation involving cell lysis and the DNA purification process. The cell lysis was performed for 2 min at $80^{\circ}C$ in a serpentine-type microreactor ($20 {\mu}l$) using a Au microheater that was integrated with a thermal microsensor on a glass substrate. The DNA that was mixed with other residual products during the cell lysis process was then filtered through a new filtration system composed of microbeads (diameter: $50 {\mu}m$) and PDMS pillars. Since the entire process (sample loading, cell lysis reaction, DNA purification, and sample extraction) was performed within 5 min in a microchip, we could reduce the sample preparation time in comparison with that for the conventional methods used in biochemistry laboratories. Finally, we verified the performance of the sample preparation chip by conducting PCR (polymerase chain reaction) analysis of the chip product.

Reliability Improvement of Cu/Low K Flip-chip Packaging Using Underfill Materials (언더필 재료를 사용하는 Cu/Low-K 플립 칩 패키지 공정에서 신뢰성 향상 연구)

  • Hong, Seok-Yoon;Jin, Se-Min;Yi, Jae-Won;Cho, Seong-Hwan;Doh, Jae-Cheon;Lee, Hai-Young
    • Journal of the Microelectronics and Packaging Society
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    • v.18 no.4
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    • pp.19-25
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    • 2011
  • The size reduction of the semiconductor chip and the improvement of the electrical performance have been enabled through the introduction of the Cu/Low-K process in modern electronic industries. However, Cu/Low-K has a disadvantage of the physical properties that is weaker than materials used for existing semiconductor manufacture process. It causes many problems in chip manufacturing and package processes. Especially, the delamination between the Cu layer and the low-K dielectric layer is a main defect after the temperature cycles. Since the Cu/Low-K layer is located on the top of the pad of the flip chip, the stress on the flip chip affects the Cu/Low-K layer directly. Therefore, it is needed to improve the underfill process or materials. Especially, it becomes very important to select the underfill to decrease the stress at the flip-chip and to protect the solder bump. We have solved the delamination problem in a 90 nm Cu/Low-K flip-chip package after the temperature cycle by selecting an appropriate underfill.

Improvement of COF Bending-induced Lead Broken Failure in LCD Module (LCD Module내 COF Bending에 따른 Lead Broken Failure의 개선)

  • Shim, Boum-Joo;Choi, Yeol;Yi, Jun-Sin
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.21 no.3
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    • pp.265-271
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    • 2008
  • TCP(Tape Carrier Package), COG (Chip On Glass), COF(Chip On Film) are three methods for connecting LDI(LCD Driver IC) with LCD panels. Especially COF is growing its portion of market place because of low cost and fine pitch correspondence. But COF has a problem of the lead broken failure in LCD module process and the usage of customer. During PCB (Printed Circuit Board) bonding process, the mismatch of the coefficient of thermal expansion between PCB and D-IC makes stress-concentration in COF lead, and also D-IC bending process during module assembly process makes the level of stress in COF lead higher. As an affecting factors of lead-broken failure, the effects of SR(Solder Resister) coating on the COF lead, surface roughness and grain size of COF lead, PI(Polyimide) film thickness, lead width and the ACF(Anisotropic Conductive Film) overlap were studied, The optimization of these affecting manufacturing processes and materials were suggested and verified to prevent the lead-broken failure.

Optical Properties as Process Condition of Color Conversion Lens Using Low-softening Point Glass for White LED (백색 LED용 저 연화점 유리를 이용한 색 변환 렌즈의 제조 조건에 따른 광 특성)

  • Chae, Yoo-Jin;Lee, Mi-Jai;Hwang, Jong-Hee;Lim, Tae-Young;Kim, Jin-Ho;Jeong, Hee-Suk;Lee, Young-Sik;Kim, Deug-Joong
    • Journal of the Korean Ceramic Society
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    • v.50 no.6
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    • pp.454-459
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    • 2013
  • Recently, remote phosphors have been reported for application to white LEDs to provide enhanced phosphor efficiency compared with conventional phosphor-based white LEDs. In this study, a remote phosphor was produced by coating via screen printing on a glass substrate with different numbers of phosphor coating. The paste consists of phosphor, lowest softening glass frits, and organic binders. The remote phosphor could be well controlled by varying the phosphor content rated paste. After mounting the remote phosphor on top of a blue LED chip, CCT, CRI, and luminance efficiency were measured and values of 5300 K, 62, and 117 lm/W were respectively obtained in the 80 wt% phosphor with 3 coating layers sintered at $800^{\circ}C$.

Optical Properties of Color Conversion Lens for White LED Using B2O3-Bi2O3-ZnO Glass (B2O3-Bi2O3-ZnO계 유리를 이용한 백색 LED용 색변환 렌즈의 광 특성)

  • Chae, Yoo-Jin;Lee, Mi-Jai;Kim, Jin-Ho;Hwang, Jong-Hee;Lim, Tae-Young;Jeong, Hee-Suk;Lee, Young-Sik;Kim, Deuk-Jung
    • Journal of the Korean Institute of Electrical and Electronic Material Engineers
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    • v.26 no.8
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    • pp.614-619
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    • 2013
  • Recently, remote phosphor is reported for white LED enhancing of phosphor efficiency compared with conventional phosphor-based W-LED. In this study, Remote phosphor was produced by screen printing coating on glass substrate with phosphor contents rated paste and heat treatment. The paste consists of phosphor, lowest softening glass frit and organic binders. Remote phosphor can be well controlled by varying the phosphor content rated paste. After mounting remote phosphor on top of blue LED chip, CCT, CRI, and luminance efficiency were measured. The measurement results showed that CCT, CRI, and luminance efficiency were 6,645, 68, and 1,16l m/W in phosphor 80 wt.% remote phosphor sintered at $600^{\circ}C$.

Interconnection Technology Based on InSn Solder for Flexible Display Applications

  • Choi, Kwang-Seong;Lee, Haksun;Bae, Hyun-Cheol;Eom, Yong-Sung;Lee, Jin Ho
    • ETRI Journal
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    • v.37 no.2
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    • pp.387-394
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    • 2015
  • A novel interconnection technology based on a 52InSn solder was developed for flexible display applications. The display industry is currently trying to develop a flexible display, and one of the crucial technologies for the implementation of a flexible display is to reduce the bonding process temperature to less than $150^{\circ}C$. InSn solder interconnection technology is proposed herein to reduce the electrical contact resistance and concurrently achieve a process temperature of less than $150^{\circ}C$. A solder bump maker (SBM) and fluxing underfill were developed for these purposes. SBM is a novel bumping material, and it is a mixture of a resin system and InSn solder powder. A maskless screen printing process was also developed using an SBM to reduce the cost of the bumping process. Fluxing underfill plays the role of a flux and an underfill concurrently to simplify the bonding process compared to a conventional flip-chip bonding using a capillary underfill material. Using an SBM and fluxing underfill, a $20{\mu}m$ pitch InSn solder SoP array on a glass substrate was successfully formed using a maskless screen printing process, and two glass substrates were bonded at $130^{\circ}C$.